초박형 0.30mm 고주파 PCB | 2-ENIG가 포함된 Layer Rogers R04003 보드 | UGPCB

Ultra-Thin High-Frequency PCB: 0.30mm Thick 2-Layer Rogers R04003 제품개요 & 정의

이것 Ultra-Thin High-Frequency PCB ~에서 UGPCB is a double-sided printed circuit board manufactured using Rogers R04003 고주파 라미네이트. Engineered for electronic devices with stringent demands on size, 무게, and RF performance, this board excels in radio frequency (RF), microwave communication, and high-speed digital applications. Its core advantage lies in the combination of an extremely thin profile (0.30mm) 그리고 superior dielectric properties, making it a critical component for device miniaturization and enhanced performance.

기술 사양 & 분류

• 분류: High-Frequency/Microwave PCB, Ultra-Thin PCB

• 레이어: 2 레이어 (양면 PCB)

• 보드 두께: 0.30 mm

• 기본 재료: Rogers R04003 Laminate (0.2mm core, built up to final thickness)

• 구리 무게 (완성된): 1온스 / 1온스 (대략. 35μm per side)

• 표면 마감: 무전해 니켈 침지 금 (동의하다), 2μ”

• 치수: 124.45 mm x 39.69 mm

재료 & 성능 특성

• 라미네이트: 로저스 RO4003C laminate is used, featuring a stable dielectric constant (Dk ~3.0) and a very low dissipation factor (Df). This is essential for 고주파 회로 보드 to minimize signal loss and ensure signal integrity.

• 구리 포일: Standard 1oz (35μm) electro-deposited copper, offering excellent conductivity and current-carrying capacity.

• 표면 마감: 동의하다 (2μ”) provides a flat, 납땜 가능, and oxidation-resistant surface. The thin gold layer is particularly suitable for RF and microwave PCBs, minimizing signal attenuation due to the skin effect at high frequencies.

구조, 설계 & Manufacturing Key Points

1. 구조: Standard 2-layer board structure with plated through-holes (PTH) 층간 연결을 위해.

2. 중요한 설계 고려 사항:

   • 임피던스 제어: 정밀한 controlled impedance PCB design is crucial. Trace width/spacing must be carefully calculated based on the Dk of RO4003 and the 0.30mm dielectric thickness to achieve target impedance values (예를 들어, 50오).

   • 열 관리: The thin profile offers a short path for heat dissipation. Layout of high-power components must be planned accordingly.

   • Mechanical Handling: The 0.30mm thickness offers flexibility but requires careful handling and support during assembly to prevent bending or damage.

3. Production Process Flow:
   Material Preparation → Inner Layer Imaging → Lamination (RO4003 core with prepreg) → Drilling → Desmear & Electroless Copper Deposition → Outer Layer Imaging & Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing / Profiling to 124.45x39.69mm → Electrical Testing (Flying Probe) → Final Inspection & Packaging

작동 방식 & 주요 특징

에이 고주파 PCB acts as a “highway” for signal transmission, ensuring minimal loss, 왜곡, and delay. 그만큼 Rogers RO4003 material 그리고 precision impedance-controlled design are fundamental to this performance.

주요 제품 기능:

• Excellent High-Frequency Performance: The low-loss characteristics of RO4003 laminate enhance RF circuit efficiency and 신호 무결성.

• Extremely Thin and Lightweight: The 0.30mm thin core PCB profile saves critical space and aids in product lightweighting.

• 높은 신뢰성 & 납땜 가능성: The ENIG finish ensures long-term shelf life, excellent solder joint reliability, and a flat surface for fine-pitch components.

• 정밀가공: Fabricated to exact dimensions (124.45×39.69mm) for reliable integration into compact assemblies.

기본 응용 프로그램 & 사용 사례

이것 ultra-thin Rogers PCB is ideal for:

• RFID Modules: Antenna and 회로 보드 in compact readers.

• Satellite Communication & GPS Devices: Miniaturized receiver modules.

• Automotive Radar Sensors: Antenna boards for 77GHz radar systems.

• 고급 테스트 & 측정 장비: Probes and signal acquisition boards.

• Portable Communication Devices & uavs: RF front-end modules where size and weight are critical.

Why Choose UGPCB for Your Ultra-Thin High-Frequency PCB?

Succeeding in competitive RF and high-speed markets requires a PCB partner with deep expertise. UGPCB provides a complete solution, ~에서 고주파 PCB 설계 지원하다 에게 high-reliability manufacturing compliant with IPC standards. Every 0.30mm thin PCB we produce undergoes rigorous impedance testing and quality checks, guaranteeing performance in real-world applications.

For your microwave antenna board 또는 high-speed transmission module, trust UGPCB to deliver superior 신호 무결성 and power efficiency. 우리는 전문적으로 RF circuit board fabrication 그리고 microwave PCB manufacturing.

Contact us today for a quote on your high-frequency PCB project.