プリント基板設計, PCB製造, プリント基板, PECVD, ワンストップサービスを使用したコンポーネントの選択

ダウンロード | について | 接触 | サイトマップ

F4BDZ294テフロン織りガラス布平面抵抗器銅覆われたラミネート - UGPCB

PCB材質一覧

F4BDZ294テフロン織りガラス布平面抵抗器銅覆われたラミネート

F4BDZ294 Introduction

F4BDZ294 is a type of Teflon woven glass fabric planar resistor copper-clad laminates with a dielectric constant of 2.94 (DK 2.94). この高周波ラミネートは、Teflon PCB織物布を使用して製造されています, which has a low dielectric constant and low dissipation factor, combined with planar resistor copper foil. It boasts excellent electrical and mechanical performance, making it highly reliable mechanically and electrically stable, which is ideal for the design of complex microwave circuits.

F4BDZ294 Specifications for the Planar Resistor Copper Foil

Square Resistance and Thickness of Nickel-Phosphorous Alloy

Square Resistance Thickness of Nickel-Phosphorous Alloy (μm) 許容範囲
50 0.20 5%
100 0.10 5%

F4BDZ294 Material Structure

One side of the material is clad with resistor copper foil, while the other side is clad with traditional copper foil. The dielectric material used is Teflon woven glass fabric, with a dielectric constant of 2.94.

F4BDZ294 Material Features

  • Low dielectric constant and loss
  • Excellent electrical and mechanical performance
  • Lower thermal coefficient of dielectric constant
  • Low outgassing

F4BDZ294 Application Scope

  1. Ground-based and airborne radar systems
  2. フェーズドアレイアンテナ
  3. GPSアンテナ
  4. Power backboards
  5. Multilayer PCBs
  6. Spotlight networks

前へ:

次:

返信を残す

伝言を残す