UGPCBのロゴ
In the era of data-intensive and ultra-high-speed signal transmission, a Printed Circuit Board (プリント基板) is far more than a simple component carrier; it is the critical architecture defining system performance limits. For demanding applications like high-speed networking, artificial intelligence computing, and advanced test instrumentation, standard FR-4 materials fall short. UGPCB addresses this need with our advanced 22-layer multilayer PCB built on Panasonic Megtron-6 R-5775G laminate, engineered to meet challenges of high frequency, 低損失, and complex interconnectivity.
1.UGPCB’s 22-Layer Megtron-6 High-Speed PCB 製品の概要 & 意味
This product is a 22-layer High-Density Interconnect (HDI) rigid printed circuit board. Its core advantage lies in the use of a premium-grade, 高速, low-loss laminate—Panasonic’s Megtron-6 R-5775G. Combined with a robust 2.0mm board thickness and precision lamination technology, it creates a high-end interconnection platform capable of handling high-frequency signals above 10GHz with exceptional signal integrity and power integrity.
2. 設計上の重要な考慮事項
Designing such an advanced 多層回路基板 requires focus on:
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インピーダンス制御: Precise calculation and control of single-ended and differential impedance to ensure consistent signal propagation within the Megtron-6 dielectric.
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スタックアップ最適化: The intelligent arrangement of the 22 conductive layers (22レイヤー)—including signal, 力, and ground planes—is crucial for maximizing shielding and minimizing crosstalk in this high-layer count PCB.
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熱管理: The 2.0mm board thickness and multilayer structure aid heat distribution. しかし, strategic use of thermal vias remains essential for high-power IC areas.
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High-Frequency Routing: Employing microstrip or stripline configurations, avoiding acute angle turns, and leveraging the low-profile copper foil of Megtron-6 to reduce losses from skin effect.
3. それがどのように機能するか & 構造
あ PCB’s primary function is to provide electrical connectivity and signal transmission between components via etched copper traces on an insulating substrate. これ 22-層PCBボード structure resembles a precise “multi-layer sandwich”:
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内層: Use H/HOZ (約 1/1 oz or 35µm) copper for core power, 地上飛行機, and some internal signal routing.
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Outer Layers: Use 1/1 oz copper for mounting primary components and routing critical signal traces.
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Dielectric Layers: All insulating prepreg materials are Panasonic Megtron-6 R-5775G, whose low Dielectric Constant (DK) および散逸係数 (Df) ensure superior high-speed signal transmission.
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表面仕上げ: エレクトロレスニッケルイマージョンゴールド (同意する) で 2 micro-inches (2u”). This provides a flat, はんだ付け可能な表面, 優れた耐酸化性, and good wire-bonding capability, ideal for high-density BGA packages and RF connectors.
4. コア素材: Panasonic Megtron-6 R-5775G
This is the heart of this advanced PCB material. Megtron-6 is Panasonic’s next-generation, 高速, low-loss circuit board material series.
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主なパフォーマンス: Features an extremely low Dielectric Constant (Dk~3.5) and ultra-low Dissipation Factor (Df~0.0015 @ 10GHz), significantly outperforming standard FR-4. Its high Glass Transition Temperature (TG) ensures superior thermal stability and dimensional consistency during high-temperature reflow soldering processes.
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Application Fit: Optimized for high-speed digital signals (10Gbps+ to 56/112Gbps) and millimeter-wave RF applications.
| アイテム | テスト方法 | 状態 | ユニット | メガトロン6 R-5775(N) 低DKガラス布 |
メガトロン6 R-5775 通常のガラス布 |
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| ガラス遷移温度。(TG) | DSC | あ | ℃ | 185 | 185 | |
| 熱分解温度。(TD) | TGA | あ | ℃ | 410 | 410 | |
| CTE X軸 | A1 | IPC-TM-650 2.4.24 | あ | ppm/°C | 14-16 | 14-16 |
| CTE Y軸 | 14-16 | 14-16 | ||||
| CTE Z軸 | A1 | IPC-TM-650 2.4.24 | あ | 45 | 45 | |
| A2 | 260 | 260 | ||||
| T288(銅で) | IPC-TM-650 2.4.24.1 | あ | 分 | >120 | >120 | |
| 誘電率(DK) | 12GHz | バランスタイプ 円形ディスク共振器 |
C-24/23/50 | － | 3.4 | 3.6 |
| 散逸係数(Df) | 0.004 | 0.004 | ||||
| 吸収 | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.14 | 0.14 | |
| 曲げ弾性率 | 埋める | JIS c 6481 | あ | GPA | 18 | 19 |
| 皮の強度* | 1オンス(35μm) | IPC-TM-650 2.4.8 | あ | kn/m | 0.8 | 0.8 |
5. 主な特長 & パフォーマンス
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Ultra-Low Signal Loss: Megtron-6 material ensures maximum efficiency in high-frequency signal transmission with minimal attenuation.
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Excellent Thermal & 寸法安定性: High Tg value combined with a 2.0mm thick board suits high-temperature, high-power application environments.
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High-Density Interconnect Capability: The 22-layer design provides abundant routing channels, supporting complex interconnections for large-scale chips (例えば。, FPGA, GPU).
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Precise Impedance & Layer-to-Layer Registration: Mature manufacturing processes guarantee consistent electrical performance across the 多層PCB.
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Superior Solderability & ボンディング: The 2u” ENIG finish ensures highly reliable solder joints and is suitable for precision SMT assembly.
6. Scientific Classification & 主要なアプリケーション
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Scientific Classification:
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レイヤーカウントごとに: High Multilayer PCB (通常 >10 レイヤー).
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素材によって: 高速PCB / 高周波PCB / 低損失PCB.
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テクノロジーによって: HDI PCB (Subject to specific design features like blind/buried vias).
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By Rigidity: リジッドPCB.
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主要なアプリケーション & ユースケース:
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High-Speed Networking Equipment: Core backplanes and motherboards for 400G/800G optical modules, ハイエンドルーター, とスイッチ.
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高度なコンピューティング & ストレージ: AI server boards, 高性能コンピューティング (HPC) clusters, enterprise SSD controller boards.
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航空宇宙 & レーダーシステム: RF front-ends and signal processing units for avionics communication and phased array radar systems.
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上級テスト & 測定器: Mainboards within high-speed oscilloscopes, スペクトラムアナライザ, および信号発生器.
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7. Production Flow Overview
UGPCB adheres to a stringent PCB manufacturing process to ensure quality:
Material Cutting → Inner Layer Imaging → Lamination (22-レイヤーの配置 & ボンディング) → Drilling → Hole Metallization → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing / Scoring → Electrical Testing → Final Inspection (AOL)
Every step is supported by high-precision equipment, with multiple quality control checkpoints integrated into the PCB fabrication process, ensuring this 22-layer Megtron-6 PCB meets the highest standards from design to delivery.
Don’t let base materials limit your innovative designs.
Whether you’re developing next-gen communication hardware or tackling frontier computing challenges, UGPCB 22-layer high-performance PCB solution is your reliable hardware foundation. We provide not just a product, but full-spectrum support from PCB design consultation to rapid prototyping and volume production.
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