Engineer Superior RF Performance: The UGPCB RO4350B Ceramic Hybrid High Frequency PCB Solution
In the era of 5G, радар, и спутниковая связь, the performance of your Высокочастотная печатная плата is critical to system success. Selecting a PCB laminate that offers exceptional RF characteristics, надежность, and cost-effectiveness is paramount for every RF engineer and procurement specialist. УГКПБ, Ведущий Производитель печатных плат и PCBA service provider, presents its advanced Ceramic Hybrid High Frequency PCB utilizing Rogers RO4350B and FR4 lamination technology. We deliver a complete solution from дизайн печатной платы к Сборка печатной платы (печатная плата).
1. Обзор продукта & Определение
The RO4350B Керамическая гибридная высокочастотная печатная плата is a high-performance печатная плата engineered for radio frequency (РФ) and microwave applications. It innovatively combines Rogers RO4350B ceramic-filled hydrocarbon laminate with standard FR4 epoxy glass material through Многослойная печатная плата lamination technology. This “hybrid” approach allows critical RF circuits (например, антенны, фильтры, amplifiers) to be routed on the low-loss RO4350B areas, while cost-sensitive digital control and power management circuits reside on the FR4 areas, achieving an optimal balance between performance and cost.
2. Основной материал & Строительство
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Материалы: This product features a Роджерс RO4350B + FR4 mixed laminate строительство. RO4350B is a ceramic-filled thermoset polymer material known for its stable dielectric constant (Дк) и низкий коэффициент рассеяния (Дф). FR4 is a standard epoxy glass weave laminate, valued for its economy and versatility.
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Строительство: This model is a standard 4-слой печатной платы. Обычно, the outer layers (L1 & L4), which host RF circuitry, use RO4350B dielectric, bonded to the inner FR4 core using prepreg. This structure ensures signal integrity in RF paths while reducing overall material cost.
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Ключевые спецификации & Согласие:
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Диэлектрическая проницаемость (Дк): 3.48 @ 10 ГГц. This stable value minimizes phase shift and impedance variance, решающее значение для controlled impedance PCB design.
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Теплопроводность: 0.69 W/m · k. Superior to standard FR4, aiding heat dissipation from active RF components and improving long-term reliability.
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Рейтинг воспламеняемости: UL 94 В-0. Meets the highest standard for flame retardancy.
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Поверхностная отделка: Погружение Золото (СОГЛАШАТЬСЯ). Provides a flat, solderable surface, excellent oxidation resistance, and long shelf life, Идеально подходит для high-frequency SMT assembly и PCBA processes.
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Готовая толщина: 1.0 мм
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Медный вес: 1 унция (35 мкм)
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3. Критические соображения дизайна & Operational Principle
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Контроль импеданса: RF transmission lines (например, microstrip, stripline) require precise impedance control (typically 50Ω or 75Ω). Designers must calculate trace width using the stable Dk of RO4350B (3.48) and dielectric thickness (0.762мм) to ensure minimal signal reflection.
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Hybrid Zone Transition: Signal transitions between RO4350B and FR4 areas cause impedance discontinuities due to Dk mismatch. Оптимальный Разводка печатной платы requires mitigation techniques like tapered traces, matching networks, or optimized via transitions.
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Тепловое управление: Despite its improved thermal conductivity (0.69 W/m · k), high-power RF designs may still require thermal vias, heatsinks, or metal-core substrates for effective PCB thermal management.
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Operational Principle: Этот монтажная плата acts as the physical substrate and transmission medium for RF signals. Its core function is to utilize the low-loss, low-dispersion properties of RO4350B to transmit electromagnetic signals with high efficiency and minimal distortion across target frequency bands (from hundreds of MHz to tens of GHz), while integrating control logic via the hybrid structure for complete system functionality.
4. Ключевые особенности & Преимущества
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Exceptional High-Frequency Performance: Low loss and stable Dk/Df ensure superior целостность сигнала.
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Optimized System Cost: Hybrid construction significantly reduces the use of premium material, offering a cost-effective PCB solution.
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Высокая надежность & Долговечность: В-0 flammability rating and robust thermal performance ensure stability in demanding environments.
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Дизайн & Assembly Friendly: Compatible with standard Изготовление печатной платы и SMT assembly processes, streamlining Производство печатных плат.
5. Производственный процесс
UGPCB adheres to a strict Контроль качества regime for high frequency PCB manufacturing:
Material Prep & Inner Layer Imaging → Hybrid Lamination & Registration → Precision Drilling & Plating → Pattern Imaging & Etching → Impedance Control Testing → Solder Mask & Поверхностная отделка (СОГЛАШАТЬСЯ) → Electrical Testing & Final Audit → Shipping. Each step is specially controlled for high-frequency characteristics.
6. Основные приложения & Варианты использования
This product is ideal for applications demanding high frequency and signal fidelity:
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Беспроводная связь: 5G base station antennas/RF modules, microwave backhaul, satellite communication terminals.
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Автомобильная электроника: Millimeter-wave radar (77 ГГц), V2X telematics modules.
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Аэрокосмическая промышленность & Оборона: Radar systems, electronic warfare (EW) оборудование, guidance systems.
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Тест & Measurement: Основной RF circuit boards in network analyzers, spectrum analyzers, and high-frequency signal sources.
Partner with UGPCB for Your High-Frequency Projects
Whether you are an engineer engaged in RF PCB layout or a sourcing professional seeking a reliable circuit board supplier, UGPCB’s RO4350B Hybrid High Frequency PCB is your ideal solution. We provide not only high-quality Изготовление печатной платы but also full-spectrum support from PCB design review to end-to-end PCBA services, accelerating your time-to-market.
Связаться с нами today for a free design consultation and a competitive quote. Power your next RF innovation with UGPCB.