What is a 6L 1+N+1 HDI PCB?
A 6L 1+N+1 HDI PCB stands for a six-layer High Density Interconnect (IDH) placa de circuito impresso, featuring one core layer flanked by N signal layers and another core layer. This configuration allows for high density interconnections, making it suitable for advanced electronic applications. The “1+N+1” designation refers to the arrangement of the core layers and signal layers.
Requisitos de design
The design of a 6L 1+N+1 HDI PCB requires careful consideration of several factors:
- Empilhamento de camada: Proper alignment of the core and signal layers to ensure optimal electrical performance.
- Traço e espaço: Minimal trace width and space of 3mil/3mil to accommodate fine features.
- Hole Sizes: Mechanical holes as small as 0.2mm and laser holes down to 0.1mm for precise component placement.
- Espessura do Cobre: Varied copper thickness with inner layers at 1OZ and outer layers at 0.5OZ to balance conductivity and flexibility.
Como funciona?
The functionality of a 6L 1+N+1 PCB HDI relies on its multilayer structure and the use of high-density interconnects. Each layer serves a specific purpose:
- Core Layers: Provide structural integrity and act as the foundation for signal layers.
- Signal Layers: Carry electrical signals between components.
- Tratamento da superfície de ouro de imersão: Ensures excellent solderability and long-term reliability by preventing oxidation.
Aplicações e Classificações
Esses PCB are primarily used in intelligent digital products where compact size and high performance are crucial. They can be classified based on their complexity and the number of layers, with the 6L 1+N+1 configuration being highly versatile for various applications.
Materiais e Desempenho
Constructed from FR-4 (ITQ), these PCBs offer excellent thermal stability and mechanical strength. The green/white color scheme aids in visual inspection and troubleshooting. The finished thickness of 1.0mm provides a robust yet flexible board suitable for intricate designs.
Estrutura e recursos
The unique structure of a 6L 1+N+1 HDI PCB includes:
- Seis camadas: One core layer, N signal layers, and another core layer.
- High Density Interconnects: Allow for complex routing and minimal space usage.
- Superfície Dourada de Imersão: Enhances conductivity and protects against corrosion.
Processo de Produção
The manufacturing process involves several sophisticated steps:
- Preparação de Materiais: Selecting high-quality FR-4 substrate and copper foils.
- Empilhamento de camada: Arranging the layers in a precise order to achieve the desired “1+N+1” configuration.
- União: Usando calor e pressão para unir as camadas.
- Gravura: Aplicação de ácido para remover o excesso de cobre, deixando apenas os caminhos condutores desejados.
- Revestimento: Adding a thin layer of metal to improve conductivity and solderability.
- Tratamento de superfície: Applying immersion gold to protect against oxidation and enhance solderability.
- Controle de qualidade: Realização de inspeções e testes completos para garantir que cada placa atenda aos rigorosos padrões de qualidade.
Casos de uso e cenários
6L 1+N+1 HDI PCBs are ideal for use in intelligent digital products where miniaturization and high performance are critical. Aplicações comuns incluem:
- Smartphones: Permitindo designs mais finos sem comprometer a funcionalidade ou o desempenho.
- Comprimidos: Fornecendo conectividade confiável para transferência e processamento de dados em alta velocidade.
- Dispositivos vestíveis: Oferece suporte a projetos compactos enquanto mantém desempenho e durabilidade robustos.