UGPCB

Reliable 2-Layer Industrial Rigid PCB Manufacturer | FR-4 TG150, 1.6mm, 무연 HASL

소개

UGPCB‘s 2-Layer Rigid PCB is a fundamental, 높은 신뢰성 회로 기판 solution engineered for demanding applications. Built on a robust FR-4 TG150 기판 with a standard 1.60mm thickness, it delivers an optimal balance of performance, 내구성, 그리고 비용 효율성. The board features a reliable lead-free Hot Air Solder Leveling (HASL) 표면 마감, a protective black solder mask, and clear white silkscreen legends for identification.

UGPCB‘s 2-Layer Rigid PCB

제품개요 & 분류

This double-sided PCB serves as a core interconnect platform for a wide range of electronics. It is scientifically classified as a 강성 PCB (by construction), 에이 2-Layer or Double-Sided Board (by layer count), and is rated for Industrial Grade (IPC 클래스 2) applications based on its FR-4 TG150 material specification, making it suitable for extended lifecycle products.

설계 & 작동원리

Successful implementation requires attention to electrical and thermal design rules. Adequate trace width for current capacity (예를 들어, 1A per 10mil trace width for 1oz copper) and strategic placement of thermal reliefs are critical. The PCB functions as a miniature city: 그만큼 FR-4 substrate is the foundation, copper traces are the roads carrying signals and power, plated through-holes are interlayer connectors, 그만큼 솔더 마스크 is a protective coating, 그리고 실크 스크린 provides navigation.

건설, 재료 & 성능

The symmetrical stack-up ensures mechanical stability. Key materials define its capabilities:

This combination yields high heat resistance, superior electrical insulation, strong mechanical rigidity (from the 1.60mm thickness), and excellent solder joint reliability.

제조공정 & 품질 관리

Our production follows IPC 표준, encompassing CAM engineering, precision drilling, 전기 도금, LPI solder mask application, legend printing, lead-free HASL surface finishing, and electrical testing. Every board undergoes 100% electrical testing and 자동 광학 검사 (AOI) to meet stringent quality criteria.

응용

This versatile PCB is ideal for:

Key Specifications Table

매개 변수 사양
레이어 2
보드 두께 1.60 mm (기준)
기본 재료 FR-4, Tg ≥ 150°C
구리 무게 1 온스 (35 μm) 기준
솔더 마스크 검은색, LPI
실크 스크린 하얀색
표면 마감 무연 HASL
최소. 추적/간격 ≥ 0.15 mm (6 밀)
Standard Compliance IPC-A-600, IPC 클래스 2
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