Precision Circuit Imaging & Etching Technology
UGPCB Factory demonstrates exceptional process control in circuit patterning and etching. For standard PCB production, we consistently achieve:
- Лазерная прямая визуализация (LDI) replacing traditional photolithography masks, enabling digital file-based exposure with ±5μm alignment accuracy
- Alkaline etching process ensuring clean line edges with ±15% line width control (industry-leading tolerance)
- Expertise in handling various copper thicknesses (1oz-6oz) with minimized side-etching
High-Precision Drilling & Hole Metallization
Our drilling capabilities cover:
- Механическое бурение for 0.4mm-3.0mm boards with ±0.025mm hole size tolerance
- Лазерное бурение down to 0.1mm microvias
- Hole metallization достижение >20μm uniform copper plating through advanced chemical deposition and electroplating
- Special processes for 8:1 к 10:1 aspect ratio requirements
Multilayer Lamination & Interlayer Alignment
- Up to 100-layer PCB fabrication using FR-4 Grade A materials
- Precision lamination with ±0.05mm layer-to-layer alignment
- Temperature/pressure/time-controlled processes preventing delamination
- Options for high-Tg materials, high-speed laminates, and heavy copper up to 1000μm
Припаяя маска & Surface Finish Options
- Solder mask colors: Green/Blue/Red/Black with 0.08mm minimum solder bridge
- Surface finishes:
- ХАСЛ (Hot Air Solder Leveling)
- СОГЛАШАТЬСЯ (Electroless Nickel Immersion Gold)
- Immersion Tin/Silver
- ОСП (Органическая припаяя консервант)
Comprehensive QC & Testing Systems
- AOI Inspection: High-resolution defect detection for line/space, подушечки, shorts/opens
- Контроль импеданса: ±10% tolerance for high-speed/RF applications
- Электрические испытания: Летающий зонд & fixture-based continuity verification
- Reliability Testing: Тепловой удар, humidity resistance, flexural testing
Process Capability & Стабильность
- CPK >1.33 (4а) across critical processes, достижение 1.67 (5а) in key areas
- Line width control within ±15% (vs industry 20% стандартный)
- Statistical process control (Спк) ensuring consistent production quality
PCBA One-Stop Services
- SMT Assembly: 01005 component handling with ±0.03mm placement accuracy
- Усовершенствованная упаковка: BGA/Micro BGA/PoP support with X-ray inspection
- DFM Support: Impedance calculation, stack-up design, manufacturability analysis
Промышленные приложения & Контакт
Serving consumer electronics, industrial controls, телекоммуникации, медицинское оборудование, and automotive sectors with tailored PCB solutions. Visit our website for process capability reports and free DFM consultation.