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F4BME-2-A Teflon PCB Glass Fabric Copper-Clad Laminates
F4BME-2-A Teflon PCB glass fabric copper-clad laminates are manufactured using imported woven glass fabric, Teflon PCB resin, and filler with a Nano-ceramic membrane. This product adheres to scientific formulations and stringent technological processes, utilizing low roughness copper foil. It surpasses the F4BM series in electrical performance and surface insulation resistance stability, boasting a higher intermodulation index than F4BME-1/2.
技術仕様
外観: Meets the specification requirements for microwave PCB laminates according to National and Military Standards.
Types:
- F4BME-2-A255
- F4BME-2-A262
- F4BME-2-A275
- F4BME-2-A285
- F4BME-2-A294
- F4BME-2-A300
寸法 (mm):
- 550*440
- 500*500
- 600*500
- 650*500
- 1000*850
- 1100*1000
- 1220*1000
- 1500*1000
Custom dimensions are available upon request.
厚さと寛容 (mm):
| Laminate Thickness | 許容範囲 |
|---|---|
| 0.254 | ±0.025 |
| 0.508 | ±0.05 |
| 0.762 | ±0.05 |
| 0.787 | ±0.05 |
| 1.016 | ±0.05 |
| 1.27 | ±0.05 |
| 1.524 | ±0.05 |
| 2.0 | ±0.075 |
| 3.0 | ±0.09 |
| 4.0 | ±0.1 |
| 5.0 | ±0.1 |
| 6.0 | ±0.12 |
| 9.0 | ±0.18 |
| 10.0 | ±0.18 |
| 12.0 | ±0.2 |
機械的強度:
- 切断/パンチ:
- 厚さ <1mm: No burrs after cutting; minimum space between two punching holes is 0.55mm, 剥離はありません.
- 厚さ >1mm: No burrs after cutting; minimum space between two punching holes is 1.10mm, 剥離はありません.
- はく離強度 (1oz copper):
- Normal state: ≥14N/cm; No bubble or delamination peel strength: ≥12N/cm (under constant humidity and temperature, kept in melting solder at 265°C ±2°C for 20 秒).
化学物質: The chemical etching method for PCB can be used without altering the dielectric properties of the laminate. Plating through holes requires sodium treatment or plasma treatment.
電気物質:
| 名前 | テスト条件 | ユニット | 価値 |
|---|---|---|---|
| Density | Normal state | g/cm³ | 2.1～2.35 |
| Moisture Absorption | Dip in distilled water at 20±2°C for 24 時間 | % | ≤0.07 |
| 動作温度 | High-low temperature chamber | ℃ | -50°C～+260°C |
| 熱伝導率 | W/m/k | 0.45~0.55 | |
| CTE (typical) | -55～288°C (εr :2.5~2.9) | ppm/°C | x: 16, y: 20, Z: 170 |
| CTE (typical) | -55～288°C (εr :2.9~3.0) | ppm/°C | x: 12 y: 15 Z: 90 |
| Shrinkage Factor | 2 hours in boiling water | % | <0.0002 |
| 表面抵抗率 | 直流, 500V, Normal state | MΩ | ≥4*10^5 |
| 体積抵抗率 | Normal state | MΩ・cm | ≥6*10^6 |
| Surface dielectric strength | d=1mm(Kv/mm) | ≥1.2 | |
| 誘電率 | 10GHz | See table below | |
| 損失係数 | 10GHz | See table below | |
| PIMD (2.5GHz) | db | -160 |
UL Flammability Rating: 94 V-0
For more information or to place an order, please visit our website www.ugpcb.com or contact us via email at sales@ipcb.com.
UGPCB Products:
UGPCB offers a wide range of products including:
- Radio/Microwave/Hybrid High Frequency FR4 Double/Multi-Layer 1~3+N+3 HDI, Anylayer HDI, Rigid-Flex, Blind Buried Slotted, Backdrilled IC Heavy Copper Board, もっと.
If you have any questions or need further assistance, please do not hesitate to contact us through our website or send an inquiry directly to sales@ugpcb.com.
