УГКПБ

18-Производитель высокопроизводительных печатных плат Layer Megtron-7 | 1.86мм толщиной | ENIG 2u”

Ультинин

In the era of high-speed data transfer and precision computing, the performance of the печатная плата (печатная плата)—the core brain of electronic devices—determines the entire system’s capability. УГКПБ introduces its high-performance 18-layer rigid PCB на основе Megtron-7 материал, engineered to meet the most demanding electrical and physical challenges, serving as the essential foundation for your next-generation advanced equipment.

1.18-Layer Megtron-7 Rigid PCB Обзор продукта & Определение

This product is an 18-layer rigid high-layer count PCB with a precisely controlled thickness of 1.86мм and overall dimensions of 165mm x 120mm. It utilizes industry-leading Megtron-7 high-speed low-loss laminate and features a 2-microinch (approx. 0.05мкм) Химическое никель, иммерсионное золото (СОГЛАШАТЬСЯ) обработка поверхности. This specification represents an advanced tier in высокопроизводительный Производство печатных плат, designed for applications where signal integrity, тепловое управление, and reliability are paramount.

18-Layer Megtron-7 Rigid PCB

2. Критические соображения дизайна

Designing a successful 18-layer PCB, especially with high-speed materials like Megtron-7, requires careful attention to several core aspects:

  1. Stack-up Design: A rational layer stack-up is critical for impedance control and crosstalk reduction. A typical 18-layer stack includes multiple signal, power, and ground planes to ensure stable power distribution and clear signal return paths.

  2. Контроль импеданса: High-speed signal transmission demands precise controlled impedance PCB дизайн. Trace width and spacing must be calculated accurately based on the Dk (Диэлектрическая проницаемость) и Дф (Коэффициент рассеяния) of Megtron-7. We offer professional impedance calculation and simulation services.

  3. Тепловое управление: The 1.86mm board thickness and multi-layer structure necessitate effective thermal pathways in the design, such as using thermal vias to connect internal copper layers for efficient heat dissipation from components.

  4. Взаимодействие высокой плотности (ИЧР) Considerations: While this is a standard through-hole design, careful planning of via types (blind, buried, through-hole) is essential at this layer count to minimize stub effects and optimize signal paths.

3. Как это работает & Структура

А Многослойная печатная плата functions like a highly integrated, three-dimensional “road network.” Electrical signals travel on copper traces (“roads”) on the surface and internal layers, with vertical connections between layers established through plated through-holes (“interchanges”). Dedicated power and ground planes provide stable voltage reference and noise shielding for the entire system. Этот 18-layer rigid PCB is formed through a precise lamination process, bonding multiple core layers and prepreg sheets into a single, robust unit with excellent electrical properties. Its sophisticated PCB board structure is the foundation for implementing complex circuit functionalities.

4. Основные материалы & Key Performance

5. Классификация продуктов

According to industry and IPC standards, this product is accurately classified as:

  1. По количеству слоев: High-Layer Count PCB (typically defined as 10+ слои).

  2. By Material Type: High-Speed High-Frequency PCB / Low-Loss PCB.

  3. По структуре: Rigid PCB.

  4. По технологиям: Controlled Impedance PCB, ENIG Finished PCB.

  5. By Application Grade: Industrial Grade / Telecommunications Grade High-Performance PCB.

6. Ключевые особенности & Преимущества

  1. Premium Material: Built on Megtron-7 high-speed laminate, providing the physical basis for superior electrical performance.

  2. High Complexity Capacity: The 18-layer circuit board design allows for extremely complex and dense circuit layouts.

  3. Точное производство: Strict tolerance control on the 1.86mm board thickness and consistent 2u” ENIG surface finish application.

  4. Engineered for Speed: Optimized throughout—from design and material selection to processing—for Высокоскоростные цифровые цепи и RF/microwave circuits.

7. Production Process Overview

The high-layer count PCB manufacturing process is highly precise: Material Cutting → Inner Layer Imaging & Etching → Automated Optical Inspection (АОИ) → Lamination (Pressing multiple inner layer cores with prepreg) → Drilling → Hole Metallization (Десмеар, Electroless & Electrolytic Copper Plating) → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → Surface Finish (СОГЛАШАТЬСЯ) → Profile Routing → Electrical Testing → Final Inspection. Each step requires stringent control, particularly layer-to-layer registration and impedance control.

8. Основные приложения & Варианты использования

Этот high-performance PCB board is the ideal choice for the following advanced applications:

Why Choose UGPCB for Your 18-Layer Megtron-7 PCBs?

We deliver more than just a монтажная плата; we provide a complete solution encompassing DFM (Дизайн для производства) обзор, точное производство, и тестирование надежности. We possess deep expertise in every detail of high-layer count Изготовление печатной платы, ensuring your design is translated into reality with the highest quality and reliability.

Contact us today for a free technical assessment and a competitive quote for your project. Let UGPCB be the robust foundation for your high-end product’s success.

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