0.22Производитель ультратонких 6-слойных печатных плат HDI Rigid-Flex, мм | УГКПБ

UGPCB’s 0.22mm Ultra-Thin 6-Layer HDI Rigid-Flex PCB Обзор продукта

In the pursuit of extreme device miniaturization and high reliability, traditional rigid Печатные платы (печатные платы) are often insufficient. UGPCB combines advanced Взаимодействие высокой плотности (ИЧР) и Жесткий флекс technologies to present our flagship product: а 0.22mm Ultra-Thin 6-Layer HDI Rigid-Flex PCB. This board is a pinnacle of Производство печатных плат и high-performance interconnect solution engineered for wearable technology, advanced medical instruments, аэрокосмический, and premium consumer electronics. It seamlessly merges the stable support of rigid boards with the dynamic bending capability of flexible circuits, enabling complex electrical connections within minimal space.

Product Definition & Scientific Classification

Это high-layer-count PCB utilizing ИЧР любого уровня и rigid-flex construction. It can be accurately classified per industry standards:

• По структуре: Жестко-гибкая печатная плата – Laminates rigid and flexible circuit layers into a single unit.

• By Technology Level: Advanced HDI PCB – Employs laser drilling, filled vias, and microvias (<0.15мм) for superior routing density.

• По количеству слоев: 6-Layer Circuit Board (comprising both rigid and flexible layers).

• Материалом: Specialty High-Performance Material PCB – Core build-up uses Panasonic RF-777 composite.

Design Essentials & Принцип работы

Design Essentials: The key to a successful rigid-flex board design lies in the rigid-to-flex transition zone. Precise calculation of bend radius, stress relief, and routing in flex areas is critical to prevent cracking during dynamic flexing. Одновременно, HDI blind and buried via design must coordinate with the stack-up structure to optimize signal integrity (И) and power integrity (ПИ).
Принцип работы: The Структура печатной платы integrates rigid sections (for component mounting and mechanical support) with flexible sections (for 3D interconnection and movement) с помощью multilayer lamination. Electrical signals travel through laser-drilled microvias и via filling plating technologies inherent to Доски HDI, achieving the shortest and most reliable paths between layers, which minimizes signal loss and crosstalk.

Основные материалы & Superior Performance

• Основной материал: We utilize the industry-premium Panasonic RF-777 35/50 составной материал. Renowned for its exceptional стабильность размеров, superior high-frequency performance, and excellent теплостойкость, it is the ideal choice for manufacturing high-reliability rigid-flex circuit boards.

• Поверхностная отделка: The board features a 2-micron Electroless Nickel Immersion Gold (СОГЛАШАТЬСЯ) finish. This provides a flat surface, excellent solderability, and long-term oxidation resistance for PCB pads, making it perfect for mounting компоненты с мелким шагом like BGAs.

• Key Performance Attributes:

  • Ultra-Thin 0.22mm Profile: Enables maximum compression of internal device space.

  • Высокая надежность: Undergoes rigorous PCB reliability testing, capable of withstanding millions of dynamic bend cycles.

  • Excellent Signal Transmission: HDI design and premium materials ensure low-loss transmission for high-speed signals.

  • High-Density Assembly: Provides an ideal platform for SMT Assembly, supporting miniaturized component layout.

Структура & Ключевые особенности

• PCB Structure: A typical 6-layer construction involving 2-4 layers of rigid FR-4 laminated with polyimide flexible cores. The штабелирование is meticulously engineered to balance stiffness and flexibility.

• Особенности продукта:

  1. 3D Interconnection Freedom: Eliminates spatial constraints, enabling 3D assembly and reducing connectors and cables.

  2. Легкий & Miniaturization: The extreme thinness directly reduces product weight and size.

  3. Enhanced System Reliability: Removes connection point failures, improving overall stability in vibrating or high-shock environments.

  4. Simplified Assembly Process: Как custom Сборка печатной платы, it streamlines final product assembly, lowering labor costs.

Прецизионный производственный процесс

UGPCB adheres to international quality standards like IPC-6013 (for flexible circuits) и IPC-2221/2223. Наш PCB fabrication process is precise and rigorous:

1. Лазерное сверление: Creates micron-level blind and buried vias in flexible and core layers.

2. Hole Metallization & Покрытие: Vias are made conductive through chemical deposition and plating, с via filling for planarization.

3. Pattern Transfer & Офорт: Forms the intricate circuit board traces.

4. Выравнивание слоя & Ламинирование: Rigid layers, препарат, and flexible layers are precisely aligned and bonded under high heat and pressure. This is the core step in rigid-flex PCB manufacturing.

5. Поверхностная отделка: Application of the СОГЛАШАТЬСЯ coating to protect pads and ensure solderability.

6. Строгое тестирование: Includes Тестирование летающих зондов, Автоматическая оптическая проверка (АОИ), and reliability testing to ensure every board’s quality.

Wide-Ranging Application Scenarios

Этот advanced PCB is the core skeleton for innovative products in:

• Носимые технологии: Умные часы, AR/VR glasses, health monitors, requiring comfort and constant flexing.

• Advanced Medical Electronics: Endoscopic capsules, hearing aids, portable monitors, demanding high reliability and miniaturization.

• Аэрокосмическая промышленность & Оборона: Satellite components, UAV flight control systems, needing extreme environment endurance and low weight.

• Precision Consumer Electronics: High-end smartphone camera modules, folding phone hinge areas, ultra-thin laptops.

• Промышленный & Автомобильная электроника: Compact sensors, robotic joint interconnection modules.

Contact a UGPCB PCB Technical Expert today for your 0.22mm Ultra-Thin HDI Rigid-Flex PCB solution! Make your product stand out in the competition for miniaturization and high performance.