Introduction to the 18Layers Communication Base Station PCB
The 18Layers Communication Base Station PCB is a sophisticated and high-performance แผงวงจรพิมพ์ designed specifically for use in communication base stations. นี้ พีซีบี offers exceptional durability, ความน่าเชื่อถือ, and efficiency, making it an ideal choice for critical communication infrastructure applications.
Key Features and Specifications
วัสดุ
- วัสดุ: The PCB is made from พานาโซนิค M6, a high-quality material known for its excellent electrical properties and thermal stability. This ensures that the PCB can withstand harsh environmental conditions and maintain optimal performance.
Layers and Copper Thickness
- เลเยอร์: กับ 18 ชั้น, this PCB provides extensive space for complex circuit designs required in advanced communication systems.
- ความหนาของทองแดง: The copper thickness ranges from 0.5 ถึง 1 ออนซ์, allowing for robust signal transmission and power distribution across the board.
Dimensions and Surface Treatment
- ความหนาสำเร็จรูป: The PCB has a finished thickness of 2.0mm, which provides structural integrity and mechanical strength.
- การรักษาพื้นผิว: It features an immersion gold surface treatment. This not only enhances the aesthetic appeal but also improves solderability, ความต้านทานการกัดกร่อน, and contact reliability.
Precision Design
- ติดตาม/อวกาศ: Featuring precise trace/space measurements of 4mil/4mil (0.1MM/0.1MM), this PCB ensures high-density interconnectivity with minimal crosstalk and signal loss.
- มินโฮล: The minimum hole size is 0.2mm (8MIL), enabling fine-pitch components and high-density layouts.
กระบวนการพิเศษ
- กระบวนการพิเศษ: The PCB incorporates a metal edging process, which adds extra strength and protection to the edges, enhancing the overall durability and lifespan of the board.
การใช้งาน
The 18Layers Communication Base Station PCB is primarily used in communication base station applications where high reliability and performance are crucial. เหล่านี้รวมถึง:
- Mobile network base stations
- Radio frequency (RF) transceivers
- Microwave communication systems
- Data center networking devices
กระบวนการผลิต
The manufacturing process of the 18Layers Communication Base Station PCB involves several meticulous steps to ensure the highest quality standards:
- การเลือกวัสดุ: High-grade Panasonic M6 วัสดุ is selected for its superior electrical properties and durability.
- การซ้อนชั้น: ที่ 18 layers are carefully stacked and bonded together using advanced laminating techniques.
- Etching and Drilling: Precision etching and drilling processes create the intricate circuit patterns and holes necessary for component placement.
- Plating and Soldermask Application: Immersion gold plating and soldermask application provide the final surface treatment, ensuring excellent conductivity and protection against environmental factors.
- การควบคุมคุณภาพ: Each PCB undergoes rigorous testing and inspection to meet strict quality criteria before being packaged for shipment.
บทสรุป
The 18Layers Communication Base Station PCB is a highly specialized product designed to meet the demanding requirements of modern communication infrastructure. Its advanced materials, precision design, and stringent manufacturing processes make it a reliable choice for any high-performance communication system. Whether you are building mobile network base stations or data center equipment, this PCB offers unmatched reliability and performance.