Introduction to F4BTME-1/2
F4BTME-1/2 is a laminated material created by combining imported varnished glass cloth with Teflon PCB resin and filler, incorporating a Nano-ceramic membrane. This product adheres to strict scientific formulations and technology processes. It employs low roughness copper foil, offering superior electrical performance compared to the F4BM-2-A series, enhanced heat dissipation, and a smaller thermal expansion coefficient. It is stable in PIM and suitable for 4G and 5G communications.
Technical Specifications of F4BTME-1/2
外観とタイプ
The appearance meets the specification requirements for microwave PCB laminates as per National and Military Standards. The available types include:
- F4BTME-1/2 (255)
- F4BTME-1/2 (265)
- F4BTME-1/2 (285)
- F4BTME-1/2 (294)
- F4BTME-1/2 (300)
- F4BTME-1/2 (320)
- F4BTME-1/2 (338)
- F4BTME-1/2 (350)
- F4BTME-1/2 (400)
- F4BTME-1/2 (440)
Dimensions and Thickness Tolerances
- Standard Dimensions: 610460, 600500, 1220914, 12201000, 1500*1000 mm.
- Customized Dimensions: Available upon request.
- 厚さのオプション: 0.254, 0.508, 0.762, 0.787, 1.016; 1.27, 1.524, 2.0; 3.0; 4.0; 5.0; 6.0; 9.0; 10.0; 12.0 mm.
- 許容範囲: ±0.025 to ±0.2 mm depending on thickness.
機械的強度
- 切断/パンチ: No burrs after cutting, minimum space between punching holes varies from 0.55mm to 1.10mm without delamination.
- はく離強度: Normal state ≥16N/cm, no bubbles or delamination under constant humidity and temperature after melting solder at 265°C±2°C for 20 秒.
- 熱ストレス抵抗: No delamination or blisters after three cycles of solder float at 260°C for 10 秒.
化学的および電気的特性
- Chemical Etching: Suitable for PCB chemical etching without altering dielectric properties; sodium treatment or plasma treatment required for through-hole plating.
- 電気性能: Includes density, moisture absorption, 使用温度範囲, 熱伝導率, CTE variations, 誘電率, 散逸係数, PIMD values, and flammability rating (UL 94 V-0).
This comprehensive overview and detailed technical specifications provide a thorough understanding of the F4BTME-1/2 laminate’s capabilities and applications, making it an ideal choice for advanced electronic device manufacturing where high-frequency performance and thermal management are critical.