UGPCB

Al 보강재가 포함된 단면 플렉스 PCB | 0.2mm 초박형 | UGPCB

Ultra-Thin Single-Sided Flex PCB with Aluminum Stiffener 제품개요 & 정의

In the pursuit of thinner, lighter, and more reliable electronic devices, UGPCB Ultra-Thin Single-Sided Flex PCB with Aluminum Stiffener represents the optimal fusion of flexible circuit technology and structural reinforcement. This solution is engineered to meet the critical challenge of requiring both dynamic flexibility and localized rigidity, 향상된 열 방출, and superior dimensional stability within constrained spaces.

This product is scientifically classified as a: Single-Sided, Adhesive-Based Flexible Printed Circuit (FPC) with a Localized Aluminum Stiffener. It features a standard single-sided FPC construction with a precisely bonded aluminum alloy stiffener in specific zones, creating a cost-effective “rigid-flex-like” performance where it matters most.

 UGPCB reinforced flexible PCB surface

주요 사양

디자인 필수사항 & Structure Analysis

Successful aluminum stiffener FPC design begins with precise application analysis. Design engineers must define:

  1. Stiffener Placement: Accurately identify areas for connector mounting, 구성요소 배치, or mechanical fastening.

  2. Dynamic Flex Zone Planning: Ensure bending occurs only in designated flexible areas, avoiding the stiffener to maximize flex life.

  3. Thermal Management Path: Utilize the aluminum’s high thermal conductivity by connecting copper pads under heat-generating 구성 요소 (예를 들어, LED, ICS) directly to the stiffener, creating an efficient heat-spreading pathway.

  4. 용인 & Registration: Strictly control the alignment tolerance between the stiffener and the FPC to ensure accurate mounting hole placement.

작동 방식 & Performance Advantages

그만큼 PCB with aluminum stiffener operates on a simple yet effective principle:

Core Features & 이익:

제조공정 & 품질 관리

UGPCB employs a mature flex circuit stiffener attachment process ensuring precision and reliability:

  1. FPC Fabrication: Processing of adhesive-based laminate (예를 들어, 셩이) through patterning, 에칭, and drilling.

  2. 표면 마무리: Application of OSP coating to exposed copper pads.

  3. 정밀 라미네이션: Bonding of the pre-cut aluminum stiffener to the FPC using controlled heat and pressure with adhesive (pre-preg or base material adhesive layer).

  4. Contour Routing & Profiling: Final board outline, stiffener shape, and mounting holes are created via CNC or laser cutting.

  5. 포괄적 인 테스트: Includes electrical testing (Flying Probe/Fixture), dimensional AOI, and peel strength tests for the stiffener bond.

기본 응용 프로그램 & 사용 사례

이것 ultra-thin flex PCB with metal stiffener is ideal for:

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