Профессиональный производитель подложек BGA IC | Решения UGPCB для тонкой линии 30 мкм

High-Performance BGA IC Substrate: The Precision Foundation for Advanced IC Packaging

In the era of smaller, Быстрее, and more powerful electronics, advanced IC packaging is critical. Acting as the essential interface between the silicon die and the main печатная плата (печатная плата), а Подложка BGA IC is the core component of high-end semiconductor packages. UGPCB leverages deep Производство печатных плат expertise and advanced processes to deliver high-performance, надежный BGA package substrate решения.

1. What is a BGA IC Substrate?

A BGA IC Substrate is a specialized type of Взаимодействие высокой плотности (ИЧР) печатная плата designed explicitly for Ball Grid Array (БГА) упаковка. It is not a standard монтажная плата but a precision multilayer interconnect structure. One side interfaces with the die via ultra-fine circuitry, while the opposite side connects to the main печатная плата through an array of solder balls, fulfilling four key functions: electrical interconnection, передача сигнала, рассеивание тепла, and physical support.

2. Design Essentials & Operational Principle

Design Essentials:

1. Ultra-High Wiring Density: To accommodate increasing I/O counts, substrates require ultra-fine line design. UGPCB reliably achieves 30μm/30μm minimum line width/space, enabling efficient fan-out routing for high-pin-count chips.

2. Precise Registration & Стабильность размеров: Alignment between die and solder balls must be extremely accurate. Our core material, Mitsubishi Gas Hf Bt Hl832nx-A-HS, offers a low CTE (Коэффициент термического расширения) и отличная стабильность размеров, preventing warpage and misalignment caused by thermal stress.

3. Reliable Microvias: Layer-to-layer interconnection depends on laser-drilled blind vias. Наш 0.075mm laser drilling capability facilitates high-density vertical connections (например, 1-2, 3-4 слои), ensuring signal integrity.

4. Optimized Signal & Целостность власти: A carefully designed stack-up (например, 1L-4L, 1L-2L, 3L-4L as per your specs) and plane allocation provide low-loss paths for high-speed signals and clean, stable power delivery to the chip.

Operational Principle:

The die is attached to the substrate’s top surface (typically Layer 1) via wire bonding or flip-chip technology. Electrical signals from the chip are routed, redistributed (Rdl), and transmitted through the substrate’s internal ultra-fine traces и Микровия (laser/mechanical holes). They finally exit via the solder ball array on the bottom surface to connect to the larger печатная плата (Сборка печатной платы). It is essentially a miniaturized, chip-specific, high-end печатная плата.

3. Основной материал, Структура & Ключевые особенности

• Основной материал: Mitsubishi Gas Hf Bt Hl832nx-A-HS high-performance laminate. Renowned for its Низкая диэлектрическая постоянная (Дк), low dissipation factor (Дф), high thermal resistance (high Tg), and exceptional dimensional stability, it is the ideal choice for high-speed, high-frequency IC packaging substrates.

• Key Structure: 4-layer build with stacked via design (1-2, 3-4 layer blind vias) for greater routing density. The overall PCB thickness is 0.3mm, meeting thin-profile packaging requirements.

• Поверхностная отделка:****Enepic (Электролетное никелевое электролетное погружение палладий Золото, 2μ”). This finish combines nickel’s barrier properties, palladium’s corrosion resistance, and gold’s superior solderability. It is the preferred choice for fine-pitch BGA solder ball вложение, ensuring long-term reliability.

• Припаяя маска & Opening: We use Taiyo PSR4000 AUS308 high-performance Liquid Photoimageable Solder Mask (LPSM), known for high resolution and reliability, perfectly defining openings for 0.1mm mechanical through-holes and pads.

4. Классификация & Основные приложения

• Классификация: Primarily categorized by interconnection method: Wire Bonding Substrates и Flip Chip Substrates. The specifications provided (ультратонкие линии, Enepic) are particularly suited for Flip Chip and other advanced packaging applications.

• Основные приложения:

  • Центральные обработки единиц (CPU/GPU) Упаковка

  • Mobile Device Application Processors (Доступа) & Baseband Chips

  • High-Speed Networking & Communication Chips (например, ПЛИС, ASIC)

  • Искусственный интеллект (Ай) & Machine Learning Accelerators

  • Advanced Memory Packaging (например, HBM)

  • These applications represent the core of высокая плотность, high-performance PCBA дизайн.

5. UGPCB’s BGA IC Substrate Production Process & Контроль качества

Наш BGA circuit board manufacturing follows a stringent, high-standard flow:
Inner Layer Imaging → Laser Drilling / Mechanical Drilling → Hole Metallization (Copper Plating) → Outer Layer Imaging → Solder Mask Application (PSR4000) → ENEPIG Surface Finish → Electrical Testing → Final Inspection.
The entire process occurs in controlled cleanroom environments (Class 10K/1K), utilizing Automated Optical Inspection (АОИ), laser measurement systems, и еще, обеспечение каждого BGA packaging PCB meets chip-level reliability standards.

6. Why Choose UGPCB for Your BGA IC Substrate?

1. Premium Material Assurance: Core laminates from top-tier suppliers like Mitsubishi Gas guarantee performance from the start.

2. Advanced Process Capability: 30/30μm line/space and 0.075mm laser microvias support the most cutting-edge chip packaging designs.

3. Ultra-Thin Core Expertise: Proven experience in high-yield, volume production of 0.3mm and thinner boards.

4. Comprehensive Surface Finish Options: We offer various high-end finishes including ENEPIG to meet different bonding/soldering needs.

5. One-Stop Service: От PCB design review и быстродействующие прототипы to volume production, we provide end-to-end PCBA substrate solutions for your new chip project.

Заключение:

As we approach the physical limits of Moore’s Law, advanced packaging is key to continued electronics performance growth. Choosing a reliable Подложка BGA IC lays a solid foundation for your chip’s success. Whether you are involved in chip design, упаковка, тестирование, или PCBA Manufacturing, UGPCB is your trusted partner.

Contact us today to discuss your BGA package substrate, HDI печатная плата требования, and request a quote. Let’s collaborate to enable the next generation of electronic innovation!