UGPCB

22 Layer High-Performance Megtron-6 PCB | 2.0mm Thick with ENIG Finish | De alta velocidade & RF Solution – UGPCB

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In the era of data-intensive and ultra-high-speed signal transmission, a Printed Circuit Board (PCB) is far more than a simple component carrier; it is the critical architecture defining system performance limits. For demanding applications like high-speed networking, artificial intelligence computing, and advanced test instrumentation, standard FR-4 materials fall short. UGPCB addresses this need with our advanced 22-layer multilayer PCB built on Panasonic Megtron-6 R-5775G laminate, engineered to meet challenges of high frequency, low loss, and complex interconnectivity.

1.UGPCB’s 22-Layer Megtron-6 High-Speed PCB Visão geral do produto & Definição

This product is a 22-layer High-Density Interconnect (IDH) rigid printed circuit board. Its core advantage lies in the use of a premium-grade, de alta velocidade, low-loss laminate—Panasonic’s Megtron-6 R-5775G. Combined with a robust 2.0mm board thickness and precision lamination technology, it creates a high-end interconnection platform capable of handling high-frequency signals above 10GHz with exceptional signal integrity and power integrity.

UGPCB's 22-Layer Megtron-6 High-Speed PCB

2. Critical Design Considerations

Designing such an advanced placa de circuito multicamada requires focus on:

  1. Controle de impedância: Precise calculation and control of single-ended and differential impedance to ensure consistent signal propagation within the Megtron-6 dielectric.

  2. Otimização de empilhamento: The intelligent arrangement of the 22 conductive layers (22Camadas)—including signal, poder, and ground planes—is crucial for maximizing shielding and minimizing crosstalk in this high-layer count PCB.

  3. Gerenciamento térmico: The 2.0mm board thickness and multilayer structure aid heat distribution. No entanto, strategic use of thermal vias remains essential for high-power IC areas.

  4. High-Frequency Routing: Employing microstrip or stripline configurations, avoiding acute angle turns, and leveraging the low-profile copper foil of Megtron-6 to reduce losses from skin effect.

3. How It Works & Estrutura

UM PCB’s primary function is to provide electrical connectivity and signal transmission between components via etched copper traces on an insulating substrate. Esse 22-layer PCB board structure resembles a precise “multi-layer sandwich”:

4. Material central: Panasonic Megtron-6 R-5775G

This is the heart of this advanced PCB material. Megtron-6 is Panasonic’s next-generation, de alta velocidade, low-loss circuit board material series.

Item Método de teste Doença Unidade MEGTRON6
R-5775(N)
Pano de vidro de baixo Dk		 MEGTRON6
R-5775
Pano de vidro normal
Temperatura de transição vítrea.(Tg) DSC UM °C 185 185
Temperatura de decomposição térmica.(Td) TGA UM °C 410 410
Eixo x CTE a1 IPC-TM-650 2.4.24 UM ppm/°C 14-16 14-16
Eixo y CTE 14-16 14-16
Eixo z CTE a1 IPC-TM-650 2.4.24 UM 45 45
a2 260 260
T288(com cobre) IPC-TM-650 2.4.24.1 UM min >120 >120
Constante dielétrica(Dk) 12GHz Tipo balanceado
ressonador de disco circular		 C-24/23/50 － 3.4 3.6
Fator de dissipação(Df) 0.004 0.004
Absorção de água IPC-TM-650 2.6.2.1 D-24/23 % 0.14 0.14
Módulo de flexão Preencher JIS C 6481 UM GPa 18 19
Força de casca* 1onças(35μm) IPC-TM-650 2.4.8 UM kN/m 0.8 0.8

5. Key Features & Desempenho

  1. Ultra-Low Signal Loss: Megtron-6 material ensures maximum efficiency in high-frequency signal transmission with minimal attenuation.

  2. Excellent Thermal & Dimensional Stability: High Tg value combined with a 2.0mm thick board suits high-temperature, high-power application environments.

  3. High-Density Interconnect Capability: The 22-layer design provides abundant routing channels, supporting complex interconnections for large-scale chips (por exemplo, FPGAs, GPUs).

  4. Precise Impedance & Layer-to-Layer Registration: Mature manufacturing processes guarantee consistent electrical performance across the PCB multicamadas.

  5. Superior Solderability & União: The 2u” ENIG finish ensures highly reliable solder joints and is suitable for precision SMT assembly.

6. Scientific Classification & Aplicações primárias

7. Production Flow Overview

UGPCB adheres to a stringent PCB manufacturing process to ensure quality:
Material Cutting → Inner Layer Imaging → Lamination (22-Alinhamento de camada & União) → Drilling → Hole Metallization → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing / Scoring → Electrical Testing → Final Inspection (AOL)

Every step is supported by high-precision equipment, with multiple quality control checkpoints integrated into the PCB fabrication process, ensuring this 22-layer Megtron-6 PCB meets the highest standards from design to delivery.

Don’t let base materials limit your innovative designs.
Whether you’re developing next-gen communication hardware or tackling frontier computing challenges, UGPCB's 22-layer high-performance PCB solution is your reliable hardware foundation. We provide not just a product, but full-spectrum support from PCB design consultation to rapid prototyping and volume production.

Click to request a quote and receive expert technical documentation. Power your project with a superior core!

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