Professional Product Overview: The 12-Layer High-Speed, High-Density PCB
In the era of high-speed data transmission and complex system integration, conventional printed circuit boards (печатные платы) fall short of meeting the performance demands of advanced electronics. The 12-layer high-speed, Высокая печатная плата is the engineered solution. Featuring up to 12 precisely aligned conductive layers, it enables intricate interconnections and efficient signal transmission within a compact footprint, serving as the “central nervous system” for high-end networking gear, data center servers, высокопроизводительные вычисления (HPC), and AI hardware.
As an expert Производитель печатных плат и поставщик печатных плат, UGPCB leverages advanced processes to deliver reliable 12-слой печатная плата производство, ensuring your products maintain a competitive performance edge.
In-Depth Parameter Analysis: The Foundation of Performance
The capability of a high-quality многослойная печатная плата is defined by its specifications. Below is an analysis of this product’s core parameters:
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Количество слоев & Stack-up: 12 слои. Этот multilayer PCB design offers superior signal integrity (И), целостность власти (ПИ), and EMC performance compared to boards with fewer layers. It allows for dedicated power and ground planes, providing clear return paths for high-speed signals.
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Толщина доски & Толерантность: 2.4mm ±10%. This robust thickness offers excellent mechanical strength for backplanes and large-form-factor applications, ensuring reliability during mating and installation. The tight tolerance guarantees consistency in assembly.
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Finished Copper Weight: Unique distribution:
1/1/1/1/1/2/2/1/1/1/1/1 oz. This indicates that the inner layers (16 -й & L7) utilize 2oz heavy copper, designed specifically for high-current power delivery. The outer and other signal layers use 1oz copper, optimized for fine-line etching. This hybrid construction is a hallmark of высокая надежность Изготовление печатной платы. -
Critical Process Capabilities:
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Минимальный размер просверленного отверстия: 0.2мм. Supports high-density BGA fan-out, enhancing routing flexibility.
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Minimum Line Width/Space: 0.076мм / 0.09мм (3мил / 3.5мил). Достигает Взаимодействие высокой плотности (ИЧР)-level routing, essential for high-speed signal propagation.
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Поверхностная отделка: ОСП (Органическая припаяя консервант). Compatible with both leaded and lead-free soldering, it protects copper pads from oxidation, offers excellent surface planarity, and is cost-effective—ideal for boards with dense SMT компоненты.
Основные материалы & Key Technologies: Enabling Superior Signal Integrity
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High-Performance Laminate: Utilizes Nanya NY6300S high-speed laminate. Its high glass transition temperature (Тг >150°С) ensures dimensional stability and reliability during high-temperature reflow soldering. Its optimized dielectric constant (Дк) and dissipation factor (Дф) significantly reduce signal loss at high frequencies, forming the material foundation for высокочастотные печатные платы.
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Advanced Copper Foil: Employs РТФ (Reverse Treated Foil) медь. Compared to standard electrodeposited (Редакция) foil, RTF foil features a smoother, low-profile surface on the treated side. This reduces signal loss due to the “skin effect” at high frequencies, critically enhancing the performance of differential signals exceeding 10 Гбит / с.
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Critical Process: Controlled-Depth Drilling (Назад бурение): In 12-layer or higher Многослойные печатные платы, the unused portion (stub) of a through-hole via can cause significant signal reflection, degrading integrity. The back drilling process precisely removes this non-functional via stub, eliminating its negative impact—a key technology for high-speed multilayer PCB производительность.
Производственный поток & Гарантия качества
UGPCB 12-Процесс производства печатной платы. strictly adheres to Стандарты IPC and includes Дизайн для производства (DFM) обзор, inner layer imaging, ламинирование, бурение (including back drilling), покрытие, outer layer imaging, solder mask application, surface finish (ОСП), маршрутизация, electrical testing, and final inspection. Each stage is supported by precision measurement equipment (АОИ, Impedance Testing, Тест летающего зонда), обеспечение каждого монтажная плата delivered meets design specifications and our high-quality standards.
Типичные приложения & Product Classification
This high-performance печатная плата is designed for demanding electrical environments and complex systems, primarily used in:
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High-End Network & Коммуникационное оборудование: Core motherboards for 400G/800G optical modules, high-end routers, and switches.
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Data Center & Облачные вычисления: Server motherboards, accelerator cards, storage backplanes.
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Высокопроизводительные вычисления: Workstation motherboards, GPU computing cards, AI accelerator hardware.
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Advanced Test & Measurement Instruments: Internal boards for instruments processing very high-frequency signals.
Scientific Product Classification:
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По количеству слоев: Многослойная печатная плата (>8 слои)
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By Technology Type: High-Speed/High-Frequency PCB, HDI печатная плата, Тяжелая медная печатная плата (partial)
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По приложению: Telecom Infrastructure PCB, Data Center/Server PCB
Why Choose UGPCB for Your 12-Layer High-Speed PCB?
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Техническая экспертиза: Proven mastery of back drilling и RTF copper foil application to tackle high-speed design challenges.
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Точное производство: Capable of 3/3.5 mil line/space, meeting stringent high-density interconnect requirements.
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Material Integrity: Core use of reputable high-speed laminates like Nanya NY6300S ensures foundational performance.
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Поддержка дизайна: Expert дизайн печатной платы и DFM review services to de-risk your project from the start.
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Consistent Quality: A fully controlled Производство печатных плат and inspection system delivers reliable products you can trust.
Ready to elevate your hardware? Contact UGPCB’s engineers for a free PCB quote и DFM -анализ on your next 12-layer high-speed board project.