UGPCB

UGPCB Rogers RO4350B + FR4 High-Frequency Hybrid Laminate: A 4-Layer High-Performance Communication PCB Solution

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UGPCB specializes in manufacturing Rogers RO4350B + FR4 high-frequency printed circuit boards. These are the ideal solution for communication systems, RF circuits, and high-speed digital designs. By combining high-frequency ceramic-based materials with traditional FR4, we achieve excellent signal integrity without compromising cost control.

This specific 4-layer hybrid board features a precise finished thickness of 1.0mm. It utilizes a symmetrical stackup of 2 layers of Rogers RO4350B and 2 layers of FR4. The surface finish is Immersion Gold (同意する). This combination provides a superior performance substrate for 5G base stations, パワーアンプ, and wireless communication equipment.

UGPCB 4-layer Rogers RO4350B FR4 hybrid PCB

What is a Rogers RO4350B + FR4 Hybrid PCB? [製品の概要 & 意味]

A Rogers RO4350B + FR4 hybrid PCB is a multilayer board made by pressing two different substrate materials together. It is not a standard FR4 board, nor is it an expensive all-high-frequency board. その代わり, it is a “mixed dielectric” product that leverages the strengths of both materials.

  • コア素材: It utilizes Rogers Corporation’s RO4350B hydrocarbon/ceramic laminate. This material is known for its stable Dielectric Constant (DK) and very low RF loss, 高周波回路に最適です.

  • Support Material: It is combined with traditional FR4 epoxy glass cloth laminate. FR4 is the most common material in the プリント基板 業界. It offers excellent mechanical support, mature processing techniques, 低コスト.

  • 製品の定義: Using UGPCB’s product as an example, the model clearly indicates its hybrid nature. The standard structure is 2 layers of Rogers RO4350B and 2 layers of FR4. This creates a total of 4 レイヤー, with the finished board thickness strictly controlled at 1.0mm.

The core design philosophy is using the right material for the right job. High-frequency signals travel through the RO4350B layers. 力, control signals, and mechanical support are handled by the FR4 layers.

主要なパラメータ & Design Specifications

To ensure high performance in high-frequency applications, UGPCB strictly follows these design specifications:

パラメーター 仕様 Design Notes
モデル ロジャース RO4350B + FR4 Hybrid Mixed dielectric structure for cost and performance.
誘電率 (DK) 3.48 Stable at 10GHz, ensuring signal speed and wavelength stability.
層構造 2L RO4350B + 2L FR4 Symmetrical stackup reduces warping risk from CTE mismatch.
Total Layers 4 レイヤー Supports complex RF front-ends and simple control circuits.
仕上がり厚さ 1.0mm Thinner than standard 1.6mm boards; ideal for compact and lightweight devices.
誘電体の厚さ 0.254mm Refers to the single-layer thickness of the RO4350B core for precise impedance control.
完成銅重量 1/0.5/0.5/1 (オズ) Outer 1OZ for heat dissipation; inner 0.5OZ for fine-line etching.
ベース銅箔 ½ (18μm) HH/HH Ensures etching precision for inner layer circuits.
表面仕上げ イマージョンゴールド (同意する) Provides excellent flatness, solderability, and oxidation resistance.
応用 通信PCB Suitable for wireless base stations and microwave transmission.

材料特性 & Performance Advantages

  1. Stable Dielectric Performance (DK=3.48)
    RO4350B maintains a consistent DK of around 3.48 across a wide frequency range from MHz to GHz. This stability allows designers to rely on a constant value for impedance calculations. It guarantees signal phase integrity during high-speed transmission, which is critical for 5G and radar systems.

  2. Low Dissipation Factor (Df)
    RO4350B features a very low dissipation factor, typically around 0.0037 10ghzで. 対照的に, standard FR4 loss increases sharply above 1GHz. UGPCB’s hybrid board ensures minimal energy loss and low heat generation as RF signals pass through the RO4350B layer.

  3. Ideal Thermal Performance

    • 熱伝導率: RO4350B has a thermal conductivity of 0.69 w/m・k. This is nearly double that of standard FR4 at 0.3 w/m・k. Heat from components like power amplifiers dissipates much faster.

    • 熱安定性: With a high glass transition temperature above 280°C and low Z-axis CTE, it ensures plated through-hole reliability during temperature changes.

  4. 機械 & Process Compatibility
    RO4350B is one of the few ceramic-filled materials compatible with standard FR4 epoxy processes. This eliminates the need for complex plasma treatments required for pure PTFE materials. It simplifies manufacturing and ensures reliable lead times.

それがどのように機能するか & 構造解析

それがどのように機能するか

High-frequency signal transmission on a PCB is essentially electromagnetic wave propagation in microstrips or striplines. In this 4-layer board, the top (L1) and bottom (L4) layers handle RF signal routing and component assembly. The internal RO4350B dielectric layer with DK of 3.48 provides a stable and low-loss electromagnetic field environment.

構造解析

The board uses a sandwich symmetrical structure:

  • L1 Layer: 1OZ copper with ENIG finish. Used for mounting RF chips.

  • L2 Layer: 0.5OZ copper. Typically a ground reference for high-frequency signals, supported by FR4.

  • コアレイヤー: 0.254mm RO4350B core. This is the primary medium for high-frequency signal transmission.

  • L3 Layer: 0.5OZ copper. Can be a power plane or a secondary ground reference.

  • L4 Layer: 1OZ copper with ENIG finish. Used for mounting control circuits or interfaces.

製品分類

UGPCB’s product falls into these categories:

  1. 素材によって: Rigid High-Frequency ハイブリッドPCB with ceramic-filled hydrocarbon and epoxy.

  2. レイヤーカウントごとに: 4-Layer Multilayer Board.

  3. プロセス別: Hybrid Lamination PCB.

  4. アプリケーションによって: Communication or RF Microwave PCB.

  5. 表面仕上げによる: ENIG or Electroless Nickel Immersion Gold Board.

Key Production Control Points

UGPCB controls these critical steps to ensure high quality:

  1. 材料の準備: Baking RO4350B and FR4 to remove moisture. RO4350B has very low absorption below 0.06 percent, but drying prevents delamination.

  2. 内層イメージング: Using ½ or 18μm HH/HH thin copper foil for precise fine-line etching.

  3. Lamination as the Core of Hybrid:

    • Using specialized bondply like Rogers 2929 or high-flow prepregs.

    • Employing a stepwise pressing schedule to manage different curing temperatures.

    • Forced cooling for over 2 hours after pressing to release stress.

  4. 掘削 & デスミア: Adjusting drill parameters due to ceramic powder. Using plasma desmear to clean resin residue from hole walls, ensuring reliable metallization.

  5. 表面仕上げ: Applying Immersion Gold for excellent protection and solderability.

典型的なアプリケーション

With its 4-layer and 1.0mm thin design combined with Rogers high-frequency performance, this PCB is ideal for:

  • 5G Communication Base Stations: RF Front-End modules and power amplifiers in AAUs.

  • Wireless Backhaul Systems: Point-to-point microwave communications requiring stable DK.

  • 自動車レーダー: 77GHz millimeter-wave radar circuits.

  • Satellite Navigation: High-frequency amplification and filtering in GPS or Beidou receivers.

  • テスト & 測定器: Signal acquisition boards inside high-frequency oscilloscopes.

UGPCBを選択する理由?

Choosing UGPCB means choosing precision and reliability. We perform impedance calculations and production control strictly according to your design parameters including 1.0mm thickness, 0.254mm dielectric, and specific copper weights. In the communication PCB field, even a slight deviation can cause system failure.

Ready to drive your next-generation communication product?

Send your Gerber files to sales@ugpcb.com for a free quote and technical support on your RO4350B hybrid board.

Our engineering team will provide professional DFM analysis and a competitive price proposal within 24 時間.

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