Introduction to the 58-Layer ATE Load PCB
The 58-layer ATE (Automated Test Equipment) Load PCB is a high-density, multicamada placa de circuito impresso engineered for precision signal transmission and durability in demanding testing environments. Designed with advanced parameters, it ensures optimal performance in high-frequency and high-power applications.
Key Specifications
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Camadas: 58
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Dimensões: 17.2″ x 17.8″
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Grossura: 230 mil
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Material: FR4 Tg185
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Tamanho mínimo do orifício: 5 mil
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BGA Spacing: 0.8 milímetros
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Proporção de aspecto: 23.4:1
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Drill-to-Copper Distance: 7 mil
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POFV (Plated Over Filled Via): Sim
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Back Drilling: No
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Acabamento superficial: ENEG+TG+ENIG
Design and Structural Features
Critical Design Considerations
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High Layer Count: The 58-layer structure supports complex routing for high-density interconnects (IDH), minimizing signal loss.
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Seleção de material: FR4 Tg185 ensures thermal stability (up to 185°C glass transition temperature), critical for high-power applications.
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Precision Drilling: UM 5 mil minimum hole size and 23.4:1 aspect ratio enable reliable microvia formation, essential for BGA (0.8 passo mm) component integration.
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Integridade do sinal: Controlled impedance and 7 mil drill-to-copper spacing reduce crosstalk and electromagnetic interference (EMI).
Unique Structural Advantages
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POFV Technology: Enhances via reliability by filling and plating vias, improving thermal and mechanical performance.
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ENEG+TG+ENIG Surface Finish: Combines electroless nickel electroless gold (ENEG) and immersion gold (CONCORDAR) for superior corrosion resistance and solderability.
Performance and Applications
Operational Principles
The PCB facilitates precise electrical signal routing across 58 camadas, leveraging FR4 Tg185’s dielectric properties to maintain signal integrity. POFV ensures robust connections in high-stress environments, while the optimized aspect ratio supports stable high-frequency operations.
Key Performance Metrics
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Thermal Resistance: Withstands temperatures up to 185°C.
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Mechanical Stability: High Tg material prevents delamination under thermal cycling.
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Signal Speed: Low-loss dielectric material minimizes latency.
Primary Use Cases
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Automated Test Equipment (COMEU): Used in semiconductor testing systems for validating ICs and microprocessors.
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Aerospace and Defense: Deployed in radar and communication systems requiring high reliability.
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Telecomunicações: Supports 5G infrastructure and high-speed data transmission.
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Eletrônica Automotiva: Integrated into ADAS (Advanced Driver Assistance Systems) and EV power modules.
Production Process and Quality Assurance
Fluxo de trabalho de fabricação
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Preparação de Materiais: FR4 Tg185 laminates are cut to 17.2″ x 17.8″ dimensions.
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Perfuração a laser: Creates 5 mil microvias with a 23.4:1 proporção de aspecto.
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Plating and Filling: POFV technology applies copper plating to filled vias.
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Layer Stackup: 58 layers are aligned and bonded under high pressure.
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Acabamento superficial: ENEG+TG+ENIG coating is applied for corrosion protection.
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Teste: Electrical continuity, impedância, and thermal stress tests are performed.
Quality Control Standards
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Classe IPC-6012 3: Ensures reliability for harsh environments.
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Controle de impedância: ±10% tolerance maintained.
Summary of Advantages
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High-Density Design: Supports complex circuitry in compact spaces.
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Resiliência térmica: FR4 Tg185 ensures stability under extreme conditions.
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Precision Engineering: 5 mil holes and 0.8mm BGA spacing enable miniaturized component integration.
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Versatile Applications: From semiconductor testing to 5G infrastructure.
This PCB combines cutting-edge design, rigorous manufacturing standards, and robust materials to meet the needs of mission-critical industries.