F4BT-1/2: A Micro Dispersed Ceramic PTFE Composite
Introduction to F4BT-1/2
F4BT-1/2 is a micro dispersed ceramic PTFE composite featuring woven fiberglass reinforcement. 이 제품, developed through scientific formulation and strict technological processes, surpasses traditional PTFE copper clad laminates with its higher dielectric constant, catering to the design and manufacturing requirements of circuit miniaturization. Its enhanced performance is attributed to the incorporation of ceramic powder.
Thermal Expansion and Heat Dissipation
F4BT-1/2 boasts a low Z-axis coefficient of thermal expansion, ensuring excellent reliability for plated through-holes. 추가적으로, its high thermal conductivity facilitates efficient heat dissipation in electronic devices.
Technical Specifications of F4BT-1/2
외관과 유형
The appearance of F4BT-1/2 meets the specifications required by National and Military Standards for microwave PCB baseplates. Available types include F4BT294 and F4BT600, each designed to cater to specific application needs.
유전 상수 및 치수
- 유전 상수: The material offers a dielectric constant of 2.94 for F4BT294 and 6.0 for F4BT600, suitable for various high-frequency applications.
- 치수: Standard dimensions are 500600 MM과 430430 mm, with custom sizes available upon request.
두께 및 공차
- 두께 옵션: Ranges from 0.25 mm to 4.0 mm, accommodating diverse design requirements.
- 용인: ±0.02 mm to ±0.07 mm depending on thickness, ensuring precision in manufacturing.
기계적 강도
- Warp: Maximum warp values vary with thickness, demonstrating excellent dimensional stability.
- 절단/펀칭: Ensures clean cuts without burrs, with minimum space between punching holes ranging from 0.55 mm to 1.10 mm, preventing delamination.
- 껍질 힘: Maintains robust adhesion, with normal state peel strength ≥17 N/cm and post-thermal stress peel strength ≥14 N/cm.
화학 및 전기 특성
- Chemical Property: Suitable for chemical etching without altering dielectric properties; capable of through-hole plating with a Hot Air Level temperature limit of 263°C.
- Electrical Property: Exhibits high density, 낮은 수분 흡수, wide operating temperature range, favorable thermal conductivity, CTE, 표면저항, 체적 저항률, pin resistance, and high dielectric breakdown voltage.
This comprehensive overview highlights the superior characteristics of F4BT-1/2, making it an ideal choice for advanced electronic applications demanding high performance and reliability.