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22-レイヤサーバーグレードの PCB メーカー | 制御された深さの穴あけによる重量銅 PCB | UGPCB エキスパート ソリューション

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Power the Future of Computing: UGPCB’s High-Performance Server PCB Solutions

In today’s rapidly evolving landscape of data centers, 人工知能, and cloud computing, server performance and stability are pivotal to digital efficiency. As the fundamental hardware bedrock, the quality of Server プリント基板 (プリント基板) is paramount. Leveraging deep technical expertise, UGPCB provides professional, customized, high-performance server PCB manufacturing and プリント基板 (印刷回路基板アセンブリ) one-stop solutions.

1. 製品の概要 & 意味

A Server PCB is a complex, multi-layer circuit board specifically engineered for server-class products. Its critical mission is to host core components like CPUs, メモリ, high-speed buses, and power modules while ensuring stable signal transmission at speeds of tens of Gbps and beyond. It is not merely a physical connection platform but the core element guaranteeing the system’s signal integrity, パワーの完全性, and thermal performance.

The specifications you provide (板厚: 2.8mm ±10%, 22 レイヤー, 2/1 oz Copper Weight, 0.1/0.1 mm Trace/Space) define a typical high-layer-count, 高密度, high-speed server PCB. It is suitable for critical applications in mid-to-high-end dual-processor or AI server motherboards, accelerator cards, and backplanes.

High-layer-count server PCB manufactured by UGPCB, installed inside a high-performance data center server

2. Design Essentials & Key Technologies

The success of such advanced PCBデザイン hinges on mastering a range of cutting-edge technologies:

  1. Stack-up & インピーダンス制御: The complex 22-layer stack-up requires precise calculation to achieve strict インピーダンス制御 (typically 50Ω single-ended, 100Ω differential), forming the cornerstone of 高速PCB設計.

  2. バックドリリング: This critical process removes the unused copper stub from high-speed signal vias (例えば。, for PCIe, DDR buses), significantly reducing signal reflection and attenuation, and is central to enhancing signal integrity.

  3. High-Speed Laminate Application: We utilize premium high-speed materials like IT-968G & IT-180A from ITEQ. Their low dissipation factor (Df) and stable dielectric constant (DK) ensure signal purity and low latency. A high Glass Transition Temperature (TG >170℃) guarantees material reliability under the prolonged high-temperature operation of servers.

  4. RTF (Reverse Treated Foil) 銅: Its smoother surface profile effectively reduces “skin effect” losses for high-frequency signals on the conductor surface, further enhancing high-speed performance.

  5. Any-Layer HDI & Hybrid Construction: Supports high-density routing. Combined with hybrid construction techniques, it allows the use of different performance materials in localized areas (例えば。, high-current power zones vs. high-speed signal zones) to meet specific circuit requirements.

3. パフォーマンス & 構造的特徴

4. 製造工程 & 品質管理

UGPCB’s server プリント基板の製造 follows a stringent, automotive electronics-grade quality control protocol: Material Inspection → Inner Layer Imaging → Precision Lamination → Laser/Mechanical Drilling → Back Drilling → Copper Deposition & Plating → Outer Layer Imaging → Solder Mask → Surface Finish (同意する) → Electrical Test (Flying Probe/Dedicated Fixture) → Final Inspection. Each stage is supported by high-speed signal testing, あおい (自動光学検査), もっと, ensuring every delivered PCB meets design specifications.

5. アプリケーションシナリオ & Technical Classification

This high-performance server PCB is widely used in:

Scientific Classification:

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