TG150 PCB | High-Tg 4-Layer Immersion Gold Circuit Board | 0.08mm Fine Line Specialist

TG150 PCB Circuit Board 導入: Meeting the Thermal Challenge in Modern Electronics

In high-speed communications, 自動車, 航空宇宙, and advanced industrial controls, electronic devices face increasingly harsh operating environments. Elevated temperatures can cause standard PCB基板 (例えば。, standard FR-4) to reach their glass transition, leading to softening, 変形, and critical performance loss, jeopardizing system reliability. を選択する high-tg プリント基板 is essential for ensuring long-term stability in these demanding applications.

High-Tg 4-Layer Immersion Gold Circuit Board

1. 製品の概要: What is a TG150 PCB?

あ TG150 PCB is a プリント基板 fabricated using a laminate material with a glass transition temperature (TG) of 150°C. The Tg is a crucial metric for a PCB substrate’s thermal endurance. Compared to common TG130 PCB laminates, TG150 material maintains superior physical rigidity and stable electrical properties under high temperatures. UGPCB 4-layer TG150 circuit board combines this high-performance material with an イマージョンゴールド (同意する) 表面仕上げ and supports 0.08mm fine-line circuitry そして 0.2mm micro-drilling, making it a high-reliability 多層PCB 解決 for advanced applications.

2. Core Material and Enhanced Performance of TG150 PCB

基本材料: A high-performance epoxy or modified FR-4 formulation, specially engineered to consistently achieve a Tg of 150°C or higher.
Key Performance Advantages (対. TG130 PCBs):
- Exceptional Thermal Stability: The increase from 130°C to 150°C Tg significantly enhances the board’s resistance to deformation at high temperatures, improving its ability to withstand high-temperature assembly processes like lead-free soldering.
- Superior Moisture and Chemical Resistance: A denser molecular structure reduces moisture absorption in humid environments, minimizing losses in insulation resistance (IR) および信号の完全性, while offering better resistance to chemical exposure.
- Improved Mechanical Strength and Dimensional Stability: High Tg PCBs exhibit lower Z-axis expansion coefficients and stronger bond strength during thermal cycling, reducing risks like via cracking and delamination.
- Stable Electrical Characteristics: 誘電率 (DK) そして 散逸係数 (Df) remain more stable at elevated operating temperatures, ensuring higher signal integrity for 高周波プリント基板.

3. Structure and Design Specifications of Our TG150 PCB

PCB Stack-up

This product is a standard 4-層 PCBボード. A typical stack-up is 信号層 – グラウンドプレーン – パワープレーン – 信号層, providing a complete return path for high-speed signals and effective EMI control.

4-layer TG150 PCB stack-up structure diagram showing signal, ground, and power plane layers

Key Design Capabilities & 仕様

Minimum Trace Width/Space: 0.08mm / 0.1mm. This represents advanced fine-line プリント基板の製造 能力, essential for routing high-density ICs (例えば。, BGA packages).

ドリル径: 0.2mm. サポート micro-via drilling, facilitating higher density interconnects and saving board space.

表面仕上げ: イマージョンゴールド (同意する). 平らな表面を提供します, 優れたはんだ付け性, そして長い保存期間, ideal for fine-pitch components (例えば。, MF, BGA).

4. Manufacturing Process and Quality Control

UGPCB TG150 PCB manufacturing process strictly adheres to international standards like IPC-6012 (Qualification and Performance Specification for Rigid PCBs). The process includes:
Material Preparation → Inner Layer Imaging → Etching → Lamination → Drilling (0.2mm) → Desmear & Plating → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing → Electrical Testing → Final Inspection.
At each stage, we employ advanced equipment (例えば。, LDI imaging, AOI検査) and rigorous reliability testing (例えば。, 熱応力, ionic contamination) to ensure the quality of every high-Tg circuit board.

TG150 PCB

5. Product Classification and Typical Applications

技術分類:
- By Tg: Mid-High Tg PCB (Tg ≥ 150°C).
- レイヤーカウントごとに: 多層プリント基板 (4-Layer Board).
- テクノロジーによって: Precision PCB (HDI-ready capability).
- By Finish: ENIG PCB, Fine-Line PCB.
Ideal Application Scenarios:
- カーエレクトロニクス: Engine Control Units (カバー), インフォテインメントシステム, power management modules – requiring tolerance under-hood temperatures.
- Telecommunications Equipment: 5G base station PAs, optical modules, network switches – where high power generates sustained heat.
- 産業用制御: サーボドライブ, plcs, industrial PCs – for reliable operation in hot factory environments.
- Power Electronics: High-power switch-mode power supplies (SMPS), inverters – where power components generate significant heat.
- 航空宇宙 & 防衛: Electronic systems with extreme demands for reliability and environmental resilience.

6. Why Choose UGPCB for Your TG150 PCBs?

認定された材料: We use verified, traceable TG150 PCB laminates from reputable suppliers.
精密製造: Our expertise in multilayer PCB fabrication そして ENIG processing ensures high yield for 0.08mm fine-line designs.
Guaranteed Specifications: All technical parameters (Tg 150°C, 0.2mm drills) are rigorously validated against datasheets.
エンドツーエンドのサポート: We provide full technical support from プリント基板設計レビュー そして インピーダンス制御 to rapid prototyping and volume production.

7. 行動を起こしてください: Secure Your Design with a Robust Foundation

Don’t let thermal limitations hinder your product innovation. Choosing UGPCB’s high-reliability TG150 PCB means investing in exceptional stability, 耐久性, とパフォーマンス.

行動を促す

*(Image Suggestion: High-quality close-up photo of a populated TG150 PCB used in a telecom orautomotive application.)*
Alt Tag: High-density assembled 4-layer TG150 PCB with ENIG finish for automotive or telecom applications

Is your next project facing thermal reliability challenges?
Do you need a PCB that can withstand rigorous environmental stress?

Contact the UGPCB expert team today!
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Let our expertise in high-performance プリント基板の製造 power your success.