Reliable 2-Layer Industrial Rigid PCB Manufacturer | FR-4 TG150, 1.6mm, Lead-Free HASL

Introducere

UGPCB‘s 2-Layer Rigid PCB is a fundamental, high-reliability placă de circuit solution engineered for demanding applications. Built on a robust FR-4 TG150 substrate with a standard 1.60mm thickness, it delivers an optimal balance of performance, durability, and cost-effectiveness. The board features a reliable lead-free Hot Air Solder Leveling (Sângera) surface finish, a protective black solder mask, and clear white silkscreen legends for identification.

Product Overview & Clasificare

This double-sided PCB serves as a core interconnect platform for a wide range of electronics. It is scientifically classified as a Rigid PCB (by construction), o 2-Layer or Double-Sided Board (by layer count), and is rated for Industrial Grade (Clasa IPC 2) applications based on its FR-4 TG150 material specification, making it suitable for extended lifecycle products.

Proiecta & Operational Principle

Successful implementation requires attention to electrical and thermal design rules. Adequate trace width for current capacity (De ex., 1A per 10mil trace width for 1oz copper) and strategic placement of thermal reliefs are critical. The PCB functions as a miniature city: cel FR-4 substrate is the foundation, copper traces are the roads carrying signals and power, plated through-holes are interlayer connectors, cel Masca de lipit is a protective coating, and the mătase provides navigation.

Construction, Materiale & Performanţă

The symmetrical stack-up ensures mechanical stability. Key materials define its capabilities:

• Miez: FR-4 TG150 Laminate (Tg ≥ 150°C) provides high thermal endurance and stability.

• Cupru: Standard 1oz (35µm) electrodeposited copper foil.

• Finishes: Black LPI solder mask and white epoxy silkscreen.

• Surface Finish: Lead-Free HASL for excellent solderability.

This combination yields high heat resistance, superior electrical insulation, strong mechanical rigidity (from the 1.60mm thickness), and excellent solder joint reliability.

Manufacturing Process & Controlul calității

Our production follows Standardele IPC, encompassing CAM engineering, precision drilling, electroplating, LPI solder mask application, legend printing, lead-free HASL surface finishing, and electrical testing. Every board undergoes 100% electrical testing and Inspecție optică automată (Aoi) to meet stringent quality criteria.

Aplicații

This versatile PCB is ideal for:

• Industrial Control Systems: PLCs, motor drives, sensor interfaces.

• Power Electronics: Switch-mode power supplies (SMPS), UPS boards, LED drivers.

• Auto & Electronica de consum: Auxiliary control modules, audio amplifiers, appliance controllers.

Key Specifications Table