Профессиональный производитель подложек HDI IC | 30/70мкм След | ENEPIG Finish – UGPCB

Обзор продукта: What is an HDI IC Substrate Board?

An HDI IC Substrate Board is a critical, high-end печатная плата engineered specifically for semiconductor package interconnection. It acts as the essential interface, providing electrical connectivity, Распределение энергии, and mechanical support between a finely-pitched silicon die and a standard motherboard печатная плата. UGPCB delivers high-reliability, advanced HDI IC Substrate manufacturing, meeting the stringent demands of applications from consumer electronics to high-performance computing.

This board, built with SI10U material in a 6-слой (2+2+2) construction and a slim profile of 0.6мм, exemplifies state-of-the-art ИЧР технология. С 35x35mm unit size, it features a 0.1mm minimum laser via diameter, 30μm minimum trace width / 70μm minimum spacing, и Enepic (Электролетное никелевое электролетное погружение палладий Золото) обработка поверхности, making it an ideal solution for packaging high-speed, высокочастотный, and highly integrated chips.

In-Depth Analysis: Дизайн, Функция, and Applications

Core Definition & Принцип работы

The HDI IC Substrate is designed to “fan-out” the dense array of micro-bumps from a semiconductor die, redistributing the connections to a larger pitch compatible with standard Сборка печатной платы processes like BGA (Шариковая сетка массив) монтаж.

The working principle follows this chain: Die → Microbumps → HDI IC Substrate (for signal redistribution & взаимосвязь) → Solder Balls (BGA/CSP) → Mainboard PCB. It is pivotal for signal integrity, power delivery, и тепловое управление.

Key Design Considerations

1. Стек-ап & Контроль импеданса: The 6-layer (2+2+2) build-up is a classic design for high routing density. Precise impedance calculation (typically 50Ω single-ended or 100Ω differential) is crucial for signal integrity.

2. Micro-via Reliability: 0.1мм (100мкм) laser-drilled micro-vias are key for interconnect density. Via shape, Медное покрытие, and fill process must be optimized for thermal cycle reliability.

3. Fine-Line Fabrication: 30μm trace width and 70μm spacing are core metrics of process capability, directly impacting I/O density and electrical performance.

4. Thermal & Mechanical Management: The selection of SI10U material considers its Coefficient of Thermal Expansion (КТР) matching with silicon to minimize thermal stress and enhance product longevity.

Primary Materials & Характеристики производительности

• Основной материал: СИ10У. A high-performance laminate offering low dielectric constant (Дк), low dissipation factor (Дф), high glass transition temperature (Тг), и отличная стабильность размеров, ideal for high-speed, high-frequency applications.

• Припаяя маска: PSR-4000 AUS308. A high-resolution, high-reliability Liquid Photoimageable Solder Mask (LPSM) that provides precise coverage, excellent insulation, and chemical resistance.

• Поверхностная отделка: Enepic. This finish deposits sequential layers of Nickel, Palladium, and Gold. Nickel acts as a diffusion barrier, Palladium prevents nickel corrosion, and the thin gold layer offers superior solderability and wire-bonding capability, perfect for fine-pitch pads.

• Performance Summary: Высокая плотность, высокоскоростной, высокая надежность, Отличное тепловое управление, and superior signal integrity.

Классификация & Сценарии приложения

HDI IC Substrates are categorized by technology and application:

• По технологиям: With core (например, this 6L build-up) or coreless types.

• По приложению:

  1. Advanced Processors: Процессор, Графический процессор, AI accelerator chips requiring maximum routing density and signal speed.

  2. Mobile & РФ: Smartphone Application Processors (Доступа) и радиочастотные модули, where miniaturization and thin profiles (0.6мм) are critical.

  3. Память: Interface substrates for High Bandwidth Memory (HBM).

  4. Networking & Автомобильная промышленность: High-speed switch chips and ADAS domain controllers.

UGPCB’s Manufacturing Process & Гарантия качества

UGPCB’s production integrates leading-edge processes compliant with IPC standards:

1. Лазерное сверление: UV laser systems create precise 0.1mm micro-vias.

2. Покрытие & Via Fill: Advanced pulse plating ensures complete via filling for reliable interconnects.

3. Advanced Imaging: High-end exposure systems and high-resolution dry film achieve 30/70мкм line definition.

4. Ламинирование: Precise alignment and pressing of multiple core layers and prepreg (ПП).

5. Поверхностная отделка: Application of the Enepic coating for optimal solderability.

6. Комплексное тестирование: Utilizes AOI (Автоматическая оптическая проверка), Тестирование летающих зондов, and impedance testing to guarantee compliance.

Наш one-stop печатная плата услуга capability extends from Подложка ИС Производство to subsequent SMT Assembly и тестирование, offering a complete packaging solution.

Why Choose UGPCB for Your HDI IC Substrate?

1. Advanced Process Capability: Proven expertise in 30/70μm trace/space и 0.1mm micro-via технология.

2. Materials Expertise: In-depth knowledge of advanced materials like СИ10У to recommend optimal solutions.

3. Uncompromising Quality: Stringent, automotive-grade quality control throughout the entire process.

4. Однопопное решение: Мы больше, чем PCB fabricator; we are your PCBA partner, offering design support, Производство, и сборка.

5. Expert Support: Dedicated engineering team provides DFM (Дизайн для производства) analysis and technical consultation.

Получите собственное решение сейчас

Whether you are developing the next HPC platform, 5G Инфраструктура, или ADAS system, UGPCB’s professional HDI IC Substrate manufacturing и Услуги по сборке печатных плат are your foundation for success.

Contact us today for a free technical consultation and quote! Let our experts help you enhance product performance through optimized IC substrate design and reliable Изготовление печатной платы процессы.