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Doosan DS-7409 HG (KQ) IC Package substrate material

Introdução

UGPCB DS-7409 HG (KQ) IC Package substrate material is Low Df, Halogen & phosphorous free. Applications include Flip chip BoC & RF module.

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DS-7409 Variants

DS-7409
DS-7409S (N)

Material Properties of DS-7409

Tg (Temperatura de transição vítrea)

Property: Tg
Unidade: grau Celsius
Test Condition: DSC
Typical Value: 170
Test Method: IPC-TM-650.2.4.25c

TMA (Thermomechanical Analysis)

Property: TMA
Unidade: grau Celsius
Test Condition: N/A
Typical Value: 165
Test Method: IPC-TM-650.2.4.24c

CTE Z-axis (Coeficiente de Expansão Térmica)

Property: CTE Z-axis
Unidade: ppm/degree Celsius
Test Condition: Ambient to Tg
Typical Value: 41
Test Method: IPC-TM-650.2.4.41

Z-axis Expansion

Property: Z-axis Expansion
Unidade: %
Test Condition: 50 grau Celsius para 260 grau Celsius
Typical Value: 3.3
Test Method: IPC-TM-650.2.4.41

Temperatura de decomposição (5% wt loss)

Property: Temperatura de decomposição
Unidade: grau Celsius
Test Condition: TGA
Typical Value: 295
Test Method: IPC-TM-650.2.4.40

T-260 & T-288 (Thermomechanical Analysis)

Property: T-260
Unidade: min
Test Condition: TMA
Typical Value: 7
Test Method: IPC-TM-650.2.4.24.1

Property: T-288
Unidade: min
Test Condition: TMA
Typical Value:
Test Method: IPC-TM-650.2.4.24.1

Constante dielétrica & Dissipation Factor

Property: Constante dielétrica (Resin content 50%)
Unidade: C-24/23/50(1GHz)
Test Condition: N/A
Typical Value: 4.2
Test Method: IPC-TM-650.2.5.5.9

Property: Dissipation Factor (Resin content 50%)
Unidade: C-24/23/50(1GHz)
Test Condition: N/A
Typical Value: 0.015
Test Method: IPC-TM-650.2.5.5.9

Força de casca

Property: Força de casca (Standard profile 1oz)
Unidade: N/mm
Test Condition: Condition A
Typical Value: 2.0
Test Method: IPC-TM-650.2.4.8

Water Absorption

Property: Water Absorption
Unidade: %
Test Condition: E-24/50+D-24/23
Typical Value: 0.12
Test Method: IPC-TM-650.2.6.2.1

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