Introduction to the 4L 1+N+1 HDI Wifi Module Product Overview
The 4L 1+N+1 HDI Wifi Module is a cutting-edge electronic module designed for high-density interconnect applications. This module utilizes advanced technology to ensure reliable and efficient performance in various electronic devices.
Определение
A High-Density Interconnect (ИЧР) module refers to a печатная плата (печатная плата) that features higher wiring density than traditional PCBs, enabling more compact and complex designs. The “4L 1+N+1” designation indicates a four-layer structure with specific layer configurations.
Требования к дизайну
The 4L 1+N+1 HDI Wifi Module is meticulously designed to meet stringent requirements:
- Слои: Four layers with a specific stack-up of 1+N+1.
- Материал: Made from high-quality Материал ФР-4.
- Толщина: The overall finished thickness of the module is 1.0mm.
- Толщина меди: Features inner copper layers at 1OZ and outer layers at 0.5OZ.
- Обработка поверхности: Incorporates immersion gold and Organic Solderability Preservatives (ОСП) for enhanced durability and solderability.
- Минимальная трассировка/пространство: Supports minimal trace and space widths of 4mil.
- Мин отверстие: Accommodates mechanical holes as small as 0.2mm and laser holes as fine as 0.1mm.
Принцип работы
The 4L 1+N+1 HDI Wifi Module operates by utilizing high-frequency signals transmitted via its integrated antenna to connect to Wi-Fi networks. The module’s HDI design allows for efficient signal routing and minimal interference, ensuring robust and stable connectivity.
Приложения
This versatile module is suitable for a wide range of applications including but not limited to:
- Промышленное оборудование: Automation systems, control panels.
- Communication Devices: Маршрутизаторы, access points, set-top boxes.
Классификация
The module falls under the category of high-density interconnect printed circuit boards, specifically tailored for applications requiring compact size and high performance.
Материальная композиция
Constructed from FR-4, a flame-retardant glass-reinforced epoxy laminate, the module ensures excellent thermal and electrical properties. The copper layers provide conductive pathways essential for signal transmission.
Характеристики производительности
- Целостность сигнала: Maintains high signal integrity due to minimized trace lengths and optimized layer stack-up.
- Тепловое управление: Efficient heat dissipation thanks to the material properties of FR-4 and the design architecture.
- Долговечность: Enhanced durability with surface treatments like immersion gold and OSP, protecting against oxidation and improving solder joint reliability.
Структурные особенности
- Quadrilateral Foramen: A specialized process involving the creation of square-shaped holes, allowing for intricate component placement and routing.
- Слой стек: The unique 1+N+1 layer arrangement optimizes space utilization and signal integrity.
Производственный процесс
The manufacturing process involves several key steps:
- Подготовка материала: Cutting and preparing the FR-4 substrate.
- Медная ламинирование: Applying copper layers on both sides and inner layers as per design.
- Офорт: Removing excess copper to form the desired circuit patterns.
- Выравнивание слоя: Stacking and aligning the layers accurately.
- Bonding: Using heat and pressure to bond the layers together.
- Обработка поверхности: Applying immersion gold and OSP finishes.
- Контроль качества: Conducting thorough inspections and tests to ensure product quality
Сценарии использования
Бытовая электроника
In smartphones and tablets, the 4L 1+N+1 HDI Wifi Module ensures reliable wireless connectivity while maintaining a slim profile.
Промышленное оборудование
For automation systems, the module provides dependable communication links in harsh industrial environments.
Communication Devices
In routers and access points, the module enhances network performance with its superior signal handling capabilities.
By adhering to these design and production standards, the 4L 1+N+1 HDI Wifi Module delivers exceptional performance and reliability, making it an ideal choice for modern electronic applications.