UGPCB

22 Layer High-Performance Megtron-6 PCB | 2.0mm Thick with ENIG Finish | High-Speed & RF Solution – UGPCB

Ultimin

In the era of data-intensive and ultra-high-speed signal transmission, a Printed Circuit Board (PCB) is far more than a simple component carrier; it is the critical architecture defining system performance limits. For demanding applications like high-speed networking, artificial intelligence computing, and advanced test instrumentation, standard FR-4 materials fall short. UGPCB addresses this need with our advanced 22-layer multilayer PCB built on Panasonic Megtron-6 R-5775G laminate, engineered to meet challenges of high frequency, low loss, and complex interconnectivity.

1.UGPCB’s 22-Layer Megtron-6 High-Speed PCB Product Overview & Definiţie

This product is a 22-layer High-Density Interconnect (HDI) rigid printed circuit board. Its core advantage lies in the use of a premium-grade, de mare viteză, low-loss laminate—Panasonic’s Megtron-6 R-5775G. Combined with a robust 2.0mm board thickness and precision lamination technology, it creates a high-end interconnection platform capable of handling high-frequency signals above 10GHz with exceptional signal integrity and power integrity.

UGPCB's 22-Layer Megtron-6 High-Speed PCB

2. Critical Design Considerations

Designing such an advanced placă de circuite multistrat requires focus on:

  1. Controlul impedanței: Precise calculation and control of single-ended and differential impedance to ensure consistent signal propagation within the Megtron-6 dielectric.

  2. Optimizarea stivuirii: The intelligent arrangement of the 22 conductive layers (22Straturi)—including signal, power, and ground planes—is crucial for maximizing shielding and minimizing crosstalk in this high-layer count PCB.

  3. Managementul termic: The 2.0mm board thickness and multilayer structure aid heat distribution. Cu toate acestea, strategic use of thermal vias remains essential for high-power IC areas.

  4. High-Frequency Routing: Employing microstrip or stripline configurations, avoiding acute angle turns, and leveraging the low-profile copper foil of Megtron-6 to reduce losses from skin effect.

3. How It Works & Structura

O PCB’s primary function is to provide electrical connectivity and signal transmission between components via etched copper traces on an insulating substrate. Acest 22-layer PCB board structure resembles a precise “multi-layer sandwich”:

4. Core Material: Panasonic Megtron-6 R-5775G

This is the heart of this advanced PCB material. Megtron-6 is Panasonic’s next-generation, de mare viteză, low-loss circuit board material series.

Articol Metoda de testare Stare Unitate Megtron6
R-5775(N)
Pânză de sticlă DK joasă		 Megtron6
R-5775
Pânză de sticlă normală
Temp de tranziție din sticlă.(TG) DSC O ° C. 185 185
Tempora de descompunere termică.(TD) TGA O ° C. 410 410
Axa X CTE A1 IPC-TM-650 2.4.24 O PPM/° C. 14-16 14-16
CTE-axa y 14-16 14-16
CTE Z-axa A1 IPC-TM-650 2.4.24 O 45 45
A2 260 260
T288(cu cupru) IPC-TM-650 2.4.24.1 O min >120 >120
Constanta dielectrică(DK) 12GHz Tip echilibrat
Resonator circular pe disc		 C-24/23/50 － 3.4 3.6
Factor de disipare(Df) 0.004 0.004
Absorbția apei IPC-TM-650 2.6.2.1 D-24/23 % 0.14 0.14
Modul de flexiune Umple Jis c 6481 O GPA 18 19
Coajă de rezistență* 1Oz(35μm) IPC-TM-650 2.4.8 O KN/m 0.8 0.8

5. Caracteristici cheie & Performanţă

  1. Ultra-Low Signal Loss: Megtron-6 material ensures maximum efficiency in high-frequency signal transmission with minimal attenuation.

  2. Excellent Thermal & Dimensional Stability: High Tg value combined with a 2.0mm thick board suits high-temperature, high-power application environments.

  3. High-Density Interconnect Capability: The 22-layer design provides abundant routing channels, supporting complex interconnections for large-scale chips (De ex., FPGAs, GPUs).

  4. Precise Impedance & Layer-to-Layer Registration: Mature manufacturing processes guarantee consistent electrical performance across the PCB multistrat.

  5. Superior Solderability & Bonding: The 2u” ENIG finish ensures highly reliable solder joints and is suitable for precision SMT assembly.

6. Scientific Classification & Aplicații primare

7. Production Flow Overview

UGPCB adheres to a stringent PCB manufacturing process to ensure quality:
Material Cutting → Inner Layer Imaging → Lamination (22-Layer Alignment & Bonding) → Drilling → Hole Metallization → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing / Scoring → Electrical Testing → Final Inspection (AOL)

Every step is supported by high-precision equipment, with multiple quality control checkpoints integrated into the PCB fabrication process, ensuring this 22-layer Megtron-6 PCB meets the highest standards from design to delivery.

Don’t let base materials limit your innovative designs.
Whether you’re developing next-gen communication hardware or tackling frontier computing challenges, UGPCB 22-layer high-performance PCB solution is your reliable hardware foundation. We provide not just a product, but full-spectrum support from PCB design consultation to rapid prototyping and volume production.

Click to request a quote and receive expert technical documentation. Power your project with a superior core!

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