新しいアンテナレベルPCB材料: RO4725JXR, RO4730JXR, and RO4730G3
Rogers launched the RO4725JXR, RO4730JXR, およびRO4730G3アンテナレベルPCB材料は、アクティブアンテナアレイの現在および将来の高性能要件を満たすための材料, small base stations, 4G base transceivers, モノのインターネット (IoT) devices, and emerging 5G wireless system applications.
Flame Retardant RO4730G3 Thermosetting Laminate Material
This flame retardant (UL 94V-0) RO4730G3 thermosetting laminate material is a derivative of Rogers’ long trusted and popular circuit material for base station antenna applications. It has a low dielectric constant of 3.0, which is preferred by antenna designers, and a z-direction dielectric constant deviation of ± 0.05 で 10 GHz.
Specifications and Features of RO4725JXR, RO4730JXR, and RO4730G3
RO4730G3 Laminate Composition and Properties
- Made of ceramic hydrocarbon material and low loss LoPro Copper foil.
- Provides excellent passive intermodulation performance (usually better than -160 DBC).
- 30% lighter than PTFE with high glass transition temperature (TG) over +280 ℃.
- Compatible with automatic assembly process.
- 熱膨張係数が低い (CTE) in Z direction (30.3 ppm/C) から -55 °C to +288 ℃.
- Better flexural strength than RO4000JXR material due to lead-free process resistance.
Stable Performance Across Temperature Range
- The performance of RO4730G3 is stable with temperature.
- Coefficient of thermal expansion (CTE) matches copper with very low rate of thermal change in the Z direction of the dielectric constant.
- High frequency loss is very low, with a loss factor of 0.0023 で 2.5 ghzと 0.0029 で 10 GHz.
Applications and Cost-Effectiveness
- Practical and cost-effective solution for current 4G, IoT wireless devices, and future 5G wireless devices.
- Combined with the right materials, offers the best combination of price, パフォーマンス, そして耐久性.
- Compatible with conventional RF-4700 laminate with no special requirements for high-temperature soldering.
- Economical alternative to PTFE antenna material, aiding designers in achieving high cost performance.
Advantages of RO4730G3 PCB Material
- Cost advantage.
- High Performance for 5G and IoT: Suitable for PCB antennas and active antenna arrays.
- Meets High Cost Performance Needs: Tailored for 4G, 5G, and IoT applications requiring high cost performance.