F4BME-1/2: Advanced Microwave PCB Laminate Overview
F4BME-1/2 is a high-performance microwave circuit board laminate crafted by laminating varnished glass cloth with Teflon (PTFE) 樹脂, following stringent scientific formulations and technology processes. This product offers significant enhancements over the F4BM series in terms of electrical performance and passive intermodulation indicators.
技術仕様
外観 & Compliance
- 会う: National and Military Standards for microwave PCB laminates.
Types Available
- F4BME217, F4BME220, F4BME245, F4BME255, F4BME265, F4BME275, F4BME285, F4BME295, F4BME300, F4BME320, F4BME338.
寸法 & カスタマイズ
- Standard sizes range from 300x250mm to 1500x1000mm.
- Custom sizes: Available upon request.
厚さ & 許容範囲
- Ranges from 0.25mm to 12.0mm, inclusive of copper thickness.
- Tolerances vary from ±0.025mm to ±0.20mm based on thickness.
機械的性質
- ワープ: Dependent on thickness, max warp varies from 0.010mm to 0.050mm.
- Cutting/Punching Strength: No burrs for <1mm thick boards; delamination-free punching holes spaced min 0.55mm for <1mm, 1.10mm for >1mm thick boards.
- はく離強度: Under normal conditions ≥16N/cm; after environmental stress testing, ≥12N/cm.
Chemical Resistance
- Suitable for standard PCB etching methods without altering dielectric properties.
- Requires sodium or plasma treatment for plating through holes.
- Hot Air Level temperature must not exceed 253°C and cannot be repeated.
- 密度: 2.1-2.35 g/cm³.
- Moisture Absorption: ≤0.08% after 24hrs in distilled water at 20±2°C.
- Operating Temperature Range: -50°C to +260°C.
- 熱伝導率: 0.3-0.5 W/mK.
- 熱膨張係数 (CTE): Varies with dielectric constant and temperature range.
- Shrinkage Factor: ≤0.0002% in boiling water for 2hrs.
- 表面 & 体積抵抗率: High under both normal and controlled humidity/temperature conditions.
- 誘電率 & 損失係数: Detailed values provided for various frequencies and types.
- PIMD (Passive Intermodulation Distortion): -158 dBc @ 2.5GHz.
For further details or inquiries about F4BME-1/2, click here.