10-Плата платы PCB слоя

Applications Overview

• Preamplifiers
• Satellite Antennas
• GPS Tracking Devices
• SAN Storage
• AC Drives
• GSM Signal Boosters
• Mobile Broadband Routers
• 220V Inverters
• Memory Modules
• Car Dashboards

10-Layer Manufacturing Process

Подготовка материала

• Cut material to size/bake material

Drilling and Inner Layer Patterning

• Inner layer drilling
• Inner layer pattern transfer
• Inner layer circuit inspection
• Etch/stripping
• Etch inspection

Surface Preparation and Laminating

• Browning
• Prepreg preparation
• Layers Pressing
• Cutting copper foil
• Positioning
• Ламинирование

Drilling and Hole Preparation

• Target hole
• Бурение
• Desmear removal
• Погружная медь

Circuit Formation

• Image and text transfer
• Circuit inspection
• Copper and tin plating
• Film removal Etching
• Tin removal
• Etching inspection

Quality Control Tests

• Dielectric inspection test
• Solder mask inspection

Final Assembly and Finishing

• Текст
• Baking pan
• Spray tin, Погружение золота, Immersion tin
• Shape
• V cut

Final Product Inspection and Packaging

• Finished Product Test
• Antioxidant
• Заключительная проверка
• Finished Product Extraction
• Упаковка