0.22mm Ultra-Thin 6-Layer HDI Rigid-Flex PCB Manufacturer | UGPCB

UGPCB’s 0.22mm Ultra-Thin 6-Layer HDI Rigid-Flex PCB ภาพรวมผลิตภัณฑ์

In the pursuit of extreme device miniaturization and high reliability, traditional rigid แผงวงจรพิมพ์ (PCBS) are often insufficient. UGPCB combines advanced การเชื่อมต่อระหว่างกันที่มีความหนาแน่นสูง (HDI) และ Rigid-Flex technologies to present our flagship product: ที่ 0.22mm Ultra-Thin 6-Layer HDI Rigid-Flex PCB. This board is a pinnacle of การผลิต PCB และ high-performance interconnect solution engineered for wearable technology, advanced medical instruments, การบินและอวกาศ, and premium consumer electronics. It seamlessly merges the stable support of rigid boards with the dynamic bending capability of flexible circuits, enabling complex electrical connections within minimal space.

Product Definition & Scientific Classification

This is a high-layer-count PCB utilizing any-layer HDI และ rigid-flex construction. It can be accurately classified per industry standards:

• By Structure: PCB แบบแข็ง – Laminates rigid and flexible circuit layers into a single unit.

• By Technology Level: Advanced HDI PCB – Employs laser drilling, filled vias, and microvias (<0.15มม) for superior routing density.

• By Layer Count: 6-Layer Circuit Board (comprising both rigid and flexible layers).

• โดยวัสดุ: Specialty High-Performance Material PCB – Core build-up uses Panasonic RF-777 composite.

Design Essentials & หลักการทำงาน

Design Essentials: The key to a successful rigid-flex board design lies in the rigid-to-flex transition zone. Precise calculation of bend radius, stress relief, and routing in flex areas is critical to prevent cracking during dynamic flexing. Concurrently, HDI blind and buried via design must coordinate with the stack-up structure to optimize signal integrity (และ) and power integrity (PI).
หลักการทำงาน: ที่ PCB structure integrates rigid sections (for component mounting and mechanical support) with flexible sections (for 3D interconnection and movement) ทาง multilayer lamination. Electrical signals travel through laser-drilled microvias และ via filling plating technologies inherent to บอร์ด HDI, achieving the shortest and most reliable paths between layers, which minimizes signal loss and crosstalk.

วัสดุหลัก & Superior Performance

• Core Material: We utilize the industry-premium Panasonic RF-777 35/50 composite material. Renowned for its exceptional เสถียรภาพมิติ, superior high-frequency performance, and excellent ความต้านทานความร้อน, it is the ideal choice for manufacturing high-reliability rigid-flex circuit boards.

• พื้นผิวเสร็จสิ้น: The board features a 2-micron Electroless Nickel Immersion Gold (เห็นด้วย) finish. This provides a flat surface, excellent solderability, and long-term oxidation resistance for PCB pads, making it perfect for mounting fine-pitch components like BGAs.

• Key Performance Attributes:

  • Ultra-Thin 0.22mm Profile: Enables maximum compression of internal device space.

  • ความน่าเชื่อถือสูง: Undergoes rigorous PCB reliability testing, capable of withstanding millions of dynamic bend cycles.

  • Excellent Signal Transmission: HDI design and premium materials ensure low-loss transmission for high-speed signals.

  • High-Density Assembly: Provides an ideal platform for แอสเซมบลี SMT, supporting miniaturized component layout.

โครงสร้าง & คุณสมบัติที่สำคัญ

• PCB Structure: A typical 6-layer construction involving 2-4 layers of rigid FR-4 laminated with polyimide flexible cores. ที่ stack-up is meticulously engineered to balance stiffness and flexibility.

• Product Features:

  1. 3D Interconnection Freedom: Eliminates spatial constraints, enabling 3D assembly and reducing connectors and cables.

  2. น้ำหนักเบา & Miniaturization: The extreme thinness directly reduces product weight and size.

  3. Enhanced System Reliability: Removes connection point failures, improving overall stability in vibrating or high-shock environments.

  4. Simplified Assembly Process: As a custom การประกอบ PCB, it streamlines final product assembly, lowering labor costs.

Precision Manufacturing Process

UGPCB adheres to international quality standards like IPC-6013 (for flexible circuits) และ IPC-2221/2223. ของเรา PCB fabrication process is precise and rigorous:

1. การขุดเจาะเลเซอร์: Creates micron-level blind and buried vias in flexible and core layers.

2. Hole Metallization & การชุบ: Vias are made conductive through chemical deposition and plating, กับ via filling for planarization.

3. Pattern Transfer & การแกะสลัก: Forms the intricate circuit board traces.

4. การจัดตำแหน่งเลเยอร์ & การเคลือบ: Rigid layers, เตรียมการ, and flexible layers are precisely aligned and bonded under high heat and pressure. This is the core step in rigid-flex PCB manufacturing.

5. การตกแต่งพื้นผิว: Application of the เห็นด้วย coating to protect pads and ensure solderability.

6. การทดสอบอย่างเข้มงวด: Includes flying probe testing, การตรวจสอบด้วยแสงอัตโนมัติ (Aoi), and reliability testing to ensure every board’s quality.

Wide-Ranging Application Scenarios

นี้ advanced PCB is the core skeleton for innovative products in:

• Wearable Technology: Smartwatches, AR/VR glasses, health monitors, requiring comfort and constant flexing.

• Advanced Medical Electronics: Endoscopic capsules, hearing aids, portable monitors, demanding high reliability and miniaturization.

• การบินและอวกาศ & การป้องกัน: Satellite components, UAV flight control systems, needing extreme environment endurance and low weight.

• Precision Consumer Electronics: High-end smartphone camera modules, folding phone hinge areas, ultra-thin laptops.

• ทางอุตสาหกรรม & อุปกรณ์อิเล็กทรอนิกส์ยานยนต์: Compact sensors, robotic joint interconnection modules.

Contact a UGPCB PCB Technical Expert today for your 0.22mm Ultra-Thin HDI Rigid-Flex PCB solution! Make your product stand out in the competition for miniaturization and high performance.