TG150 PCB Circuit Board Introduction: Meeting the Thermal Challenge in Modern Electronics
In high-speed communications, automotive, aerospace, and advanced industrial controls, electronic devices face increasingly harsh operating environments. Elevated temperatures can cause standard PCB substrates (e.g., standard FR-4) to reach their glass transition, leading to softening, deformation, and critical performance loss, jeopardizing system reliability. Selecting a high-Tg printed circuit board is essential for ensuring long-term stability in these demanding applications.
1. Product Overview: What is a TG150 PCB?
A TG150 PCB is a printed circuit board fabricated using a laminate material with a glass transition temperature (Tg) of 150°C. The Tg is a crucial metric for a PCB substrate’s thermal endurance. Compared to common TG130 PCB laminates, TG150 material maintains superior physical rigidity and stable electrical properties under high temperatures. UGPCB’s 4-layer TG150 circuit board combines this high-performance material with an Immersion Gold (ENIG) surface finish and supports 0.08mm fine-line circuitry and 0.2mm micro-drilling, making it a high-reliability multilayer PCB solution for advanced applications.
2. Core Material and Enhanced Performance of TG150 PCB
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Base Material: A high-performance epoxy or modified FR-4 formulation, specially engineered to consistently achieve a Tg of 150°C or higher.
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Key Performance Advantages (vs. TG130 PCBs):
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Exceptional Thermal Stability: The increase from 130°C to 150°C Tg significantly enhances the board’s resistance to deformation at high temperatures, improving its ability to withstand high-temperature assembly processes like lead-free soldering.
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Superior Moisture and Chemical Resistance: A denser molecular structure reduces moisture absorption in humid environments, minimizing losses in insulation resistance (IR) and signal integrity, while offering better resistance to chemical exposure.
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Improved Mechanical Strength and Dimensional Stability: High Tg PCBs exhibit lower Z-axis expansion coefficients and stronger bond strength during thermal cycling, reducing risks like via cracking and delamination.
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Stable Electrical Characteristics: Dielectric constant (Dk) and dissipation factor (Df) remain more stable at elevated operating temperatures, ensuring higher signal integrity for high-frequency PCBs.
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3. Structure and Design Specifications of Our TG150 PCB
PCB Stack-up
This product is a standard 4-layer PCB board. A typical stack-up is Signal Layer – Ground Plane – Power Plane – Signal Layer, providing a complete return path for high-speed signals and effective EMI control.
Key Design Capabilities & Specifications
Minimum Trace Width/Space: 0.08mm / 0.1mm. This represents advanced fine-line PCB manufacturing capability, essential for routing high-density ICs (e.g., BGA packages).
Drill Diameter: 0.2mm. Supports micro-via drilling, facilitating higher density interconnects and saving board space.
Surface Finish: Immersion Gold (ENIG). Provides a flat surface, excellent solderability, and long shelf life, ideal for fine-pitch components (e.g., QFP, BGA).
4. Manufacturing Process and Quality Control
UGPCB’s TG150 PCB manufacturing process strictly adheres to international standards like IPC-6012 (Qualification and Performance Specification for Rigid PCBs). The process includes:
Material Preparation → Inner Layer Imaging → Etching → Lamination → Drilling (0.2mm) → Desmear & Plating → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing → Electrical Testing → Final Inspection.
At each stage, we employ advanced equipment (e.g., LDI imaging, AOI inspection) and rigorous reliability testing (e.g., thermal stress, ionic contamination) to ensure the quality of every high-Tg circuit board.
5. Product Classification and Typical Applications
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Technical Classification:
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By Tg: Mid-High Tg PCB (Tg ≥ 150°C).
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By Layer Count: Multilayer PCB (4-Layer Board).
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By Technology: Precision PCB (HDI-ready capability).
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By Finish: ENIG PCB, Fine-Line PCB.
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Ideal Application Scenarios:
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Automotive Electronics: Engine Control Units (ECUs), infotainment systems, power management modules – requiring tolerance under-hood temperatures.
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Telecommunications Equipment: 5G base station PAs, optical modules, network switches – where high power generates sustained heat.
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Industrial Controls: Servo drives, PLCs, industrial PCs – for reliable operation in hot factory environments.
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Power Electronics: High-power switch-mode power supplies (SMPS), inverters – where power components generate significant heat.
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Aerospace & Defense: Electronic systems with extreme demands for reliability and environmental resilience.
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6. Why Choose UGPCB for Your TG150 PCBs?
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Certified Materials: We use verified, traceable TG150 PCB laminates from reputable suppliers.
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Precision Manufacturing: Our expertise in multilayer PCB fabrication and ENIG processing ensures high yield for 0.08mm fine-line designs.
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Guaranteed Specifications: All technical parameters (Tg 150°C, 0.2mm drills) are rigorously validated against datasheets.
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End-to-End Support: We provide full technical support from PCB design review and impedance control to rapid prototyping and volume production.
7. Take Action: Secure Your Design with a Robust Foundation
Don’t let thermal limitations hinder your product innovation. Choosing UGPCB’s high-reliability TG150 PCB means investing in exceptional stability, durability, and performance.
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