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F4BMX-1/2 Teflon PCBの概要

F4BMX-1/2 Teflon PCBの概要

F4BMX-1/2 is a high-performance laminate crafted by layering imported varnished glass cloth with Teflon resin and Polytrtrafluoroethylene film. This product adheres to scientific formulations and stringent technological processes, offering superior electrical performance compared to the F4B series. It features a broader range of dielectric constants, lower dielectric loss tangent, increased resistance, and more stable performance. The use of imported woven glass fabric ensures consistency in the properties of the laminate.

F4BMX-1/2 Technical Specifications

外観

Meets the specification requirements for microwave PCB laminates according to national and military standards.

Types

誘電率

寸法 (mm)

厚さと寛容 (mm)

Laminate Thickness 許容範囲
0.25 ±0.025
0.5 ±0.05
0.8 ±0.05
1.0 ±0.05
1.5 ±0.075
2.0 ±0.09
3.0 ±0.1
4.0 ±0.1
5.0 ±0.1
6.0 ±0.12
8.0 ±0.15
10.0 ±0.18
12.0 ±0.2

注記: The laminate thickness includes the copper thickness. Customized laminates are available for special dimensions.

機械的強度

厚さ(mm) Maximum Warp Original Board Single Side Double Side
0.25~0.5 0.030 0.050 0.025 0.020
0.8~1.0 0.025 0.030 0.020 0.020
1.5~2.0 0.020 0.025 0.015 0.015
3.0~5.0 0.015 0.020 0.010 0.010

Cutting/Punching Strength:

皮の強度 (for 1oz copper):

化学物質

The chemical etching method for PCB can be used without altering the dielectric properties of the laminate. Plating through holes requires sodium treatment or plasma treatment. Hot Air Level temperature must not exceed 253 degrees Celsius and cannot be repeated.

電気物質

名前 テスト条件 ユニット 価値
密度 Normal state g/cm³ 2.1~2.35
Moisture Absorption Dip in distilled water at 20±2°C for 24 時間 % ≤0.08
動作温度 High-low temperature chamber 学位摂氏 -50°C~+260°C
熱伝導率 W/m/k 0.3~0.5
CTE Typical (εr :2.1~2.3) ppm/°C x: 24(x), y: 34(y), z: 235(z)
CTE Typical (εr :2.3~2.9) ppm/°C x: 16(x), y: 20(y), z: 168(z)
CTE Typical (εr :2.9~3.38) ppm/°C x: 12(x), y: 15(y), z: 92(z)
Shrinkage Factor 2 hours in boiling water % < 0.0002
表面抵抗率 直流, 500V, Normal state ≥2*10^5
Under constant humidity and temperature ≥8*10^4
体積抵抗率 Normal state MΩ・cm ≥8*10^6
Under constant humidity and temperature ≥2*10^5
Surface dielectric strength Normal state d=1mm(Kv/mm) ≥1.2
Under constant humidity and temperature ≥1.1
誘電率 10GHz, εr (±2%) See table below
損失係数 10GHz tgδ See table below

Dielectric Constant and Dissipation Factor at 10GHz

タイプ 誘電率 (εr) 損失係数 (tgside)
F4BMX217 2.17
F4BMX220 2.20
F4BMX245 2.45
F4BMX255 2.55
F4BMX265 2.65
F4BMX275 2.75
F4BMX285 2.85
F4BMX294 2.94
F4BMX300 3.0

UGPCB Products and Services

UGPCB offers a variety of products including Radio/Microwave/High Frequency hybrid circuits, single layer to multilayer AnyLayerHDI, BGA, IC Heavy Copper Board, and custom solutions such as Rigid-Flex, HDI, Blind Buried Slotted Blind Back Drilled, and IC Carrier boards. Our services include PCB manufacturing, 電気めっき, もっと. For any inquiries, please contact us through our website www.ugpcb.com or email us at sales@ugpcb.com.

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