УГКПБ

12-Слой согласен PCB | High-Reliability FR-4 TU872SLK Multilayer Circuit Board

Ультинин

Обзор профессионального продукта

The UGPCB 12-Layer Rigid PCB is a high-end многослойная плата engineered for complex signal transmission, межсоединения высокой плотности (ИЧР), and demanding operating environments. Manufactured with high-performance FR-4 TU872SLK laminate and finished with 2-microinch Immersion Gold (СОГЛАШАТЬСЯ), this board is a cornerstone solution for industrial control systems, telecommunications infrastructure, and advanced computing hardware, offering exceptional electrical performance, long-term reliability, and robust signal integrity.

12-Слой согласен PCB

Product Definition & Классификация

This product is classified as a High-Layer Count Rigid Printed Circuit Board. It can be further categorized as:

Критические соображения дизайна

Designing a 12-layer PCB requires meticulous attention to:

  1. Stack-up Design: A rational stack-up sequence (например, alternating signal-ground-signal layers) is paramount for impedance control, crosstalk reduction, and Electromagnetic Compatibility (ЭМС). A proper 12-layer stack-up provides excellent power integrity and signal shielding.

  2. Контроль импеданса: For high-speed digital signals (например, Ддр, PCIE) or RF lines, precise calculation and control of trace characteristic impedance (например, 50Ω single-ended, 90Ω/100Ω differential) are essential. We utilize advanced EDA tools and precise process controls to ensure consistency.

  3. Власть & Ground Plane Management: Solid ground planes and optimized power segmentation ensure low-noise power delivery and clear return paths, which are critical for system stability.

  4. Тепловое управление: The 1.6mm board thickness and the thermal properties of FR-4 must align with component power dissipation. High-power areas may require thermal vias or integration with external cooling solutions.

Как это работает

A PCB is a passive platform that provides mechanical support, electrical interconnection, and signal transmission pathways for electronic components. This 12-layer PCB facilitates a complete working system by connecting chips, резисторы, конденсаторы, и т. д., through a complex network of etched copper traces. The multilayer architecture allows traces to cross on different layers without interference, significantly increasing circuit complexity and integration density. The ENIG surface finish guarantees reliable solder joints and long-term contact stability.

*(Image Suggestion: Detailed cross-sectional diagram of a 12-layer PCB stack-up)*
*Alt Text: Cross-sectional view of a 12-layer PCB stack-up showing alternating copper layers and dielectric, illustrating complex internal structure for high-density interconnect.*

Строительство & Материалы

Ключевые особенности & Производительность

  1. Высокая надежность: TU872SLK high-Tg material and ENIG finish ensure resistance to high temperatures, коррозия, and suitability for long-term operation in harsh environments.

  2. Отличная целостность сигнала: Rigorous stack-up design and impedance control guarantee high-speed signal quality and lower bit error rates.

  3. Strong Load-Bearing & Thermal Capacity: The 1.6mm thickness offers robust mechanical strength and substantial thermal load management.

  4. Precision Solder Platform: The flat 2μ” ENIG surface is ideal for fine-pitch компоненты (например, BGAS), resulting in strong, reliable solder joints with low defect rates.

  5. Взаимодействие высокой плотности (ИЧР): Twelve routing layers support complex, dense circuit designs, enabling reduced product footprint.

Manufacturing Process Flow

Inner Layer Imaging → AOI Inspection → Lamination & Pressing → Drilling → Electroless Copper Deposition → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing & Profiling → Electrical Testing → Final Quality Control (FQC)

Приложения & Варианты использования

This PCB is widely used in stability and performance-critical fields:

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