UGPCB

High-Performance LED Ceramic PCB & Ceramic Substrate PCB | 0.635mm AlN, 1OZ Copper

Model Overview

The LED Ceramic PCB and Ceramic Substrate PCB are advanced componentes eletrônicos designed for high-performance applications. Esses PCB feature a robust construction and superior thermal management capabilities, making them ideal for various demanding applications.

LED Ceramic PCB

Composição de materiais

The core of these PCBs is composed of a ceramic substrato, which offers exceptional thermal conductivity and mechanical stability. The ceramic material used is primarily aluminum nitride (AlN), known for its high thermal conductivity and low electrical conductivity, making it an excellent choice for high-power electronics.

Configuração de camada

These PCBs are constructed as 2-layer ceramic PCBs, which means they have two layers of circuitry embedded within the ceramic substrate. This configuration allows for more complex circuit designs while maintaining the benefits of ceramic’s thermal properties.

Color and Appearance

The color of the LED Ceramic PCB and Ceramic Substrate PCB is white, giving them a sleek and professional appearance. The white ceramic surface also aids in reflecting light, which can be beneficial in certain applications.

Thickness Specifications

The thickness of the aluminum nitride ceramic substrate is precisely controlled at 0.635mm, ensuring consistent performance and reliability. This thickness provides a good balance between mechanical strength and thermal conductivity.

Espessura do Cobre

The copper thickness on these PCBs is 1OZ (35um), which is sufficient for carrying high currents while maintaining good electrical conductivity. The copper layer is etched to form the desired circuit patterns.

Tratamento de superfície

The surface of the copper circuitry is treated with immersion gold, which provides excellent corrosion resistance and electrical conductivity. The gold thickness is >=3U”, ensuring reliable connections and long-term durability.

Abertura Mínima

The minimum aperture size on these PCBs is 0.8mm, allowing for the use of small components and tight packaging layouts. This feature is crucial for high-density electronics applications.

Características de desempenho

The LED Ceramic PCB and Ceramic Substrate PCB offer several performance characteristics that make them superior to traditional PCBs:

Processo de Produção

The production of LED Ceramic PCBs and Ceramic Substrate PCBs involves several steps:

  1. Preparation of Ceramic Substrate: The ceramic material is processed to form the desired substrate shape and thickness.
  2. Circuit Design and Etching: The circuit patterns are designed and etched onto the copper layer using photolithography and etching techniques.
  3. Assembly and Lamination: The etched copper layers are assembled with the ceramic substrate, and the assembly is laminated to form a cohesive structure.
  4. Drilling and Plating: Holes are drilled for component placement, and the surfaces are plated with immersion gold to provide corrosion resistance and electrical conductivity.
  5. Final Inspection and Testing: The finished PCBs are inspected for quality and tested to ensure they meet performance specifications.

Cenários de aplicação

The LED Ceramic PCB and Ceramic Substrate PCB are ideal for a wide range of high-power applications, incluindo:

Para concluir, the LED Ceramic PCB and Ceramic Substrate PCB offer exceptional performance and reliability, making them ideal for high-power and high-performance electronics applications.

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