F4BME-1/2: Advanced Microwave PCB Laminate Overview
F4BME-1/2 is a high-performance microwave circuit board laminate crafted by laminating varnished glass cloth with Teflon (PTFE) 수지, following stringent scientific formulations and technology processes. This product offers significant enhancements over the F4BM series in terms of electrical performance and passive intermodulation indicators.
기술 사양
모습 & 규정 준수
- 만난다: National and Military Standards for microwave PCB laminates.
사용 가능한 유형
- F4BME217, F4BME220, F4BME245, F4BME255, F4BME265, F4BME275, F4BME285, F4BME295, F4BME300, F4BME320, F4BME338.
치수 & 맞춤화
- Standard sizes range from 300x250mm to 1500x1000mm.
- Custom sizes: 요청시 제공됩니다.
두께 & 용인
- Ranges from 0.25mm to 12.0mm, inclusive of copper thickness.
- Tolerances vary from ±0.025mm to ±0.20mm based on thickness.
기계적 특성
- Warp: Dependent on thickness, max warp varies from 0.010mm to 0.050mm.
- Cutting/Punching Strength: No burrs for <1mm thick boards; delamination-free punching holes spaced min 0.55mm for <1mm, 1.10mm for >1mm thick boards.
- 껍질 힘: Under normal conditions ≥16N/cm; after environmental stress testing, ≥12N/cm.
Chemical Resistance
- Suitable for standard PCB etching methods without altering dielectric properties.
- Requires sodium or plasma treatment for plating through holes.
- Hot Air Level temperature must not exceed 253°C and cannot be repeated.
- 밀도: 2.1-2.35 g/cm³.
- 수분 흡수: ≤0.08% after 24hrs in distilled water at 20±2°C.
- Operating Temperature Range: -50°C to +260°C.
- 열전도율: 0.3-0.5 w/mk.
- 열 팽창 계수 (CTE): Varies with dielectric constant and temperature range.
- Shrinkage Factor: ≤0.0002% in boiling water for 2hrs.
- 표면 & 부피 저항성: High under both normal and controlled humidity/temperature conditions.
- 유전 상수 & 소산 인자: Detailed values provided for various frequencies and types.
- PIMD (Passive Intermodulation Distortion): -158 dBc @ 2.5GHz.
For further details or inquiries about F4BME-1/2, click here.