6L 1+N+1 HDI PCB Manufacturer | High Density Interconnect PCBs

What is a 6L 1+N+1 HDI PCB?

A 6L 1+N+1 HDI PCB stands for a six-layer High Density Interconnect (HDI) แผงวงจรพิมพ์, featuring one core layer flanked by N signal layers and another core layer. This configuration allows for high density interconnections, making it suitable for advanced electronic applications. The “1+N+1” designation refers to the arrangement of the core layers and signal layers.

ข้อกำหนดการออกแบบ

The design of a 6L 1+N+1 HDI PCB requires careful consideration of several factors:

• การซ้อนชั้น: Proper alignment of the core and signal layers to ensure optimal electrical performance.
• ติดตามและพื้นที่: Minimal trace width and space of 3mil/3mil to accommodate fine features.
• Hole Sizes: Mechanical holes as small as 0.2mm and laser holes down to 0.1mm for precise component placement.
• ความหนาของทองแดง: Varied copper thickness with inner layers at 1OZ and outer layers at 0.5OZ to balance conductivity and flexibility.

มันทำงานอย่างไร?

The functionality of a 6L 1+N+1 เอชดีไอ พีซีบี relies on its multilayer structure and the use of high-density interconnects. Each layer serves a specific purpose:

• Core Layers: Provide structural integrity and act as the foundation for signal layers.
• Signal Layers: Carry electrical signals between components.
• การบำบัดพื้นผิวทองคำ: Ensures excellent solderability and long-term reliability by preventing oxidation.

Applications and Classifications

เหล่านี้ PCBS are primarily used in intelligent digital products where compact size and high performance are crucial. They can be classified based on their complexity and the number of layers, with the 6L 1+N+1 configuration being highly versatile for various applications.

Materials and Performance

Constructed from FR-4 (iteq), these PCBs offer excellent thermal stability and mechanical strength. โทนสีเขียว/สีขาวช่วยในการตรวจสอบด้วยภาพและการแก้ไขปัญหา. The finished thickness of 1.0mm provides a robust yet flexible board suitable for intricate designs.

Structure and Features

The unique structure of a 6L 1+N+1 HDI PCB includes:

• Six Layers: One core layer, N signal layers, and another core layer.
• High Density Interconnects: Allow for complex routing and minimal space usage.
• พื้นผิวทองคำแช่: Enhances conductivity and protects against corrosion.

กระบวนการผลิต

The manufacturing process involves several sophisticated steps:

1. การเตรียมวัสดุ: Selecting high-quality FR-4 substrate and copper foils.
2. การซ้อนชั้น: Arranging the layers in a precise order to achieve the desired “1+N+1” configuration.
3. Bonding: Using heat and pressure to bond the layers together.
4. การแกะสลัก: Applying etchant to remove excess copper, leaving only the desired conductive paths.
5. การชุบ: Adding a thin layer of metal to improve conductivity and solderability.
6. การรักษาพื้นผิว: Applying immersion gold to protect against oxidation and enhance solderability.
7. การควบคุมคุณภาพ: Conducting thorough inspections and tests to ensure each board meets stringent quality standards.

Use Cases and Scenarios

6L 1+N+1 HDI PCBs are ideal for use in intelligent digital products where miniaturization and high performance are critical. แอปพลิเคชันทั่วไปรวมถึง:

• สมาร์ทโฟน: Enabling slimmer designs without compromising on functionality or performance.
• เม็ด: Providing reliable connectivity for high-speed data transfer and processing.
• Wearable Devices: Supporting compact designs while maintaining robust performance and durability.