High-Reliability 8-Layer Heavy Copper PCB | 2.0mm Thick FR-4 TG170

High-Reliability 8-Layer Rigid PCB 제품개요 & 정의

In the realm of high-speed, high-density electronic design, 다층 PCB (인쇄 회로 기판) are indispensable. UGPCB 8-레이어 견고한 PCB, built with a substantial 2.0mm 보드 두께 그리고 3OZ heavy copper foil, is engineered to withstand demanding electrical and physical environments. It serves not only as the foundation for electrical connectivity but as a critical component ensuring device stability and enhanced product reliability. For applications in industrial controls, power systems, 아니면 자동차 전자제품, this high-specification board is the optimal solution for complex, high-performance designs.

핵심 사양

• 레이어 수: 8-레이어 리지드 PCB

• Finished Board Thickness: 2.0mm ±10%

• 기본 재료: FR-4, 유리전이온도 (Tg) ≥ 170°C

• 표면 마감: 무연 열풍 솔더 레벨링 (HASL-LF)

• 구리 무게: 3 평방 피트 당 온스 (≈105μm) for both inner and outer layers

• 솔더 마스크 & 실크 스크린: Green LPI Solder Mask, White Silkscreen Legend

중요한 설계 고려 사항

When designing with this high-specification PCB, engineers must prioritize:

1. 열 관리: Leverage the high current-carrying capacity of 3OZ heavy copper to optimize power and ground planes, reducing impedance and heat rise. Use thermal simulation in conjunction with the high heat resistance of FR-4 TG170 material.

2. 임피던스 제어 & 신호 무결성: The 8-layer stack-up allows effective separation of signal, 힘, 그리고지면 층. Precise calculation and control of trace impedance (예를 들어, 50Ω 단일 종단, 100Ω 차동) is essential to minimize reflection and crosstalk.

3. 기계적 & Electrical Reliability: 그만큼 2.0mm thick board enhances overall rigidity, suitable for applications with vibration or insertion stress. For high-voltage or high-current nodes, adjust trace width and clearance according to IPC-2221 standards 그리고 3OZ copper weight to ensure safety margins.

4. DFM (제조 가능성을위한 설계): Collaborate with UGPCB’s engineering team early to address specific requirements for heavy copper PCB 그리고 thick board PCB 처리, such as drilling parameters and plating uniformity, ensuring a high-yield manufacturing process.

작동 방식 & 구조

An 8-레이어 PCB is fabricated by laminating multiple conductive layers into a single unit using precise processes including inner-layer imaging, 라미네이션, 교련, and plating. Electrical connections between layers are established via plated through-holes (PTHS), 블라인드 비아, or buried vias. A typical stack-up example is:

최상층 (신호) — Prepreg — L2 (지면) — Core — L3 (신호) — Core — L4 (힘) — Core — L5 (신호) — Prepreg — Bottom Layer (신호)

This “sandwich” structure effectively isolates high-speed signals, provides solid reference planes, and ensures efficient power distribution.

성능 & 주요 특징

1. Superior Electrical Performance: 3OZ heavy copper provides extremely low conductor resistance and excellent current-carrying capacity (over 3x that of standard 1OZ copper), reducing power loss and voltage drop.

2. Exceptional Thermal Reliability: FR-4 TG170 high Tg material withstands higher operating and soldering temperatures. Combined with the thermal conductivity of heavy copper, it significantly improves long-term reliability in high-temperature environments.

3. Enhanced Mechanical Stability: 그만큼 2.0mm thick board combined with rigid FR-4 offers superior resistance to bending and vibration, ideal for harsh operating conditions.

4. High Solder Joint Reliability: 그만큼 HASL-LF surface finish 아파트를 제공합니다, coplanar pad surface with excellent solderability and extended shelf life, compliant with RoHS directives.

5. 고밀도 상호 연결 (HDI) 능력: The 8-layer design offers ample routing space for complex circuits, facilitating device miniaturization and functional integration.

생산 공정 개요

Engineering Review → Material Cutting (FR-4 TG170) → Inner Layer Imaging & 에칭 (3온스) → Oxide Treatment & Lamination → Mechanical Drilling & Copper Plating → Outer Layer Patterning & 도금 (to 3OZ) → Solder Mask Application (Green LPI) & 실크 스크린 (하얀색) → Lead-Free HASL Surface Finish → Electrical Testing & 최종검사 (per IPC standards)

Each stage incorporates stringent quality control checkpoints to ensure every high-reliability multilayer PCB meets exact customer specifications.

기본 응용 프로그램 & 사용 사례

This PCB is designed for high-power, high-stability applications:

• 산업 제어 시스템: plcs, 모터 드라이브, and industrial power supplies requiring heavy copper PCBs for high current.

• 재생 에너지 & Power Systems: Solar inverters, UPS 시스템, and EV charging modules relying on high current capacity and thermal endurance.

• 자동차 전자: On-Board Chargers (OBC), 배터리 관리 시스템 (BMS), and DC-DC converters, 어디 high Tg PCBs are essential for under-hood temperatures.

• Telecommunications Infrastructure: Base station power amplifier units and network backup power systems.

• 고급 테스트 & 측정 장비: Instruments requiring stable power delivery and low-noise performance.

제품 분류 (Per IPC Standards)

1. 레이어 수에 의해: 다층 PCB (>4 레이어), specifically an 8-layer circuit board.

2. 강성별: 강성 PCB.

3. 기본 재료에 의해: FR-4 PCB, subset: 높은 TG PCB (Tg ≥ 170°C).

4. By Special Process: 무거운 구리 PCB (per IPC-2152), Thick Board PCB.

5. By Application Class: Suitable for IPC 클래스 2 (Dedicated Service Electronic Products) 그리고 수업 3 (High-Reliability Electronic Products) 애플리케이션, 포함 Industrial Grade PCB, Power Electronics PCB, 그리고 Automotive Grade PCB.