UGPCB

4-Layer Rigid-Flex PCB Manufacturer – High Tg, 1.6หนา มม, ENIG+Gold Plating | UGPCB

1.UGPCB 4-Layer High Tg Rigid-Flex PCB ภาพรวมผลิตภัณฑ์: Redefining High-Reliability Interconnectivity

In modern high-end electronic design, traditional rigid แผงวงจรพิมพ์ (PCBS) are often limited by space and form factor, while Flexible PCBs (FPCS) may lack mechanical support. PCB แบบแข็ง เทคโนโลยี, an innovative การผลิต PCB solution, perfectly merges the stability of rigid boards with the bendability of flexible circuits. UGPCB 4-Layer High Tg Rigid-Flex PCB, with its precise lamination structure, superior material selection, and demanding surface finish, stands as the ideal PCB solution for complex 3D spatial layouts and harsh operating environments.

4-Layer Rigid-Flex PCB

2. Scientific Classification & Core Parameters

3. Design Essentials & Structure Analysis

Successful Rigid-Flex PCB design เป็นสิ่งสำคัญ. This product is designed adhering to these key points:

  1. Rigid-to-Flex Transition Zone Design: Bend areas are meticulously simulated, avoiding right and acute angles. Smooth curved traces are implemented to eliminate stress concentration points, a cornerstone of high-reliability PCB design.

  2. Stack-up Symmetry: Rigid sections employ a symmetrical lamination stack-up (เช่น, copper-dielectric-core-dielectric-copper) to prevent warping under thermal stress.

  3. ความเข้ากันได้ของวัสดุ: The selected Panasonic RF-777 material has matched Coefficients of Thermal Expansion (ซีทีอี) in both rigid and flexible zones, ensuring robust bonding at the interfaces.

Structural Feature: The board is constructed by laminating two rigid outer sections with a multilayer structure containing flexible inner layers, enabling electrical interconnection in three-dimensional space.

Image Suggestion 2: A detailed cross-sectional diagram of the board’s layer stack-up, clearly labeling rigid areas, flex areas, วัสดุ, and thicknesses.
Alt Tag: Cross-section diagram of a 4-Layer Rigid-Flex PCB stack-up, showing the integration of rigid FR-4 and flexible polyimide materials.

4. วัสดุ & ผลงาน

5. Manufacturing Process Flow

UGPCB employs industry-leading PCB production processes to ensure quality:

  1. Laser & Mechanical Drilling: High-precision drilling for varying hole size requirements.

  2. Hole Metallization & การชุบ: Ensures interlayer connectivity.

  3. การทำลวดลาย & การแกะสลัก: Forms precise circuit patterns.

  4. การเคลือบ & Pressing: Precisely bonds rigid and flexible layers into a single unit under high heat and pressure—the technical core of rigid-flex circuit board processing.

  5. การตกแต่งพื้นผิว: Sequential application of ENIG and selective hard gold plating.

  6. Contour Routing & การทดสอบ: Final outline achieved via CNC and laser routing, followed by Aoi (การตรวจสอบด้วยแสงอัตโนมัติ), electrical testing, and flex-cycle reliability testing.

Image Suggestion 3: An image of a modern PCB production line, focusing on a lamination press or AOI inspection station.
Alt Tag: UGPCB’s modern Rigid-Flex PCB production line featuring high-precision lamination and inspection equipment for quality assurance.

6. ข้อดีที่สำคัญ & Product Features

7. Typical Applications

นี้ 4-Layer Rigid-Flex PCB is the preferred PCB component for demanding sectors:

8. ทำไมต้องเลือก UGPCB?

As a professional ผู้ผลิต PCB, UGPCB specializes in PCB แบบแข็ง เทคโนโลยี, offering full-spectrum capabilities from PCB design support and precision การผลิต PCB to rigorous PCB testing. We commit to:

Contact UGPCB today for a free prototype evaluation and quote. Let our professional การผลิต PCB services power your innovative product to market success.

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