UGPCB

12-레이어 ENIG PCB | 고신뢰성 FR-4 TU872SLK 다층 회로 기판

Ultimin

Professional Product Overview

The UGPCB 12-Layer Rigid PCB is a high-end 다층 회로 기판 engineered for complex signal transmission, 고밀도 상호 연결 (HDI), and demanding operating environments. Manufactured with high-performance FR-4 TU872SLK laminate and finished with 2-microinch Immersion Gold (동의하다), this board is a cornerstone solution for industrial control systems, 통신 인프라, and advanced computing hardware, offering exceptional electrical performance, long-term reliability, and robust signal integrity.

12-레이어 ENIG PCB

제품 정의 & 분류

This product is classified as a High-Layer Count Rigid Printed Circuit Board. It can be further categorized as:

중요한 설계 고려 사항

Designing a 12-layer PCB requires meticulous attention to:

  1. Stack-up Design: A rational stack-up sequence (예를 들어, alternating signal-ground-signal layers) is paramount for impedance control, crosstalk reduction, and Electromagnetic Compatibility (EMC). A proper 12-layer stack-up provides excellent power integrity and signal shielding.

  2. 임피던스 제어: For high-speed digital signals (예를 들어, DDR, PCIE) or RF lines, precise calculation and control of trace characteristic impedance (예를 들어, 50Ω 단일 종단, 90Ω/100Ω differential) are essential. We utilize advanced EDA tools and precise process controls to ensure consistency.

  3. 힘 & Ground Plane Management: Solid ground planes and optimized power segmentation ensure low-noise power delivery and clear return paths, which are critical for system stability.

  4. 열 관리: The 1.6mm board thickness and the thermal properties of FR-4 must align with component power dissipation. High-power areas may require thermal vias or integration with external cooling solutions.

작동 방식

A PCB is a passive platform that provides mechanical support, 전기적 상호 연결, and signal transmission pathways for electronic components. This 12-layer PCB facilitates a complete working system by connecting chips, 저항기, 커패시터, 등., through a complex network of etched copper traces. The multilayer architecture allows traces to cross on different layers without interference, significantly increasing circuit complexity and integration density. The ENIG surface finish guarantees reliable solder joints and long-term contact stability.

*(이미지 제안: Detailed cross-sectional diagram of a 12-layer PCB stack-up)*
*Alt Text: Cross-sectional view of a 12-layer PCB stack-up showing alternating copper layers and dielectric, illustrating complex internal structure for high-density interconnect.*

건설 & 재료

주요 특징 & 성능

  1. 높은 신뢰성: TU872SLK high-Tg material and ENIG finish ensure resistance to high temperatures, 부식, and suitability for long-term operation in harsh environments.

  2. 우수한 신호 무결성: Rigorous stack-up design and impedance control guarantee high-speed signal quality and lower bit error rates.

  3. Strong Load-Bearing & Thermal Capacity: The 1.6mm thickness offers robust mechanical strength and substantial thermal load management.

  4. Precision Solder Platform: The flat 2μ” ENIG surface is ideal for fine-pitch 구성 요소 (예를 들어, BGAS), resulting in strong, reliable solder joints with low defect rates.

  5. 고밀도 상호 연결 (HDI): Twelve routing layers support complex, dense circuit designs, enabling reduced product footprint.

Manufacturing Process Flow

Inner Layer Imaging → AOI Inspection → Lamination & Pressing → Drilling → Electroless Copper Deposition → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing & Profiling → Electrical Testing → Final Quality Control (FQC)

응용 & 사용 사례

This PCB is widely used in stability and performance-critical fields:

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