UGPCB Standard 2-Layer Rigid PCB: Reliable 1.6mm FR-4 Circuit Boards for Demanding Applications
At the heart of modern electronics, の プリント基板 (プリント基板) acts as the foundational platform, interconnecting components and routing signals with precision. UGPCB Standard 2-Layer Rigid PCB, built with a robust 1.60mmの厚さ そして高性能 FR-4 TG150 material, represents the optimal balance of durability, 電気性能, and cost-effectiveness for a wide range of applications. これ 両面PCB is a proven solution for prototypes and medium-complexity electronic devices.

Product Definition & 分類
技術分類:
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レイヤーカウントごとに: 両面PCB / Two Layer PCB
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By Substrate Rigidity: リジッドPCB
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ベース素材によって: Glass Epoxy (FR-4) プリント基板
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By Flammability Rating: UL94 V-0 (inherent to FR-4)
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By Assembly Compatibility: スルーホールテクノロジー (tht) and Surface-Mount Technology (SMT) capable PCB.
This product is a double sided circuit board constructed with copper clad laminate on both sides of an insulating FR-4 core. Electrical connection between layers is achieved via plated through-holes (PTH). The 1.60mm (約 1/16 インチ) ボードの厚さ is an industry-standard, offering excellent mechanical stability.
工事 & 材料仕様
レイヤースタックアップ:
これ 2 層リジッドPCB structure is as follows (top to bottom):
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Top Solder Mask (白): Insulating layer to prevent solder bridges.
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Top Copper Layer (1 オンス, ~35µm): Etched to form conductive traces and pads.
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Insulating Core Substrate (FR-4, Tg150): Provides mechanical support and electrical insulation.
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Bottom Copper Layer (1 オンス, ~35µm): Etched to form bottom-layer circuitry.
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Bottom Solder Mask (白): Insulating protective layer.
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Silkscreen Legend (黒): Component designators, logos, and markings.
Key Materials:
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Base Laminate: FR-4 TG150. This denotes a flame-retardant glass-reinforced epoxy laminate with a Glass Transition Temperature (TG) of 150°C. It offers superior mechanical strength, 電気断熱, and thermal reliability for a rigid printed circuit board, making it the industry’s most cost-effective choice.
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銅箔: Standard 1-ounce (オンス) Electro-Deposited copper for optimal conductivity and current carrying capacity.
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表面仕上げ: Lead-Free Hot Air Solder Leveling (出血). A cost-effective and reliable PCB surface finish that provides excellent solderability, good shelf life, and robust protection against oxidation.
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Inks: High-quality photo-imageable white solder mask ink and durable black epoxy silkscreen ink.
(Image Suggestion: Cross-sectional diagram of the PCB stack-up)
Alt Tag: Detailed cross-sectional diagram of a 2 layer rigid PCB showing copper, FR-4 core, and solder mask layers.
設計ガイドライン & 動作原理
設計上の重要な考慮事項:
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Via Design: Maximize the routing space of your double sided プリント基板設計 by strategically placing Plated Through-Holes (pths) for inter-layer connections.
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トレース幅/間隔: For 1oz copper, a standard minimum trace/space is 6mil/6mil (~0.15mm) to ensure reliable manufacturability and current capacity.
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パッド & Hole Annular Ring: Ensure adequate pad size relative to the drill hole to guarantee a strong connection for PCBアセンブリ と信頼性.
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はんだマスク & シルクスクリーン: White solder mask aids visual inspection during SMTアセンブリ, while clear black silkscreen is crucial for PCBプロトタイピング and repair.
動作原理:
A PCB does not generate function but enables it through its predefined conductive pathways. The etched copper traces replace discrete wiring, providing electrical connections between components. The insulating FR-4 substrate prevents short circuits. メッキスルーホール (pths) serve as vertical conduits, connecting the top and bottom PCB copper layers, thereby doubling the available routing area compared to a single-sided board and increasing design flexibility.
性能特性 & 利点
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高い信頼性: The FR-4 TG150 substrate ensures stable performance in environments below its Tg, offering excellent thermal and mechanical stability for a rigid circuit board.
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Excellent Electrical Properties: Low dielectric constant and dissipation factor support the signal integrity requirements of most digital and analog circuits.
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High Manufacturability: The 1.6mm standard PCB 厚さ そして 鉛フリーHASL process are mature, ensuring high yield, cost control, and fast lead times.
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Superior Solderability: The HASL finish offers a flat, wettable surface ideal for both through-hole soldering そして SMT soldering processes.
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Clear Identification: High-contrast white solder mask with black legend facilitates efficient プリント基板 検査, テスト, and rework.
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Environmental Compliance: Lead-Free HASL finish complies with RoHS and other environmental directives.
Standard Manufacturing Process Flow
UGPCB adheres to IPC standards throughout our PCB fabrication process:
Panelization → Drilling → Electroless Copper Deposition → Dry Film Lamination & Imaging → Copper Plating → Etching → Solder Mask Application & Curing → Silkscreen Printing → Surface Finish (鉛フリーHASL) → Profiling/Routing → Electrical Testing (飛行プローブ) → Final Automated Optical Inspection (あおい) → Packaging & Shipment.
主要なアプリケーション & ユースケース
This versatile two layer rigid PCB is widely used in industries that demand a balance of reliability and value:
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産業用制御: PLC interfaces, センサーモジュール, motor drives, HMI controller boards.
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家電: Smart appliance controllers, audio amplifiers, 電源, educational kits.
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通信: Router/switch peripheral boards, RF antenna modules, network monitoring units.
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カーエレクトロニクス: インフォテインメントシステム, lighting control modules, body control modules (non-safety critical).
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Power Electronics: Smart meter PCBs, UPS control boards, solar inverter circuitry.
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テスト & 測定: Data acquisition cards, instrument control panels, handheld tester boards.
Why Choose UGPCB for Your 2-Layer PCB Needs?
Choosing UGPCB means partnering with a reliable PCBメーカー committed to quality. 私たちは以下を専門としています PCBプロトタイプ and medium-volume production, implementing rigorous Electrical Testing and IPC-A-600 based inspection on every board. From simple 2 レイヤーボード to complex multi-layer designs, 専門家を提供します PCB design for manufacturing (DFM) support and a streamlined supply chain.
Contact us today for a competitive quote and swift lead time on your 1.6mm FR-4 2-Layer PCB project!
(Image Suggestion: Gallery of finished PCBs with different designs)
Alt Tag: Gallery of various 2 layer rigid PCB examples manufactured by UGPCB with white solder mask.