UGPCB

Custom 2-Layer Rigid FR-4 PCB | CONCORDAR + Hard Gold Finish | Alta confiabilidade & Baixo custo

Custom 2-Layer Rigid FR-4 PCB: CONCORDAR + Hard Gold Finish for High Reliability & Cost-Effectiveness

Discover the industry “gold standard” for balanced performance and affordability. UGPCB’s 2-layer rigid FR-4 PCB, featuring TG150 high-temperature material and a dual ENIG + Hard Gold surface finish, delivers superior reliability for demanding applications.

EU. Why Choose 2-Layer Rigid FR-4 PCB?

In the era of electronic miniaturization, the demand for alta confiabilidade, baixo custo, e compact design has made the 2-layer rigid PCB the “golden choice” for engineers and procurement managers. Unlike single-sided boards limited by routing space or expensive multi-layer boards, the 2-layer design strikes the perfect balance between performance and price.

UGPCB enhances this baseline by utilizing FR-4 TG150 heat-resistant material and a specialized Ouro de imersão em níquel eletrolítico (CONCORDAR) + Hard Gold tratamento de superfície. This combination significantly improves durability and solderability, making it suitable for a wider range of harsh environments.

2-layer FR4 PCBs with immersion gold and gold-plated surface finish

II. Product Core Specifications (IPC-A-600 Compliant)

The following parameters ensure full compatibility with industry standards and optimal manufacturability (Dfm).

Parâmetro Specification Details
Contagem de camadas 2 Camadas (Double-sided: Principal & Bottom routing, FR-4 core substrate)
Espessura da placa 1.60milímetros (Standard industry thickness, balancing mechanical strength & espaço)
Material base FR-4 TG150 (Epoxy resin glass cloth; Glass Transition Temp: 150°C; Excellent heat resistance)
Acabamento superficial ENIG 2u” + Hard Gold 30u” (Dual protection: Chemical immersion gold + Electroplated gold for wear resistance)
Copper Weight 1onças (35μm) (Standard thickness, sufficient for most current carrying requirements)
Máscara de solda Verde (Default; Preto, Azul, Vermelho, White available upon request)
Silkscreen White Epoxy Ink (Component identifiers, Logo)
Min. Drill Hole 0.3milímetros (12mil)
Min. Line Width/Space 3mil / 3mil

III. Product Definition: What is a 2-Layer Rigid PCB?

1. Definição

UM PCB rígido is a non-flexible printed circuit board composed of a substrate, copper foil traces, solder mask, and silkscreen. It establishes fixed electrical connections through drilling and etching processes.
UM 2-Layer Rigid PCB (Double-Sided Board) is the foundational type of rigid PCB, featuring copper traces on both the top and bottom sides of the substrate. Electrical connections between layers are achieved via Plated Through Holes (Vias).

2. Classification by Layer Count

UGPCB’s 2-layer offering represents the highest cost-performance ratio in the rigid PCB category.

4. Design Guidelines for High Reliability

With limited routing space on 2-layer boards, aderência a IPC-2221 design standards is crucial for signal integrity and thermal management.

1. Power and Ground Layout

2. Signal Routing

3. Via Design

V. Princípio Operacional: How PCBs Work

The core function of a PCB is to connect electronic components (chips, resistores, capacitores) via copper traces to achieve predetermined electrical functions.

VI. Material & Desempenho: Why FR-4 TG150?

1. Material base: FR-4 TG150

FR-4 (Flame Retardant 4) is the industry standard for epoxy resin glass cloth substrates.

2. Acabamento superficial: ENIG 2u” + Hard Gold 30u”

Surface finish acts as the PCB’s “protective shield.” UGPCB combines two finishes for maximum benefit:

Comparison: This combination outperforms HASL (Nivelamento de solda com ar quente) and standard OSP (Conservador de solda orgânica) in high-reliability applications like controle industrial e eletrônica automotiva.

VII. Estrutura & Características: Panelization Advantages

This PCB utilizes Matrix Panelization, where multiple individual PCBs (por exemplo, 10×10 array) are arranged on a larger production panel connected by Webs (Tabs).

Advantages of Panelization:

Additional Product Features:

VIII. Processo de fabricação: Strict IPC-A-600 & IPC-6012 Control

UGPCB’s workflow adheres strictly to IPC-A-600 (Quality Standard) e IPC-6012 (Performance Specification for Rigid PCBs).

  1. Corte: Shearing FR-4 laminate to required dimensions (por exemplo, 18″x24″).
  2. Perfuração: CNC drilling for component holes (0.3milímetros) and vias (0.2milímetros).
  3. Electroless Copper: Chemical deposition of 1-2μm copper for interlayer connectivity.
  4. Image Transfer: Applying photoresist, exposing, and developing to transfer circuit patterns.
  5. Gravura: Removing excess copper to form final traces.
  6. Máscara de solda: Coating with green solder mask ink, exposing, and curing to protect circuits.
  7. Acabamento superficial: CONCORDAR (2u”) + Hard Gold (30u”) plating for solderability.
  8. Silkscreen: Printing component designators (R1, C2) and logos.
  9. Electrical Test: Flying Probe Test to check continuity and isolation (no shorts/opens).
  10. Routing/V-Cut: Separating individual PCBs from the panel and chamfering edges.
  11. Inspeção Final: AOI (Inspeção óptica automatizada) for scratches, oxidation, dimensional accuracy, and reliability tests (Thermal Shock, Vibration).

IX. Cenários de aplicação

Thanks to its high reliability and cost-effectiveness, this PCB is widely used in:

  1. Eletrônicos de consumo
    • Mobile/Tablets: Charging boards, Módulos de potência, keypads.
    • Wearables: Smartwatch motherboards, fitness tracker sensors.
    • Home Appliances: AC control boards, washing machine displays.
  2. Controle industrial
    • PLC Modules: I/O boards, communication modules.
    • Sensores: Signal processing for temp/pressure sensors.
    • Robotics: Servo motor control, encoder interfaces.
  3. Eletrônica Automotiva
    • Infotainment: Navigation mainboards, audio controls.
    • Safety Systems: Reverse radar control, TPMS (Tire Pressure Monitoring).
    • EVs: Charging pile control, Bms (Sistema de gerenciamento de bateria) auxiliary boards.
  4. Dispositivos médicos
    • Portable Diagnostics: Glucose meters, sphygmomanometers.
    • Monitoring: ECG, pulse oximeter signal boards.
    • Surgical: Control boards for minimally invasive instruments.
  5. Other Fields
    • Telecom: Router/Switch interface cards.
    • Aeroespacial: Drone flight controllers, satellite comms.
    • Casa inteligente: Smart locks, smart lighting controls.

X. Por que escolher UGPCB?

As a professional PCB manufacturer with over 10 years of experience, UGPCB serves 1000+ clients globally.

XI. Request a Quote: Accelerate Your Time-to-Market

If you need 2-layer rigid FR-4 PCBs or have questions about ENIG+Hard Gold ou panelization, contact UGPCB today!

Summary

UGPCB's 2-Layer Rigid FR-4 PCB, apresentando FR-4 TG150 base material e CONCORDAR + Hard Gold surface finish, is the premier choice for applications demanding alta confiabilidade e baixo custo. Whether you are a consumer electronics manufacturer or an automotive engineer, we provide customized solutions that meet IPC-A-600 standards.

Contact us now to start your project and seize market opportunities!

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