Professional HDI IC Substrate Manufacturer | 30/70μm Trace | ENEPIG Finish – UGPCB

Product Overview: What is an HDI IC Substrate Board?

An HDI IC Substrate Board is a critical, high-end printed circuit board engineered specifically for semiconductor package interconnection. It acts as the essential interface, providing electrical connectivity, power distribution, and mechanical support between a finely-pitched silicon die and a standard motherboard PCB. UGPCB delivers high-reliability, advanced HDI IC Substrate manufacturing, meeting the stringent demands of applications from consumer electronics to high-performance computing.

This board, built with SI10U material in a 6-layer (2+2+2) construction and a slim profile of 0.6mm, exemplifies state-of-the-art HDI technology. With a 35x35mm unit size, it features a 0.1mm minimum laser via diameter, 30μm minimum trace width / 70μm minimum spacing, and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface finish, making it an ideal solution for packaging high-speed, high-frequency, and highly integrated chips.

In-Depth Analysis: Design, Function, and Applications

Core Definition & Working Principle

The HDI IC Substrate is designed to “fan-out” the dense array of micro-bumps from a semiconductor die, redistributing the connections to a larger pitch compatible with standard PCB assembly processes like BGA (Ball Grid Array) mounting.

The working principle follows this chain: Die → Microbumps → HDI IC Substrate (for signal redistribution & interconnection) → Solder Balls (BGA/CSP) → Mainboard PCB. It is pivotal for signal integrity, power delivery, and thermal management.

Key Design Considerations

1. Stack-up & Impedance Control: The 6-layer (2+2+2) build-up is a classic design for high routing density. Precise impedance calculation (typically 50Ω single-ended or 100Ω differential) is crucial for signal integrity.

2. Micro-via Reliability: 0.1mm (100μm) laser-drilled micro-vias are key for interconnect density. Via shape, copper plating, and fill process must be optimized for thermal cycle reliability.

3. Fine-Line Fabrication: 30μm trace width and 70μm spacing are core metrics of process capability, directly impacting I/O density and electrical performance.

4. Thermal & Mechanical Management: The selection of SI10U material considers its Coefficient of Thermal Expansion (CTE) matching with silicon to minimize thermal stress and enhance product longevity.

Primary Materials & Performance Characteristics

• Core Material: SI10U. A high-performance laminate offering low dielectric constant (Dk), low dissipation factor (Df), high glass transition temperature (Tg), and excellent dimensional stability, ideal for high-speed, high-frequency applications.

• Solder Mask: PSR-4000 AUS308. A high-resolution, high-reliability Liquid Photoimageable Solder Mask (LPSM) that provides precise coverage, excellent insulation, and chemical resistance.

• Surface Finish: ENEPIG. This finish deposits sequential layers of Nickel, Palladium, and Gold. Nickel acts as a diffusion barrier, Palladium prevents nickel corrosion, and the thin gold layer offers superior solderability and wire-bonding capability, perfect for fine-pitch pads.

• Performance Summary: High density, high speed, high reliability, excellent thermal management, and superior signal integrity.

Classification & Application Scenarios

HDI IC Substrates are categorized by technology and application:

• By Technology: With core (e.g., this 6L build-up) or coreless types.

• By Application:

  1. Advanced Processors: CPU, GPU, AI accelerator chips requiring maximum routing density and signal speed.

  2. Mobile & RF: Smartphone Application Processors (AP) and RF modules, where miniaturization and thin profiles (0.6mm) are critical.

  3. Memory: Interface substrates for High Bandwidth Memory (HBM).

  4. Networking & Automotive: High-speed switch chips and ADAS domain controllers.

UGPCB’s Manufacturing Process & Quality Assurance

UGPCB’s production integrates leading-edge processes compliant with IPC standards:

1. Laser Drilling: UV laser systems create precise 0.1mm micro-vias.

2. Plating & Via Fill: Advanced pulse plating ensures complete via filling for reliable interconnects.

3. Advanced Imaging: High-end exposure systems and high-resolution dry film achieve 30/70μm line definition.

4. Lamination: Precise alignment and pressing of multiple core layers and prepreg (PP).

5. Surface Finishing: Application of the ENEPIG coating for optimal solderability.

6. Comprehensive Testing: Utilizes AOI (Automated Optical Inspection), flying probe testing, and impedance testing to guarantee compliance.

Our one-stop PCBA service capability extends from IC substrate manufacturing to subsequent SMT assembly and testing, offering a complete packaging solution.

Why Choose UGPCB for Your HDI IC Substrate?

1. Advanced Process Capability: Proven expertise in 30/70μm trace/space and 0.1mm micro-via technology.

2. Materials Expertise: In-depth knowledge of advanced materials like SI10U to recommend optimal solutions.

3. Uncompromising Quality: Stringent, automotive-grade quality control throughout the entire process.

4. One-Stop Solution: We are more than a PCB fabricator; we are your PCBA partner, offering design support, manufacturing, and assembly.

5. Expert Support: Dedicated engineering team provides DFM (Design for Manufacturability) analysis and technical consultation.

Get Your Custom Solution Now

Whether you are developing the next HPC platform, 5G infrastructure, or ADAS system, UGPCB’s professional HDI IC Substrate manufacturing and PCBA assembly services are your foundation for success.

Contact us today for a free technical consultation and quote! Let our experts help you enhance product performance through optimized IC substrate design and reliable PCB fabrication processes.