UGPCB

18-Layer High-Performance Megtron-7 PCB Manufacturer | 1.86หนา มม | ENIG 2u”

คำขาด

In the era of high-speed data transfer and precision computing, the performance of the แผงวงจรพิมพ์ (พีซีบี)—the core brain of electronic devices—determines the entire system’s capability. UGPCB introduces its high-performance 18-layer rigid PCB based on Megtron-7 วัสดุ, engineered to meet the most demanding electrical and physical challenges, serving as the essential foundation for your next-generation advanced equipment.

1.18-Layer Megtron-7 Rigid PCB ภาพรวมผลิตภัณฑ์ & คำนิยาม

This product is an 18-layer rigid high-layer count PCB with a precisely controlled thickness of 1.86มม and overall dimensions of 165mm x 120mm. It utilizes industry-leading Megtron-7 high-speed low-loss laminate and features a 2-microinch (approx. 0.05µm) ทองคำแช่นิเกิลแบบไม่ใช้ไฟฟ้า (เห็นด้วย) พื้นผิวเสร็จสิ้น. This specification represents an advanced tier in ประสิทธิภาพสูง การผลิต PCB, designed for applications where signal integrity, การจัดการความร้อน, and reliability are paramount.

18-Layer Megtron-7 Rigid PCB

2. ข้อควรพิจารณาการออกแบบที่สำคัญ

Designing a successful 18-layer PCB, especially with high-speed materials like Megtron-7, requires careful attention to several core aspects:

  1. Stack-up Design: A rational layer stack-up is critical for impedance control and crosstalk reduction. A typical 18-layer stack includes multiple signal, พลัง, and ground planes to ensure stable power distribution and clear signal return paths.

  2. การควบคุมความต้านทาน: High-speed signal transmission demands precise controlled impedance PCB ออกแบบ. Trace width and spacing must be calculated accurately based on the Dk (ค่าคงที่ไดอิเล็กตริก) และดฟ (ปัจจัยการกระจาย) of Megtron-7. We offer professional impedance calculation and simulation services.

  3. การจัดการความร้อน: The 1.86mm board thickness and multi-layer structure necessitate effective thermal pathways in the design, such as using thermal vias to connect internal copper layers for efficient heat dissipation from components.

  4. การเชื่อมต่อระหว่างกันที่มีความหนาแน่นสูง (HDI) Considerations: While this is a standard through-hole design, careful planning of via types (blind, buried, through-hole) is essential at this layer count to minimize stub effects and optimize signal paths.

3. มันทำงานอย่างไร & โครงสร้าง

อัน multi-layer PCB functions like a highly integrated, three-dimensional “road network.” Electrical signals travel on copper traces (“roads”) on the surface and internal layers, with vertical connections between layers established through plated through-holes (“interchanges”). Dedicated power and ground planes provide stable voltage reference and noise shielding for the entire system. นี้ 18-layer rigid PCB is formed through a precise lamination process, bonding multiple core layers and prepreg sheets into a single, robust unit with excellent electrical properties. Its sophisticated PCB board structure is the foundation for implementing complex circuit functionalities.

4. วัสดุหลัก & Key Performance

5. Product Classification

According to industry and IPC standards, this product is accurately classified as:

  1. โดยการนับเลเยอร์: High-Layer Count PCB (typically defined as 10+ ชั้น).

  2. By Material Type: High-Speed High-Frequency PCB / Low-Loss PCB.

  3. By Structure: PCB แข็ง.

  4. โดยเทคโนโลยี: Controlled Impedance PCB, ENIG Finished PCB.

  5. By Application Grade: Industrial Grade / Telecommunications Grade High-Performance PCB.

6. คุณสมบัติที่สำคัญ & ประโยชน์

  1. Premium Material: Built on Megtron-7 high-speed laminate, providing the physical basis for superior electrical performance.

  2. High Complexity Capacity: ที่ 18-layer circuit board design allows for extremely complex and dense circuit layouts.

  3. การผลิตที่แม่นยำ: Strict tolerance control on the 1.86mm board thickness and consistent 2u” ENIG surface finish application.

  4. Engineered for Speed: Optimized throughout—from design and material selection to processing—for high-speed digital circuits และ RF/microwave circuits.

7. Production Process Overview

ที่ high-layer count PCB manufacturing process is highly precise: Material Cutting → Inner Layer Imaging & Etching → Automated Optical Inspection (Aoi) → Lamination (Pressing multiple inner layer cores with prepreg) → Drilling → Hole Metallization (desmear, Electroless & Electrolytic Copper Plating) → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → Surface Finish (เห็นด้วย) → Profile Routing → Electrical Testing → Final Inspection. Each step requires stringent control, particularly layer-to-layer registration and impedance control.

8. แอปพลิเคชันหลัก & ใช้เคส

นี้ high-performance PCB board is the ideal choice for the following advanced applications:

Why Choose UGPCB for Your 18-Layer Megtron-7 PCBs?

We deliver more than just a แผงวงจร; we provide a complete solution encompassing DFM (ออกแบบเพื่อการผลิต) ทบทวน, การผลิตที่แม่นยำ, และ การทดสอบความน่าเชื่อถือ. We possess deep expertise in every detail of high-layer count การผลิต PCB, ensuring your design is translated into reality with the highest quality and reliability.

Contact us today for a free technical assessment and a competitive quote for your project. Let UGPCB be the robust foundation for your high-end product’s success.

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