Подложка IC корпуса LGA

At the heart of cutting-edge chips lies a substrate, scarcely the size of a fingernail yet crisscrossed by tens of thousands of intricate circuits, silently dictating the performance and stability of the entire system.

The IC Package Substrate is the core carrier in semiconductor chip packaging. It is responsible for establishing electrical signal connections, power delivery, physical support, рассеивание тепла, and protection between the semiconductor die and the external печатная плата (печатная плата). Its performance directly determines the chip’s signal integrity, thermal efficiency, and the final product’s reliability.

IC substrates utilizing LGA (Земельная сетка массив) упаковка, with their unique design of flat array pads on the bottom side, are becoming a critical choice for high-performance, high-density chip packaging.

01 Обзор продукта: Определение & Основные спецификации

The IC package substrate, often called an IC carrier, is the highest-value key material in the chip packaging process. It acts as the translator and bridge between the microscopic world of the semiconductor die and the macroscopic world of PCB circuits.

Проще говоря, through its internal precision micro-circuitry, it transforms and expands the densely packed electrode pads (on a micron scale) on the die to a scale suitable for soldering and connection to the main PCB.

The LGA IC Substrate from УГКПБ is a high-end interconnect carrier specifically designed for high-density, high-performance chips. The core specifications of its base model define its capability boundaries.

The table below clearly outlines the product’s key physical and electrical parameters:

The hallmark of LGA packaging is the arrangement of flat metal pads (Lands) in a full or partial array on the substrate bottom, as opposed to the solder balls of a BGA (Шариковая сетка массив).

This design offers better coplanarity control and shorter electrical paths when soldered to the PCB, benefiting high-frequency and high-speed signal transmission.

02 Technical Deep Dive: Структура, Дизайн & Operating Principle

An LGA IC substrate is a complex micro-system engineering feat. Its core structure typically comprises, from top to bottom: the die attach area (for Flip Chip or Wire Bond connections), multilayer HDI routing layers, embedded passive components (optional), and the bottom-side LGA pad array.

Design Focus centers on achieving efficient and reliable electrical interconnection within a minuscule area. The 40μm minimum line width and 100μm spacing are core design rules, necessitating precise calculations for current carrying capacity, контроль импеданса, и сигнал перекрестных помех.

Embedding Technology is a leading-edge design direction. It involves embedding passive components like resistors and capacitors, or even IC dies, directly within the substrate layers. This significantly shortens circuit paths, improves electrical performance, enhances reliability, and conserves surface space.

Operating Principle can be likened to a highway interchange for signals and power. Signals generated by the chip enter the substrate’s top layer via micro-bumps or gold wires. They are then re-distributed and routed through the substrate’s intricate, multi-layered circuitry before being transmitted stably and efficiently to the motherboard PCB via the bottom LGA pads.

Throughout this process, the substrate’s own low dielectric loss, stable impedance, and excellent thermal performance are critical to preventing signal distortion, power attenuation, and chip overheating.

03 Материальная наука: The “Flesh & Blood” of the Substrate

The source of a substrate’s performance lies in its constituent materials. The core material of our substrate is SI165, a high-performance organic resin-based laminate. In the IC substrate domain, the laminate is the largest cost component, typically accounting for over 30% от общей стоимости. Its properties dictate the substrate’s electrical, тепло, and mechanical performance.

Current mainstream high-end organic laminates include:

• Бт (Bismaleimide Triazine) Смола: Holds over 70% global market share. Known for high heat resistance, Высокий модуль, and low Coefficient of Thermal Expansion (КТР), it’s widely used in memory chip packaging.

• Абф (Ajinomoto Build-up Film): Supplied mainly by Japan’s Ajinomoto. Preferred for high-end logic chips (процессоры, GPUs) due to its superior insulation and suitability for extremely fine line patterning.

Beyond the core laminate, copper foil forms the conductive traces, special prepregs are used for lamination, в то время как PSR-2000 BL500 solder mask и ENEPIG surface finish form the final protective and solderable barrier.

High-precision LGA substrates are the cornerstone for chip miniaturization and performance enhancement, with internal wiring densities far exceeding those of standard PCBs.

04 Manufacturing Artistry: The Journey from Raw Material to Precision Component

IC substrate manufacturing represents the most complex and precision-demanding segment of Изготовление печатной платы. While its core process flow shares similarities with standard multilayer PCB production, the precision controls are significantly more stringent.

Key processes include inner layer imaging, ламинирование, лазерное/механическое сверление, hole metallization, визуализация внешнего слоя, surface finishing, нанесение паяльной маски, and routing/electrical testing.

To achieve 40μm-level line widths, manufacturing predominantly employs the modified Semi-Additive Process (Мсап). This process involves depositing a thin layer of chemical copper on the laminate, electroplating to build up the desired circuit pattern, and finally etching away the excess thin copper. This allows for finer lines than traditional subtractive methods.

Drilling technology is also crucial. For 100μm-level microvias, mechanical drilling reaches its limits, making high-precision laser drilling существенный. It can create smaller, more precise blind and buried vias.

ENEPIG surface finishing is the final critical step. It sequentially deposits Nickel, Palladium, and Gold, providing top-tier soldering and reliability performance for the LGA pads.

ALT: Simplified diagram illustrating the steps of the modified Semi-Additive Process (Мсап) for creating ultra-fine circuit lines.

05 Application Spectrum: Powering Diverse Industries

LGA IC substrates are not for a single product. As core components, they are integrated into the heart of nearly all advanced electronic systems.

Their application landscape can be clearly mapped based on the chip types they serve and end-use applications:

• Высокопроизводительные вычисления (HPC): процессоры, GPUs, ПЛИС. This sector demands the most from substrates, requiring ABF material, extremely high routing density, and excellent high-speed performance. LGA packaging is prevalent in these large-size chips.

• Memory Chips: Драм, NAND Flash. Typically use mature BT material substrates. Enormous demand makes this a mainstay of the substrate market.

• Коммуникации & РФ: 5G/6G RF modules, Усилители мощности. Require substrates with low-loss, высокочастотные характеристики.

• Датчики & Мемс: Датчики изображения, Inertial Measurement Units, Microphones. Substrates must meet specific packaging forms and reliability requirements.

• Автомобильная электроника & Ай: Autonomous Driving Chips, ИИ ускорители. An emerging growth field requiring substrates with automotive-grade high reliability and robust data-processing capabilities.

The global IC substrate market is projected to reach $16.19 миллиард за 2025, driven by the vigorous growth of these downstream applications.

06 Будущий перспективы: Technology Evolution & Industry Insights

The substrate industry evolves in lockstep with, and even drives, advancements in semiconductor packaging technology. Two major trends are currently prominent: High-Density Integration и Advanced Packaging Convergence.

As Moore’s Law approaches physical limits, enhancing system performance through advanced packaging has become a primary pathway. The rise of technologies like Система-в-упаковки (Глоток) и 2.5D/3D Packaging places unprecedented demands on substrates.

Например, substrates used as Interposers in 2.5D packaging require extremely high-density TSV (Через SILICON VIA) interconnects. In 3D stacking, substrates must withstand significant thermal and mechanical stress challenges from multi-die stacking.

The burgeoning Чиплет technology further elevates the substrate to a system integration hub. Chiplets of varying functions and process nodes require heterogeneous integration via the substrate, presenting the ultimate test for design complexity, routing capability, и целостность сигнала.

Regarding the competitive landscape, the global IC substrate industry is an oligopoly, with the top ten players holding a combined market share exceeding 80%. The high-end market is dominated by a handful of companies in Japan, Южная Корея, and Taiwan. Mainland Chinese companies are striving to catch up, accelerating breakthroughs into the mid-to-high-end market, fueled by both national policy support and market demand.

UGPCB’s LGA IC Substrate solutions are at the forefront of this technological transformation. An 8x8mm substrate carries not just microscopic circuits, but serves as a macroscopic bridge to next-generation high-performance computing.

As global digitalization and intelligentization deepen, the insatiable demand for chip performance continues—from cloud data centers to handheld smart devices.