Rogers PCB RO4350B 인쇄 회로 기판

Ultimin

1 year ago

Professional 8-Layer Rogers 4350B High-Frequency PCB for Demanding RF & Microwave Applications

In the rapidly advancing fields of wireless communications, 항공우주, and high-end test instrumentation, 표준 PCB fall short of meeting extreme demands for signal integrity, 낮은 손실, and thermal stability. UGPCB leverages deep technical expertise to present this 8-Layer High-Frequency PCB 기반 Rogers 4350B laminate. Engineered to address core challenges in RF applications, it is more than an interconnect—it’s a critical foundation ensuring stable performance and signal purity in advanced electronic systems.

제품개요 & 정의

This product is an 8-layer rigid high-frequency Printed Circuit Board (PCB), utilizing the industry-recognized premium RF material—로저스 4350B. Through precision multilayer lamination and specialized processing, it achieves high-density integration of complex RF circuits within a 1.65mm board thickness, delivering superior electrical performance control. It is specifically designed for applications requiring 낮은 손실, 안정적인 유전체 상수, 우수한 열 관리.

Detailed Specifications & 디자인 고려 사항

A high-quality PCB starts with precise control over every detail. Below are the core specifications and their design significance:

Parameter Category	사양	Design Rationale & Implication
Basic Structure	레이어: 8 레이어	Provides ample routing space, supports separate power, 지면, and signal planes—essential for 고밀도 상호 연결 (HDI) 그리고 전자기 간섭 (EMI) suppression.
	보드 두께: 1.65mm	A balanced thickness ensuring mechanical robustness and heat dissipation while accommodating spatial constraints in assemblies.
핵심 자료	라미네이트: 로저스 4350B	The cornerstone of high-frequency PCB 설계. Its low dissipation factor (Df) and stable dielectric constant (DK) with minimal variation over frequency/temperature are critical for RF/microwave circuit 신호 무결성.
전도도	구리 무게: 안의 1/1 온스, 밖의 1/1 온스	Balanced copper weight ensures consistent current-carrying capacity and impedance control accuracy. 1 oz outer copper aids in heat dissipation.
표면 마감	동의하다 (무전해 니켈 침지 금), 2μ”	Provides a flat, highly solderable surface with excellent oxidation resistance, ensuring long-term reliability for RF connectors and BGA assemblies.
Physical Dimensions	280mm x 120mm	Suited for medium-sized RF modules or subsystems, balancing integration density and mechanical strength.
특수 공정	Depth-Controlled Milling (Step-down) + 블라인드 비아	Key for enhanced spatial efficiency and performance. Step-down milling allows varied board heights; blind vias enable high-density interconnect from surface to inner layers, reducing signal crosstalk—a hallmark of advanced RF PCBs.

Alt tag for suggested technical diagram: Cross-section diagram of 8-layer PCB stackup showing blind vias and step-down milling.

작동 방식 & 기본 응용 프로그램

작동 원리:

고주파에서 (MHz to GHz range), electrical signal transmission behaves more like electromagnetic wave propagation. This PCB leverages the stable dielectric properties of Rogers 4350B to provide a “smooth highway” for these waves, minimizing energy loss (삽입 손실) and waveform distortion during transmission. Its precise 8-layer stack-up 그리고 blind via design ensure controlled characteristic impedance (예를 들어, 50Ω or 75Ω) for transmission lines while mitigating interlayer signal reflection and crosstalk.

Key Applications:

무선 인프라: 5G/6G base station antennas, 전력 증폭기 (PAs), 필터, LNAs.
Satellite Comms & 항공우주: Satellite transceiver modules, 레이더 시스템, RF front-ends.
고급 테스트 & 측정: Core boards for network analyzers, 스펙트럼 분석기, signal generators.
자동차 전자: Millimeter-wave radar boards for ADAS.
의료 장비: RF control modules in high-precision imaging systems (예를 들어, MRI).

과학적 분류

Per industry and IPC standards, this product is classified as a 고주파, Multilayer Rigid Printed Circuit Board. More specifically, 그것은 8-Layer Metal Core PCB with Blind Vias, fabricated on ceramic-filled hydrocarbon/glass weave reinforced laminate (Rogers 4350B series).

건설 & Key Performance Features

Structural Analysis:

This PCB employs a classic symmetrical stack-up, comprising multiple signal layers with dedicated power and ground planes. 블라인드 비아 connect the surface to adjacent inner layers, ~하는 동안 through-holes provide interconnection through the entire board. Depth-controlled milling creates mechanical recesses for shield can installation or special assembly requirements.

Outstanding Performance Features:

초저신호 손실: The low dissipation factor of 로저스 4350B at GHz frequencies ensures high-efficiency signal transmission.
Exceptional Electrical Stability: Excellent thermal coefficient of dielectric constant (TCDk) guarantees consistent performance across a wide temperature range.
우수한 열 관리: 열 팽창 계수 (CTE) and high thermal conductivity enhance reliability in high-power RF circuits.
High-Precision Impedance Control: Achievable tolerance of ±5% or better, thanks to material stability and UGPCB’s advanced process control.
High-Reliability Interconnects: Robust 2μ” ENIG finish and precision blind via technology ensure durable connections in harsh environments.
Enhanced Design Flexibility: The combination of 8 레이어, 블라인드 비아, and step milling supports highly complex and compact RF system design.

Core Manufacturing Process Flow

재료 준비 & Inner Layer Fabrication: Rogers 4350B clad laminates are sheared, 뚫은 (for blind vias), plated, patterned, and etched to form inner layer circuits.
Layup & 라미네이션: Etched inner layer cores and prepreg sheets are aligned in the designed stack-up and bonded under high temperature and pressure.
Mechanical Drilling & 도금: Through-holes are drilled, followed by electroless and electrolytic copper plating to metallize all holes (PTH and blind vias).
Outer Layer Imaging & 도금: Outer layer circuit pattern is applied, followed by pattern plating to build up trace and hole copper thickness.
표면 마감: 무전해 니켈 침지 금 (동의하다) process applied to form a 2-microinch nickel-gold protective layer on pads and hole walls.
CNC Routing & Step Milling: The board outline is routed, 그리고 depth-controlled milling creates step-down areas as per design.
Electrical Test & 점검: 100% electrical test (flying probe or fixture) for continuity and isolation, followed by final QA inspection (including impedance coupon testing).

Typical Use Case Scenarios

Scenario 1: 5G Massive MIMO Antenna Array Board

In such array boards, densely packed RF channels require minimal mutual interference. This PCB’s stable Dk and blind via design ensure channel isolation and phase coherence, while its superior thermal performance supports prolonged stable operation of PA chips.
Alt tag: 8-layer Rogers 4350B PCB assembly for a 5G Massive MIMO antenna unit.
Scenario 2: Airborne Radar Signal Processing Front-End

Airborne environments involve large temperature swings and vibration. This PCB’s low TCDk ensures consistent radar performance across altitudes and temperatures, while the 1.65mm thick, robust construction resists vibrational stress.

Why Choose UGPCB for Your High-Frequency PCB?

재료 전문 지식: We possess in-depth knowledge of processing high-frequency materials like Rogers, ensuring material integrity from storage through fabrication.
고급 공정 능력: Mature processes for blind via registration 그리고 depth-controlled milling ensure first-pass success for complex designs.
Performance Validation: We provide critical impedance test reports 그리고 S-parameter data support using high-end network analyzers, bridging simulation and measurement.
엔드 투 엔드 지원: We offer full-cycle technical collaboration—from stack-up & impedance design, DFM 분석, to volume production—accelerating your time to market.

Ready to Power Your Next RF Project?

Contact a UGPCB engineer today for a comprehensive DFM review and a competitive quote. Submit your stack-up and impedance requirements to start the conversation.