6-Layer HDI Rigid Flex PCB with Blind and Buried Vias

Composição de materiais

Rigid Insulating Materials

• FR4
• DuPont Polyimide (with good flexural properties)

Rigid Area Thickness

• 0.6milímetros (provides good strength to the board)

Laminate Sources

• All laminates sourced from authorized dealers under XPCB inspection

Acabamento superficial

ENIG Finish

• Advantages:
  • Excellent surface flatness
  • Good oxidation resistance
  • Suitability for movable contacts