Any Layer HDI PCB: The Most Complex Design Structure

Overview

Any Layer HDI PCB is the most complex HDI PCB design structure, offering unparalleled connectivity and performance.

High-Density Interconnect Layers

All Layers as HDI

In this structure, all layers are high-density interconnect layers, allowing for free interconnection of conductors on any layer of the PCB.

Copper-Filled Stacked Microvia Structure

The copper-filled stacked microvia structure facilitates this interconnectivity, providing a reliable and efficient means of connecting various layers.

Applications

Highly Complex Devices

This structure is ideal for highly complex, high pin-count devices such as CPU and GPU chips used in handheld and mobile devices.

Excellent Electrical Characteristics

The design yields excellent electrical characteristics, making it suitable for high-performance applications.

Benefits

Reliable Interconnect Solution

The Any Layer HDI PCB structure provides a reliable interconnect solution for complex devices, ensuring stable and efficient performance.

UGPCB Advantage

This structure, featuring UGPCB technology, represents a significant advancement in PCB design and manufacturing.