12-Layer Gold Finger PCB Manufacturer | 1.6mm FR-4 TG170 ENIG & Hard Gold Plating | UGPCB

High-Performance 12-Layer ENIG + 골드 핑거 PCB 제품개요

그만큼 12-레이어 골드 핑거 PCB is a hallmark product in the high-end 인쇄 회로 기판 산업, engineered specifically for electronic equipment demanding extreme reliability, stable electrical connections, and frequent plugging/unplugging cycles. UGPCB employs advanced manufacturing processes and premium materials (FR-4 TG170), combining 2μ” Electroless Nickel Immersion Gold (동의하다) surface finish with 30μ” Hard Gold Finger Plating 기술. We deliver a comprehensive high-reliability PCB solution for applications ranging from industrial controls to advanced communication systems.

제품 정의

A Gold Finger PCB refers to a circuit board featuring a series of exposed, rectangular contact pads plated with thick gold (“fingers”) along one edge. These boards are designed for direct insertion into a matching connector slot, establishing a stable, pluggable connection for electrical signals and power between devices. 이 제품은 12-레이어 다층 PCB with a standard thickness of 1.60mm, offering an optimal balance between complex circuit integration and mechanical robustness.

중요한 설계 고려 사항

1. Gold Finger Area Design:

   • Chamfer (Bevel) Edge (Typically 20-45°): Facilitates smooth insertion into the connector—a critical aspect of 골드핑거 PCB 설계.

   • Lead-in (Trace Fanout): Connections from the gold fingers to internal traces must have smooth curves, avoiding right angles to prevent stress concentration and plating cracks.

   • Solder Mask Clearance (Solder Mask Define): The gold finger area requires precise solder mask opening to ensure a clean, exposed plating surface.

2. 임피던스 제어 & 신호 무결성: 로서 12-layer precision PCB, strict impedance control (예를 들어, 50Ω 단일 종단, 100Ω 차동) for high-speed signal layers is essential. Stack-up design must be optimized via simulation to minimize crosstalk.

3. 열의 & Reliability Management: High-Tg material, coupled with a well-designed via structure, ensures the high-layer-count PCB operates stably in elevated temperature environments. 홀을 통해 도금 (PTHS) should be avoided at the root of gold fingers to prevent fluid entrapment and structural weakness.

작동 방식 & 구조

This PCB facilitates complex circuit interconnections through its internal 12 전도성 층. The core functionality resides in the Hard Gold Plated Fingers. The durable 30-microinch gold plating provides excellent conductivity, 내산화성, 내마모성. When the board is inserted into a backplane or card-edge connector, the gold fingers make tight, low-resistance electrical contact with the connector’s spring contacts, transmitting signals and power. The board core uses FR-4 TG170, providing solid mechanical support and electrical insulation.

핵심 재료 & 명세서

• 기본 재료: FR-4 TG170. A high-performance epoxy glass laminate.

  • 높은 유리 전이 온도 (Tg ≥ 170°C): Significantly enhances the PCB’s mechanical stability and heat resistance under high-temperature operating conditions, preventing delamination and Z-axis expansion.

  • Superior Electrical Properties: 저 유전 상수 (DK) and dissipation factor (Df), suitable for mid-to-high frequency applications.

  • High Mechanical Strength: Ensures the 1.6mm thick PCB board resists bending and warping in mating/unmating and high-vibration environments.

• 표면 마감:

  • Board Surface: 무전해 니켈 침지 금 (동의하다, 2μ”): Provides a flat, coplanar surface for reliable soldering of fine-pitch components and offers excellent oxidation resistance.

  • 골드 핑거스: Selective Electroplated Hard Gold (30μ”): High hardness, superior abrasion resistance, and extended mating cycle life, capable of withstanding 500+ insertion/withdrawal cycles with ease.

주요 특징 & 장점

1. Unmatched Reliability: FR-4 TG170 high-Tg material 그리고 12-layer precision lamination ensure long-term stability in harsh operating conditions.

2. Extended Mating Cycle Life: 30μ” thick hard gold fingers far exceed standard plating thickness, offering exceptional wear resistance—the ideal choice for high-durability plug-in PCBs.

3. 우수한 신호 무결성: The multilayer design provides uninterrupted reference planes for high-speed signals, and controlled impedance guarantees signal quality.

4. Robust Thermal & 기계적 성능: The 1.60mm standard thickness combined with high-Tg material delivers superior rigidity, 열 관리, and dimensional stability.

5. Comprehensive High-End Solution: 에서 다층 PCB 제작 에게 specialty surface finishing (동의하다 + Selective Gold), UGPCB provides full-process control, ensuring consistent, 고품질 결과.

Manufacturing Process Flow

Panelization → Inner Layer Imaging → Lamination (12-층) → Drilling → Desmear & Electroless Copper Deposition → Outer Layer Imaging → Pattern Plating (for Hard Gold Fingers) → Etching → Solder Mask Application → ENIG Surface Finish → Gold Finger Beveling → Electrical Test (비행 프로브 / Fixture) → 최종 자동 광학 검사 (AOI) → 포장.

기본 응용 프로그램 & 사용 사례

This product is the core component of high-end electronic devices requiring direct board-to-board plug connections 또는 integration into backplane systems.

• 산업 제어 시스템: PLC modules, industrial computer motherboards, servo drives, I/O interface cards.

• 통신 & Networking Equipment: Router/switch line cards, optical transceiver modules, baseband processing units.

• 의료 전자 장치: Data acquisition and processing boards for advanced medical imaging systems (예를 들어, CT 스캐너, ultrasound machines).

• 시험 & 측정 장비: Plug-in modules for high-end oscilloscopes, 스펙트럼 분석기, and Automated Test Equipment (먹었다).

• 항공우주 & Defense Electronics: Mission-critical avionics systems and radar signal processing modules where reliability is paramount.

Scientific Product Classification

1. 레이어 수에 의해: High-Layer-Count / 다층 회로 보드 (≥8 layers, 구체적으로 12 레이어).

2. By Special Feature/Process: 골드핑거 (Gold Edge Connector) PCB, Mixed Surface Finish PCB (동의하다 + Selective Hard Gold).

3. By Material Property: 높은 Tg (TG170) PCB, FR-4 Series PCB.

4. By Application Grade: Industrial-Grade PCB, Telecom-Grade PCB, High-Reliability PCB.

Why Choose UGPCB’s 12-Layer Gold Finger PCB?

We understand that a reliable Gold Finger PCB is the foundation of your high-end equipment’s stable operation. 심층적인 전문 지식을 활용하여 다층 PCB 제조 그리고 specialty surface finish processes, UGPCB guarantees that every board delivered meets military-grade reliability standards with commercial-grade delivery efficiency. 우리는 단순한 제품이 아닌, but a customized PCB solution.

Contact our technical sales team today to discuss your project requirements, receive a detailed quote, and qualify for a free design-for-manufacturability (DFM) 검토 and sample program. Partner with UGPCB for your most demanding 12 layer circuit board 애플리케이션.