Engineer Superior RF Performance: The UGPCB RO4350B Ceramic Hybrid High Frequency PCB Solution
In the era of 5G, radar, e comunicações satélites, the performance of your PCB de alta frequência is critical to system success. Selecting a PCB laminate that offers exceptional RF characteristics, confiabilidade, and cost-effectiveness is paramount for every RF engineer and procurement specialist. UGPCB, uma liderança Fabricante de placas de circuito impresso e PCBA service provider, presents its advanced Ceramic Hybrid High Frequency PCB utilizing Rogers RO4350B and FR4 lamination technology. We deliver a complete solution from Projeto de PCB para Montagem de placas de circuito impresso (PCBA).
1. Visão geral do produto & Definição
O RO4350B HYBRID HYBRID PCB de alta frequência is a high-performance placa de circuito impresso engineered for radio frequency (RF) and microwave applications. It innovatively combines Rogers RO4350B ceramic-filled hydrocarbon laminate with standard FR4 epoxy glass material through multi-layer PCB lamination technology. This “hybrid” approach allows critical RF circuits (por exemplo, antenas, filtros, amplifiers) to be routed on the low-loss RO4350B areas, while cost-sensitive digital control and power management circuits reside on the FR4 areas, achieving an optimal balance between performance and cost.
2. Material central & Construção
-
Materiais: This product features a Rogers RO4350B + FR4 mixed laminate construção. RO4350B is a ceramic-filled thermoset polymer material known for its stable dielectric constant (Dk) e baixo fator de dissipação (Df). FR4 is a standard epoxy glass weave laminate, valued for its economy and versatility.
-
Construção: This model is a standard 4-camada PCB. Tipicamente, the outer layers (L1 & L4), which host RF circuitry, use RO4350B dielectric, bonded to the inner FR4 core using prepreg. This structure ensures signal integrity in RF paths while reducing overall material cost.
-
Key Specifications & Conformidade:
-
Constante dielétrica (Dk): 3.48 @ 10 GHz. This stable value minimizes phase shift and impedance variance, crucial para controlled impedance PCB design.
-
Condutividade térmica: 0.69 W/m · k. Superior to standard FR4, aiding heat dissipation from active RF components and improving long-term reliability.
-
Classificação inflamabilidade: UL 94 V-0. Meets the highest standard for flame retardancy.
-
Acabamento superficial: Imersão Ouro (CONCORDAR). Provides a flat, solderable surface, excellent oxidation resistance, and long shelf life, ideal para high-frequency SMT assembly e PCBA processes.
-
Espessura Acabada: 1.0 milímetros
-
Copper Weight: 1 onças (35 μm)
-
3. Critical Design Considerations & Operational Principle
-
Controle de impedância: RF transmission lines (por exemplo, microstrip, stripline) require precise impedance control (typically 50Ω or 75Ω). Designers must calculate trace width using the stable Dk of RO4350B (3.48) and dielectric thickness (0.762milímetros) to ensure minimal signal reflection.
-
Hybrid Zone Transition: Signal transitions between RO4350B and FR4 areas cause impedance discontinuities due to Dk mismatch. Optimal Layout da placa de circuito impresso requires mitigation techniques like tapered traces, matching networks, or optimized via transitions.
-
Gerenciamento térmico: Despite its improved thermal conductivity (0.69 W/m · k), high-power RF designs may still require thermal vias, heatsinks, or metal-core substrates for effective PCB thermal management.
-
Operational Principle: Esse placa de circuito acts as the physical substrate and transmission medium for RF signals. Its core function is to utilize the low-loss, low-dispersion properties of RO4350B to transmit electromagnetic signals with high efficiency and minimal distortion across target frequency bands (from hundreds of MHz to tens of GHz), while integrating control logic via the hybrid structure for complete system functionality.
4. Key Features & Advantages
-
Exceptional High-Frequency Performance: Low loss and stable Dk/Df ensure superior integridade do sinal.
-
Optimized System Cost: Hybrid construction significantly reduces the use of premium material, offering a cost-effective PCB solution.
-
Alta confiabilidade & Durabilidade: V-0 flammability rating and robust thermal performance ensure stability in demanding environments.
-
Projeto & Assembly Friendly: Compatible with standard Fabricação de PCB e SMT assembly processes, streamlining PCBA production.
5. Processo de fabricação
UGPCB adheres to a strict controle de qualidade regime for high frequency PCB manufacturing:
Preparação de material & Inner Layer Imaging → Hybrid Lamination & Registration → Precision Drilling & Plating → Pattern Imaging & Etching → Impedance Control Testing → Solder Mask & Acabamento superficial (CONCORDAR) → Electrical Testing & Final Audit → Shipping. Each step is specially controlled for high-frequency characteristics.
6. Aplicações primárias & Casos de uso
This product is ideal for applications demanding high frequency and signal fidelity:
-
Wireless Communications: 5G base station antennas/RF modules, microwave backhaul, satellite communication terminals.
-
Eletrônica Automotiva: Millimeter-wave radar (77 GHz), V2X telematics modules.
-
Aeroespacial & Defesa: Radar systems, electronic warfare (EW) equipamento, guidance systems.
-
Test & Measurement: Core RF circuit boards in network analyzers, spectrum analyzers, and high-frequency signal sources.
Partner with UGPCB for Your High-Frequency Projects
Whether you are an engineer engaged in RF PCB layout or a sourcing professional seeking a reliable circuit board supplier, UGPCB’s RO4350B Hybrid High Frequency PCB is your ideal solution. We provide not only high-quality Fabricação de PCB but also full-spectrum support from PCB design review to end-to-end PCBA services, accelerating your time-to-market.
Contate-nos today for a free design consultation and a competitive quote. Power your next RF innovation with UGPCB.