Material
Advanced Composite Material
The RO4350B + IT180 Mix Laminate High Frequency PCB Board is made from a mix of Rogers RO4350B and IT180. Rogers RO4350B is a high-performance microwave/RF laminate known for its low loss, high stability, and excellent processability. IT180 is a reinforced glass fiber material that provides additional mechanical strength and thermal stability. This mixed material enables the PCB board to exhibit excellent performance and reliability in high-frequency applications.
Performance
Outstanding Electrical Performance
- Dielectric Constant (DK): 3.48
- A stable dielectric constant helps reduce signal loss and delay, ensuring the quality of high-frequency signal transmission.
- Impedance Control: 50 Ohms
- A standard impedance value ensures matched and stable signal transmission, reducing reflections and interference.
- Dielectric Thickness: 0.508 mm
- An appropriate dielectric thickness further enhances the high-frequency signal transmission performance.
Excellent Thermal Management
- Thermal Conductivity: 0.69w/m.k
- High thermal conductivity material aids in heat dissipation, protecting circuits from overheating damage and ensuring stability in high-power applications.
Advanced Production Process
- Number of Layers: 6 Layers
- A six-layer design accommodates complex circuit layouts and wiring requirements.
- Blind Hole: 1L~2L HDI
- High-Density Interconnect (HDI) blind hole technology enables a more compact circuit layout and higher signal transmission efficiency.
- Copper Thickness: 1 Ounce
- Adequate copper thickness provides good current carrying capacity and signal transmission performance.
- Surface Treatment: Immersion Gold
- Immersion gold surface treatment offers excellent electrical conductivity and corrosion resistance, enhancing circuit reliability and stability.
Production Process
Raw Material Preparation
- Prepare Rogers RO4350B and IT180 mixed materials, as well as auxiliary materials such as copper foil and solder mask ink.
h3: Laminating and Pressing
- Laminate and press the mixed materials according to the designed number of layers to form a multilayer board structure.
Drilling and Plating
- Drill holes using laser or mechanical methods to create the required circuit channels.
- Plate the drilled holes with copper to enhance the reliability of circuit connections.
Circuit Patterning and Solder Masking
- Create circuit patterns on the multilayer board and apply a solder mask to protect the circuits from external environmental factors.
Surface Treatment and Testing
- Apply immersion gold surface treatment to improve the electrical conductivity and corrosion resistance of the circuits.
- Conduct rigorous electrical performance and reliability testing on the finished products to ensure quality.
Application Scenarios
Wireless Communication Devices
- Suitable for various wireless communication devices, such as mobile phones, base stations, and routers, providing stable high-frequency signal transmission.
Radar Systems
- In radar systems, the RO4350B + IT180 Mix Laminate PCB can withstand high power and high-speed signals, ensuring the accuracy and reliability of the radar system.
High-Speed Data Transmission Equipment
- Suitable for high-speed data transmission equipment, such as data center switches and storage devices, providing high-speed and stable signal transmission channels.